JP4175877B2 - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

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Publication number
JP4175877B2
JP4175877B2 JP2002347320A JP2002347320A JP4175877B2 JP 4175877 B2 JP4175877 B2 JP 4175877B2 JP 2002347320 A JP2002347320 A JP 2002347320A JP 2002347320 A JP2002347320 A JP 2002347320A JP 4175877 B2 JP4175877 B2 JP 4175877B2
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JP
Japan
Prior art keywords
wiring
interlayer insulating
insulating film
contact hole
pixel
Prior art date
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Expired - Fee Related
Application number
JP2002347320A
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English (en)
Japanese (ja)
Other versions
JP2004177892A5 (enExample
JP2004177892A (ja
Inventor
明 石川
康守 福島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Sharp Corp
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd, Sharp Corp filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2002347320A priority Critical patent/JP4175877B2/ja
Priority to US10/717,562 priority patent/US7122830B2/en
Priority to TW092133079A priority patent/TWI270207B/zh
Priority to KR1020030085429A priority patent/KR101124995B1/ko
Publication of JP2004177892A publication Critical patent/JP2004177892A/ja
Publication of JP2004177892A5 publication Critical patent/JP2004177892A5/ja
Application granted granted Critical
Publication of JP4175877B2 publication Critical patent/JP4175877B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13454—Drivers integrated on the active matrix substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2002347320A 2002-11-29 2002-11-29 半導体装置及びその作製方法 Expired - Fee Related JP4175877B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002347320A JP4175877B2 (ja) 2002-11-29 2002-11-29 半導体装置及びその作製方法
US10/717,562 US7122830B2 (en) 2002-11-29 2003-11-21 Semiconductor device and method of manufacturing the same
TW092133079A TWI270207B (en) 2002-11-29 2003-11-25 Semiconductor device and method of manufacturing the same
KR1020030085429A KR101124995B1 (ko) 2002-11-29 2003-11-28 반도체 장치 및 반도체 장치 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002347320A JP4175877B2 (ja) 2002-11-29 2002-11-29 半導体装置及びその作製方法

Publications (3)

Publication Number Publication Date
JP2004177892A JP2004177892A (ja) 2004-06-24
JP2004177892A5 JP2004177892A5 (enExample) 2005-10-27
JP4175877B2 true JP4175877B2 (ja) 2008-11-05

Family

ID=32500739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002347320A Expired - Fee Related JP4175877B2 (ja) 2002-11-29 2002-11-29 半導体装置及びその作製方法

Country Status (4)

Country Link
US (1) US7122830B2 (enExample)
JP (1) JP4175877B2 (enExample)
KR (1) KR101124995B1 (enExample)
TW (1) TWI270207B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006138960A (ja) * 2004-11-10 2006-06-01 Nec Corp 液晶表示装置及びその製造方法並びに投射表示装置
JP2007184467A (ja) * 2006-01-10 2007-07-19 Fujifilm Corp 固体撮像素子
US7510323B2 (en) * 2006-03-14 2009-03-31 International Business Machines Corporation Multi-layered thermal sensor for integrated circuits and other layered structures
US7176074B1 (en) * 2006-08-10 2007-02-13 Chunghwa Picture Tubes, Ltd. Manufacturing method of thin film transistor array substrate
KR101453829B1 (ko) * 2007-03-23 2014-10-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조 방법
WO2008155086A1 (de) * 2007-06-18 2008-12-24 Microgan Gmbh Halbleiterbauelement mit ringförmig geschlossener kontaktierung
US8354674B2 (en) * 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
CN101796619B (zh) * 2007-11-02 2013-03-06 夏普株式会社 电路基板和显示装置
TWI657565B (zh) 2011-01-14 2019-04-21 日商半導體能源研究所股份有限公司 半導體記憶裝置
TWI520273B (zh) 2011-02-02 2016-02-01 半導體能源研究所股份有限公司 半導體儲存裝置
CN104488016B (zh) * 2012-07-20 2018-08-10 株式会社半导体能源研究所 显示装置及具有该显示装置的电子设备
US9025117B2 (en) * 2012-09-04 2015-05-05 Shenzhen China Star Optoelectronics Technology Co., Ltd Liquid crystal display panel and manufacturing method thereof
KR101406290B1 (ko) * 2013-05-30 2014-06-12 박준영 액정 표시 장치
WO2018033817A1 (ja) * 2016-08-17 2018-02-22 株式会社半導体エネルギー研究所 表示装置および電子機器
CN107665896B (zh) * 2017-10-27 2021-02-23 北京京东方显示技术有限公司 显示基板及其制作方法、显示面板和显示装置
WO2025159072A1 (ja) * 2024-01-22 2025-07-31 ソニーセミコンダクタソリューションズ株式会社 電子デバイスおよび電子デバイスの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3312083B2 (ja) * 1994-06-13 2002-08-05 株式会社半導体エネルギー研究所 表示装置
JPH0943630A (ja) 1995-07-27 1997-02-14 Toshiba Corp 液晶パネル基板
JP3729955B2 (ja) 1996-01-19 2005-12-21 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH10198292A (ja) * 1996-12-30 1998-07-31 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP3980156B2 (ja) * 1998-02-26 2007-09-26 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置
US6593592B1 (en) * 1999-01-29 2003-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having thin film transistors
JP4514871B2 (ja) * 1999-01-29 2010-07-28 株式会社半導体エネルギー研究所 半導体装置および電子機器
JP4056765B2 (ja) * 2001-02-28 2008-03-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
SG138468A1 (en) * 2001-02-28 2008-01-28 Semiconductor Energy Lab A method of manufacturing a semiconductor device
JP2003078037A (ja) * 2001-09-04 2003-03-14 Nec Corp 半導体メモリ装置
JP4634673B2 (ja) * 2001-09-26 2011-02-16 シャープ株式会社 液晶表示装置及びその製造方法
US20030203454A1 (en) * 2002-02-08 2003-10-30 Chotani Gopal K. Methods for producing end-products from carbon substrates

Also Published As

Publication number Publication date
KR20040047720A (ko) 2004-06-05
JP2004177892A (ja) 2004-06-24
TWI270207B (en) 2007-01-01
US7122830B2 (en) 2006-10-17
US20040113142A1 (en) 2004-06-17
TW200423395A (en) 2004-11-01
KR101124995B1 (ko) 2012-03-28

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