JP2007046142A5 - - Google Patents
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- Publication number
- JP2007046142A5 JP2007046142A5 JP2005234650A JP2005234650A JP2007046142A5 JP 2007046142 A5 JP2007046142 A5 JP 2007046142A5 JP 2005234650 A JP2005234650 A JP 2005234650A JP 2005234650 A JP2005234650 A JP 2005234650A JP 2007046142 A5 JP2007046142 A5 JP 2007046142A5
- Authority
- JP
- Japan
- Prior art keywords
- salt
- cyanide
- alkyl
- different
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims 11
- 238000007747 plating Methods 0.000 claims 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 8
- 229910052709 silver Inorganic materials 0.000 claims 8
- 239000004332 silver Substances 0.000 claims 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- -1 silver salts Chemical class 0.000 claims 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000002280 amphoteric surfactant Substances 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000003093 cationic surfactant Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 150000003378 silver Chemical class 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005234650A JP4162246B2 (ja) | 2005-08-12 | 2005-08-12 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005234650A JP4162246B2 (ja) | 2005-08-12 | 2005-08-12 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007046142A JP2007046142A (ja) | 2007-02-22 |
| JP2007046142A5 true JP2007046142A5 (enExample) | 2008-02-28 |
| JP4162246B2 JP4162246B2 (ja) | 2008-10-08 |
Family
ID=37849214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005234650A Expired - Lifetime JP4162246B2 (ja) | 2005-08-12 | 2005-08-12 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4162246B2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5247142B2 (ja) * | 2007-12-19 | 2013-07-24 | 株式会社大和化成研究所 | 銀めっき方法 |
| JP5481282B2 (ja) * | 2010-06-07 | 2014-04-23 | 神鋼リードミック株式会社 | 電子部品材 |
| JP5789430B2 (ja) | 2011-06-27 | 2015-10-07 | イハラニッケイ化学工業株式会社 | ２−クロロメチルベンズアルデヒドの製造方法、２−クロロメチルベンズアルデヒド含有組成物及びその保管方法 |
| US8980077B2 (en) * | 2012-03-30 | 2015-03-17 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| CN104402784B (zh) * | 2014-12-15 | 2015-10-21 | 黄河三角洲京博化工研究院有限公司 | 羟基化合物、巯基化合物及其制备方法、用于制备光学树脂的硫醇组合物 |
| US10385458B2 (en) | 2014-12-17 | 2019-08-20 | Atotech Deutschland Gmbh | Plating bath composition and method for electroless plating of palladium |
| WO2018142776A1 (ja) | 2017-01-31 | 2018-08-09 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| JP6432667B2 (ja) | 2017-01-31 | 2018-12-05 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| JP6645609B2 (ja) | 2018-07-27 | 2020-02-14 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| EP3835458B1 (en) | 2018-07-27 | 2023-08-16 | Mitsubishi Materials Corporation | Tin alloy plating solution |
| CN114175408A (zh) * | 2019-08-09 | 2022-03-11 | 三菱综合材料株式会社 | 连接器用端子材料 |
| WO2021029254A1 (ja) * | 2019-08-09 | 2021-02-18 | 三菱マテリアル株式会社 | コネクタ用端子材 |
| JP7040544B2 (ja) * | 2020-02-20 | 2022-03-23 | 三菱マテリアル株式会社 | コネクタ用端子材 |
| JP7140176B2 (ja) * | 2020-11-25 | 2022-09-21 | 三菱マテリアル株式会社 | 錫合金めっき液 |
| US11578418B2 (en) * | 2021-03-29 | 2023-02-14 | Rohm And Haas Electronic Materials Llc (Rhem) | Silver electroplating compositions and methods for electroplating silver with low coefficients of friction |
| CN113930814B (zh) * | 2021-11-12 | 2023-07-11 | 国网山东省电力公司电力科学研究院 | 一种银合金镀液、电刷镀工艺、银合金镀层及应用 |
-
2005
- 2005-08-12 JP JP2005234650A patent/JP4162246B2/ja not_active Expired - Lifetime
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