JP2018123421A5 - - Google Patents
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- Publication number
- JP2018123421A5 JP2018123421A5 JP2017222433A JP2017222433A JP2018123421A5 JP 2018123421 A5 JP2018123421 A5 JP 2018123421A5 JP 2017222433 A JP2017222433 A JP 2017222433A JP 2017222433 A JP2017222433 A JP 2017222433A JP 2018123421 A5 JP2018123421 A5 JP 2018123421A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- alloy plating
- tin
- tin alloy
- solution according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001128 Sn alloy Inorganic materials 0.000 claims 7
- 238000007747 plating Methods 0.000 claims 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims 1
- 239000002280 amphoteric surfactant Substances 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 238000005282 brightening Methods 0.000 claims 1
- 239000003093 cationic surfactant Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- -1 sulfide compound Chemical class 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020197024869A KR102174876B1 (ko) | 2017-01-31 | 2017-12-13 | 주석 합금 도금액 |
| PCT/JP2017/044668 WO2018142776A1 (ja) | 2017-01-31 | 2017-12-13 | 錫合金めっき液 |
| EP17895170.3A EP3578692A4 (en) | 2017-01-31 | 2017-12-13 | TIN ALLOY PLATING SOLUTION |
| US16/481,959 US20190390357A1 (en) | 2017-01-31 | 2017-12-13 | Tin alloy plating solution |
| CN201780084824.3A CN110249076A (zh) | 2017-01-31 | 2017-12-13 | 锡合金镀液 |
| TW106145193A TWI681084B (zh) | 2017-01-31 | 2017-12-22 | 錫合金鍍敷液 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017015219 | 2017-01-31 | ||
| JP2017015219 | 2017-01-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018123421A JP2018123421A (ja) | 2018-08-09 |
| JP2018123421A5 true JP2018123421A5 (enExample) | 2018-09-20 |
| JP6432667B2 JP6432667B2 (ja) | 2018-12-05 |
Family
ID=63110055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017222433A Active JP6432667B2 (ja) | 2017-01-31 | 2017-11-20 | 錫合金めっき液 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190390357A1 (enExample) |
| EP (1) | EP3578692A4 (enExample) |
| JP (1) | JP6432667B2 (enExample) |
| KR (1) | KR102174876B1 (enExample) |
| CN (1) | CN110249076A (enExample) |
| TW (1) | TWI681084B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7243002B2 (ja) * | 2018-07-20 | 2023-03-22 | 三菱マテリアル株式会社 | 錫めっき液及び錫合金めっき液 |
| JP2021095396A (ja) * | 2019-12-12 | 2021-06-24 | 三菱マテリアル株式会社 | ジチアポリエーテルジオール及びその製造方法並びに該ジチアポリエーテルジオールを含むＳｎＡｇめっき液、該ＳｎＡｇめっき液を用いてめっき皮膜を形成する方法 |
| US20240116861A1 (en) | 2019-12-12 | 2024-04-11 | Mitsubishi Materials Corporation | Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution |
| CN111188069A (zh) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | 一种镀锡铋合金溶液及其制备方法 |
| CN112981459A (zh) * | 2021-03-12 | 2021-06-18 | 昆明理工大学 | 一种电解精炼粗焊锡的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4296358B2 (ja) * | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JP3718790B2 (ja) | 1998-12-24 | 2005-11-24 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| JP4756886B2 (ja) * | 2005-03-22 | 2011-08-24 | 石原薬品株式会社 | 非シアン系のスズ−銀合金メッキ浴 |
| JP4162246B2 (ja) | 2005-08-12 | 2008-10-08 | 石原薬品株式会社 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
| EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
| JP2016148085A (ja) * | 2015-02-12 | 2016-08-18 | ユケン工業株式会社 | スズ−銅めっき液および導電部材 |
| JP6631348B2 (ja) * | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | ホスホニウム塩を用いためっき液 |
-
2017
- 2017-11-20 JP JP2017222433A patent/JP6432667B2/ja active Active
- 2017-12-13 EP EP17895170.3A patent/EP3578692A4/en not_active Withdrawn
- 2017-12-13 KR KR1020197024869A patent/KR102174876B1/ko active Active
- 2017-12-13 CN CN201780084824.3A patent/CN110249076A/zh active Pending
- 2017-12-13 US US16/481,959 patent/US20190390357A1/en not_active Abandoned
- 2017-12-22 TW TW106145193A patent/TWI681084B/zh active
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