TWI681084B - 錫合金鍍敷液 - Google Patents

錫合金鍍敷液 Download PDF

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Publication number
TWI681084B
TWI681084B TW106145193A TW106145193A TWI681084B TW I681084 B TWI681084 B TW I681084B TW 106145193 A TW106145193 A TW 106145193A TW 106145193 A TW106145193 A TW 106145193A TW I681084 B TWI681084 B TW I681084B
Authority
TW
Taiwan
Prior art keywords
tin
plating solution
alloy plating
acid
tin alloy
Prior art date
Application number
TW106145193A
Other languages
English (en)
Chinese (zh)
Other versions
TW201833391A (zh
Inventor
康司
八十嶋司
片瀬𤥨磨
Original Assignee
日商三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱綜合材料股份有限公司 filed Critical 日商三菱綜合材料股份有限公司
Publication of TW201833391A publication Critical patent/TW201833391A/zh
Application granted granted Critical
Publication of TWI681084B publication Critical patent/TWI681084B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW106145193A 2017-01-31 2017-12-22 錫合金鍍敷液 TWI681084B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017015219 2017-01-31
JP2017-015219 2017-01-31
JP2017-222433 2017-11-20
JP2017222433A JP6432667B2 (ja) 2017-01-31 2017-11-20 錫合金めっき液

Publications (2)

Publication Number Publication Date
TW201833391A TW201833391A (zh) 2018-09-16
TWI681084B true TWI681084B (zh) 2020-01-01

Family

ID=63110055

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106145193A TWI681084B (zh) 2017-01-31 2017-12-22 錫合金鍍敷液

Country Status (6)

Country Link
US (1) US20190390357A1 (ja)
EP (1) EP3578692A4 (ja)
JP (1) JP6432667B2 (ja)
KR (1) KR102174876B1 (ja)
CN (1) CN110249076A (ja)
TW (1) TWI681084B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7243002B2 (ja) * 2018-07-20 2023-03-22 三菱マテリアル株式会社 錫めっき液及び錫合金めっき液
US20240116861A1 (en) * 2019-12-12 2024-04-11 Mitsubishi Materials Corporation Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution
CN111188069A (zh) * 2019-12-31 2020-05-22 大连长丰实业总公司 一种镀锡铋合金溶液及其制备方法
CN112981459A (zh) * 2021-03-12 2021-06-18 昆明理工大学 一种电解精炼粗焊锡的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589411B (en) * 1999-09-27 2004-06-01 Ishihara Chemical Co Ltd Alloy plating bath containing tin and copper, plating method for depositing alloy containing and copper, and article having a plated coating of alloy containing tin and copper formed thereon
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴
JP2016183409A (ja) * 2015-03-26 2016-10-20 三菱マテリアル株式会社 ホスホニウム塩を用いためっき液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP3718790B2 (ja) 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
JP4162246B2 (ja) 2005-08-12 2008-10-08 石原薬品株式会社 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP2016148085A (ja) * 2015-02-12 2016-08-18 ユケン工業株式会社 スズ−銅めっき液および導電部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW589411B (en) * 1999-09-27 2004-06-01 Ishihara Chemical Co Ltd Alloy plating bath containing tin and copper, plating method for depositing alloy containing and copper, and article having a plated coating of alloy containing tin and copper formed thereon
JP2006265572A (ja) * 2005-03-22 2006-10-05 Ishihara Chem Co Ltd 非シアン系のスズ−銀合金メッキ浴
JP2016183409A (ja) * 2015-03-26 2016-10-20 三菱マテリアル株式会社 ホスホニウム塩を用いためっき液

Also Published As

Publication number Publication date
KR102174876B1 (ko) 2020-11-05
EP3578692A1 (en) 2019-12-11
EP3578692A4 (en) 2020-12-09
JP6432667B2 (ja) 2018-12-05
JP2018123421A (ja) 2018-08-09
CN110249076A (zh) 2019-09-17
TW201833391A (zh) 2018-09-16
US20190390357A1 (en) 2019-12-26
KR20190103460A (ko) 2019-09-04

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