JP6432667B2 - 錫合金めっき液 - Google Patents

錫合金めっき液 Download PDF

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Publication number
JP6432667B2
JP6432667B2 JP2017222433A JP2017222433A JP6432667B2 JP 6432667 B2 JP6432667 B2 JP 6432667B2 JP 2017222433 A JP2017222433 A JP 2017222433A JP 2017222433 A JP2017222433 A JP 2017222433A JP 6432667 B2 JP6432667 B2 JP 6432667B2
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JP
Japan
Prior art keywords
tin
plating solution
alloy plating
tin alloy
acid
Prior art date
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Application number
JP2017222433A
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English (en)
Japanese (ja)
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JP2018123421A5 (enExample
JP2018123421A (ja
Inventor
康司 巽
康司 巽
司 八十嶋
司 八十嶋
琢磨 片瀬
琢磨 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to CN201780084824.3A priority Critical patent/CN110249076A/zh
Priority to PCT/JP2017/044668 priority patent/WO2018142776A1/ja
Priority to EP17895170.3A priority patent/EP3578692A4/en
Priority to KR1020197024869A priority patent/KR102174876B1/ko
Priority to US16/481,959 priority patent/US20190390357A1/en
Priority to TW106145193A priority patent/TWI681084B/zh
Publication of JP2018123421A publication Critical patent/JP2018123421A/ja
Publication of JP2018123421A5 publication Critical patent/JP2018123421A5/ja
Application granted granted Critical
Publication of JP6432667B2 publication Critical patent/JP6432667B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2017222433A 2017-01-31 2017-11-20 錫合金めっき液 Active JP6432667B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PCT/JP2017/044668 WO2018142776A1 (ja) 2017-01-31 2017-12-13 錫合金めっき液
EP17895170.3A EP3578692A4 (en) 2017-01-31 2017-12-13 TIN ALLOY PLATING SOLUTION
KR1020197024869A KR102174876B1 (ko) 2017-01-31 2017-12-13 주석 합금 도금액
US16/481,959 US20190390357A1 (en) 2017-01-31 2017-12-13 Tin alloy plating solution
CN201780084824.3A CN110249076A (zh) 2017-01-31 2017-12-13 锡合金镀液
TW106145193A TWI681084B (zh) 2017-01-31 2017-12-22 錫合金鍍敷液

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017015219 2017-01-31
JP2017015219 2017-01-31

Publications (3)

Publication Number Publication Date
JP2018123421A JP2018123421A (ja) 2018-08-09
JP2018123421A5 JP2018123421A5 (enExample) 2018-09-20
JP6432667B2 true JP6432667B2 (ja) 2018-12-05

Family

ID=63110055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017222433A Active JP6432667B2 (ja) 2017-01-31 2017-11-20 錫合金めっき液

Country Status (6)

Country Link
US (1) US20190390357A1 (enExample)
EP (1) EP3578692A4 (enExample)
JP (1) JP6432667B2 (enExample)
KR (1) KR102174876B1 (enExample)
CN (1) CN110249076A (enExample)
TW (1) TWI681084B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220113671A (ko) 2019-12-12 2022-08-16 미쓰비시 마테리알 가부시키가이샤 디티아폴리에테르디올, 그 제조 방법, 디티아폴리에테르디올을 포함하는 SnAg 도금액, 및 SnAg 도금액을 사용하여 도금 피막을 형성하는 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7243002B2 (ja) * 2018-07-20 2023-03-22 三菱マテリアル株式会社 錫めっき液及び錫合金めっき液
JP2021095396A (ja) * 2019-12-12 2021-06-24 三菱マテリアル株式会社 ジチアポリエーテルジオール及びその製造方法並びに該ジチアポリエーテルジオールを含むＳｎＡｇめっき液、該ＳｎＡｇめっき液を用いてめっき皮膜を形成する方法
CN111188069A (zh) * 2019-12-31 2020-05-22 大连长丰实业总公司 一种镀锡铋合金溶液及其制备方法
CN112981459A (zh) * 2021-03-12 2021-06-18 昆明理工大学 一种电解精炼粗焊锡的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP3718790B2 (ja) 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
JP4756886B2 (ja) * 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金メッキ浴
JP4162246B2 (ja) 2005-08-12 2008-10-08 石原薬品株式会社 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP2016148085A (ja) * 2015-02-12 2016-08-18 ユケン工業株式会社 スズ−銅めっき液および導電部材
JP6631348B2 (ja) * 2015-03-26 2020-01-15 三菱マテリアル株式会社 ホスホニウム塩を用いためっき液

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220113671A (ko) 2019-12-12 2022-08-16 미쓰비시 마테리알 가부시키가이샤 디티아폴리에테르디올, 그 제조 방법, 디티아폴리에테르디올을 포함하는 SnAg 도금액, 및 SnAg 도금액을 사용하여 도금 피막을 형성하는 방법

Also Published As

Publication number Publication date
US20190390357A1 (en) 2019-12-26
KR20190103460A (ko) 2019-09-04
TW201833391A (zh) 2018-09-16
EP3578692A4 (en) 2020-12-09
CN110249076A (zh) 2019-09-17
EP3578692A1 (en) 2019-12-11
KR102174876B1 (ko) 2020-11-05
JP2018123421A (ja) 2018-08-09
TWI681084B (zh) 2020-01-01

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