JP4162246B2 - シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 - Google Patents

シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 Download PDF

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Publication number
JP4162246B2
JP4162246B2 JP2005234650A JP2005234650A JP4162246B2 JP 4162246 B2 JP4162246 B2 JP 4162246B2 JP 2005234650 A JP2005234650 A JP 2005234650A JP 2005234650 A JP2005234650 A JP 2005234650A JP 4162246 B2 JP4162246 B2 JP 4162246B2
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Japan
Prior art keywords
silver
acid
salt
plating bath
cyanide
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Expired - Lifetime
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JP2005234650A
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Japanese (ja)
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JP2007046142A5 (enExample
JP2007046142A (ja
Inventor
哲治 西川
惠吾 小幡
雅一 吉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
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Priority to JP2005234650A priority Critical patent/JP4162246B2/ja
Publication of JP2007046142A publication Critical patent/JP2007046142A/ja
Publication of JP2007046142A5 publication Critical patent/JP2007046142A5/ja
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Publication of JP4162246B2 publication Critical patent/JP4162246B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2005234650A 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 Expired - Lifetime JP4162246B2 (ja)

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JP2005234650A JP4162246B2 (ja) 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法

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JP2005234650A JP4162246B2 (ja) 2005-08-12 2005-08-12 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法

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JP2007046142A JP2007046142A (ja) 2007-02-22
JP2007046142A5 JP2007046142A5 (enExample) 2008-02-28
JP4162246B2 true JP4162246B2 (ja) 2008-10-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4230775A4 (en) * 2020-11-25 2025-02-26 Mitsubishi Materials Corporation Tin alloy plating solution

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5247142B2 (ja) * 2007-12-19 2013-07-24 株式会社大和化成研究所 銀めっき方法
JP5481282B2 (ja) * 2010-06-07 2014-04-23 神鋼リードミック株式会社 電子部品材
JP5789430B2 (ja) 2011-06-27 2015-10-07 イハラニッケイ化学工業株式会社 ２−クロロメチルベンズアルデヒドの製造方法、２−クロロメチルベンズアルデヒド含有組成物及びその保管方法
US8980077B2 (en) * 2012-03-30 2015-03-17 Rohm And Haas Electronic Materials Llc Plating bath and method
CN104402784B (zh) * 2014-12-15 2015-10-21 黄河三角洲京博化工研究院有限公司 羟基化合物、巯基化合物及其制备方法、用于制备光学树脂的硫醇组合物
US10385458B2 (en) 2014-12-17 2019-08-20 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
WO2018142776A1 (ja) 2017-01-31 2018-08-09 三菱マテリアル株式会社 錫合金めっき液
JP6432667B2 (ja) 2017-01-31 2018-12-05 三菱マテリアル株式会社 錫合金めっき液
JP6645609B2 (ja) 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
EP3835458B1 (en) 2018-07-27 2023-08-16 Mitsubishi Materials Corporation Tin alloy plating solution
CN114175408A (zh) * 2019-08-09 2022-03-11 三菱综合材料株式会社 连接器用端子材料
WO2021029254A1 (ja) * 2019-08-09 2021-02-18 三菱マテリアル株式会社 コネクタ用端子材
JP7040544B2 (ja) * 2020-02-20 2022-03-23 三菱マテリアル株式会社 コネクタ用端子材
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
CN113930814B (zh) * 2021-11-12 2023-07-11 国网山东省电力公司电力科学研究院 一种银合金镀液、电刷镀工艺、银合金镀层及应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4230775A4 (en) * 2020-11-25 2025-02-26 Mitsubishi Materials Corporation Tin alloy plating solution

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