KR102174876B1 - 주석 합금 도금액 - Google Patents
주석 합금 도금액 Download PDFInfo
- Publication number
- KR102174876B1 KR102174876B1 KR1020197024869A KR20197024869A KR102174876B1 KR 102174876 B1 KR102174876 B1 KR 102174876B1 KR 1020197024869 A KR1020197024869 A KR 1020197024869A KR 20197024869 A KR20197024869 A KR 20197024869A KR 102174876 B1 KR102174876 B1 KR 102174876B1
- Authority
- KR
- South Korea
- Prior art keywords
- tin
- plating solution
- acid
- alloy plating
- tin alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017015219 | 2017-01-31 | ||
JPJP-P-2017-015219 | 2017-01-31 | ||
JP2017222433A JP6432667B2 (ja) | 2017-01-31 | 2017-11-20 | 錫合金めっき液 |
JPJP-P-2017-222433 | 2017-11-20 | ||
PCT/JP2017/044668 WO2018142776A1 (ja) | 2017-01-31 | 2017-12-13 | 錫合金めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190103460A KR20190103460A (ko) | 2019-09-04 |
KR102174876B1 true KR102174876B1 (ko) | 2020-11-05 |
Family
ID=63110055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197024869A KR102174876B1 (ko) | 2017-01-31 | 2017-12-13 | 주석 합금 도금액 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190390357A1 (ja) |
EP (1) | EP3578692A4 (ja) |
JP (1) | JP6432667B2 (ja) |
KR (1) | KR102174876B1 (ja) |
CN (1) | CN110249076A (ja) |
TW (1) | TWI681084B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7243002B2 (ja) * | 2018-07-20 | 2023-03-22 | 三菱マテリアル株式会社 | 錫めっき液及び錫合金めっき液 |
US20240116861A1 (en) * | 2019-12-12 | 2024-04-11 | Mitsubishi Materials Corporation | Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution |
CN111188069A (zh) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | 一种镀锡铋合金溶液及其制备方法 |
CN112981459A (zh) * | 2021-03-12 | 2021-06-18 | 昆明理工大学 | 一种电解精炼粗焊锡的方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265572A (ja) * | 2005-03-22 | 2006-10-05 | Ishihara Chem Co Ltd | 非シアン系のスズ−銀合金メッキ浴 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4296358B2 (ja) * | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
JP3718790B2 (ja) | 1998-12-24 | 2005-11-24 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
JP3433291B2 (ja) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品 |
US7628903B1 (en) * | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
JP4162246B2 (ja) | 2005-08-12 | 2008-10-08 | 石原薬品株式会社 | シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法 |
EP2221396A1 (en) * | 2008-12-31 | 2010-08-25 | Rohm and Haas Electronic Materials LLC | Lead-Free Tin Alloy Electroplating Compositions and Methods |
JP2016148085A (ja) * | 2015-02-12 | 2016-08-18 | ユケン工業株式会社 | スズ−銅めっき液および導電部材 |
JP6631348B2 (ja) * | 2015-03-26 | 2020-01-15 | 三菱マテリアル株式会社 | ホスホニウム塩を用いためっき液 |
-
2017
- 2017-11-20 JP JP2017222433A patent/JP6432667B2/ja active Active
- 2017-12-13 CN CN201780084824.3A patent/CN110249076A/zh active Pending
- 2017-12-13 US US16/481,959 patent/US20190390357A1/en not_active Abandoned
- 2017-12-13 KR KR1020197024869A patent/KR102174876B1/ko active IP Right Grant
- 2017-12-13 EP EP17895170.3A patent/EP3578692A4/en not_active Withdrawn
- 2017-12-22 TW TW106145193A patent/TWI681084B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265572A (ja) * | 2005-03-22 | 2006-10-05 | Ishihara Chem Co Ltd | 非シアン系のスズ−銀合金メッキ浴 |
Also Published As
Publication number | Publication date |
---|---|
EP3578692A1 (en) | 2019-12-11 |
EP3578692A4 (en) | 2020-12-09 |
JP6432667B2 (ja) | 2018-12-05 |
TWI681084B (zh) | 2020-01-01 |
JP2018123421A (ja) | 2018-08-09 |
CN110249076A (zh) | 2019-09-17 |
TW201833391A (zh) | 2018-09-16 |
US20190390357A1 (en) | 2019-12-26 |
KR20190103460A (ko) | 2019-09-04 |
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