JP2018123421A5 - - Google Patents
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- Publication number
- JP2018123421A5 JP2018123421A5 JP2017222433A JP2017222433A JP2018123421A5 JP 2018123421 A5 JP2018123421 A5 JP 2018123421A5 JP 2017222433 A JP2017222433 A JP 2017222433A JP 2017222433 A JP2017222433 A JP 2017222433A JP 2018123421 A5 JP2018123421 A5 JP 2018123421A5
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- alloy plating
- tin
- tin alloy
- solution according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229910001128 Sn alloy Inorganic materials 0.000 claims 7
- 238000007747 plating Methods 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910052718 tin Inorganic materials 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- AXZWODMDQAVCJE-UHFFFAOYSA-L Tin(II) chloride Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims 1
- 239000002280 amphoteric surfactant Substances 0.000 claims 1
- 239000003945 anionic surfactant Substances 0.000 claims 1
- 230000003078 antioxidant Effects 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 238000005282 brightening Methods 0.000 claims 1
- 239000003093 cationic surfactant Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000008139 complexing agent Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000002736 nonionic surfactant Substances 0.000 claims 1
- 239000003002 pH adjusting agent Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000011780 sodium chloride Substances 0.000 claims 1
- -1 sulfide compound Chemical class 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Claims (7)
- 可溶性錫塩と、錫より貴な金属の可溶性塩と、下記一般式（１）で示されるスルフィド化合物とを含む錫合金めっき液。式（１）中、ｎは１〜３である。
- 更にアニオン界面活性剤、カチオン界面活性剤、非イオン系界面活性剤及び両性界面活性剤より選ばれる少なくとも１種又は２種以上の界面活性剤を含む請求項１記載の錫合金めっき液。
- 前記錫より貴な金属が、銀、銅、金及びビスマスより選ばれる少なくとも１種又は２種以上の金属である請求項１又は請求項２記載の錫合金めっき液。
- 更に酸化防止剤を含む請求項１から請求項３のいずれか１項に記載の錫合金めっき液。
- 更に錫用の錯体化剤を含む請求項１から請求項４のいずれか１項に記載の錫合金めっき液。
- 更にｐＨ調整剤を含む請求項１から請求項５のいずれか１項に記載の錫合金めっき液。
- 更に光沢化剤を含む請求項１から請求項６のいずれか１項に記載の錫合金めっき液。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/481,959 US20190390357A1 (en) | 2017-01-31 | 2017-12-13 | Tin alloy plating solution |
| EP17895170.3A EP3578692A4 (en) | 2017-01-31 | 2017-12-13 | TIN ALLOY PLATING SOLUTION |
| CN201780084824.3A CN110249076A (zh) | 2017-01-31 | 2017-12-13 | 锡合金镀液 |
| KR1020197024869A KR102174876B1 (ko) | 2017-01-31 | 2017-12-13 | 주석 합금 도금액 |
| PCT/JP2017/044668 WO2018142776A1 (ja) | 2017-01-31 | 2017-12-13 | 錫合金めっき液 |
| TW106145193A TWI681084B (zh) | 2017-01-31 | 2017-12-22 | 錫合金鍍敷液 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017015219 | 2017-01-31 | ||
| JP2017015219 | 2017-01-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018123421A JP2018123421A (ja) | 2018-08-09 |
| JP2018123421A5 true JP2018123421A5 (ja) | 2018-09-20 |
| JP6432667B2 JP6432667B2 (ja) | 2018-12-05 |
Family
ID=63110055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017222433A Active JP6432667B2 (ja) | 2017-01-31 | 2017-11-20 | 錫合金めっき液 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190390357A1 (ja) |
| EP (1) | EP3578692A4 (ja) |
| JP (1) | JP6432667B2 (ja) |
| KR (1) | KR102174876B1 (ja) |
| CN (1) | CN110249076A (ja) |
| TW (1) | TWI681084B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7243002B2 (ja) * | 2018-07-20 | 2023-03-22 | 三菱マテリアル株式会社 | 錫めっき液及び錫合金めっき液 |
| US20240116861A1 (en) * | 2019-12-12 | 2024-04-11 | Mitsubishi Materials Corporation | Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution |
| CN111188069A (zh) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | 一种镀锡铋合金溶液及其制备方法 |
| CN112981459A (zh) * | 2021-03-12 | 2021-06-18 | 昆明理工大学 | 一种电解精炼粗焊锡的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4296358B2 (ja) * | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JP3718790B2 (ja) | 1998-12-24 | 2005-11-24 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
| US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| JP4756886B2 (ja) * | 2005-03-22 | 2011-08-24 | 石原薬品株式会社 | 非シアン系のスズ−銀合金メッキ浴 |
| JP4162246B2 (ja) | 2005-08-12 | 2008-10-08 | 石原薬品株式会社 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
| EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
| JP2016148085A (ja) * | 2015-02-12 | 2016-08-18 | ユケン工業株式会社 | スズ−銅めっき液および導電部材 |
| JP6631348B2 (ja) * | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | ホスホニウム塩を用いためっき液 |
-
2017
- 2017-11-20 JP JP2017222433A patent/JP6432667B2/ja active Active
- 2017-12-13 CN CN201780084824.3A patent/CN110249076A/zh active Pending
- 2017-12-13 US US16/481,959 patent/US20190390357A1/en not_active Abandoned
- 2017-12-13 KR KR1020197024869A patent/KR102174876B1/ko active IP Right Grant
- 2017-12-13 EP EP17895170.3A patent/EP3578692A4/en not_active Withdrawn
- 2017-12-22 TW TW106145193A patent/TWI681084B/zh active
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