CN110249076A - 锡合金镀液 - Google Patents

锡合金镀液 Download PDF

Info

Publication number
CN110249076A
CN110249076A CN201780084824.3A CN201780084824A CN110249076A CN 110249076 A CN110249076 A CN 110249076A CN 201780084824 A CN201780084824 A CN 201780084824A CN 110249076 A CN110249076 A CN 110249076A
Authority
CN
China
Prior art keywords
plating solution
tin
acid
tin alloy
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780084824.3A
Other languages
English (en)
Chinese (zh)
Inventor
巽康司
八十嶋司
片濑琢磨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority claimed from PCT/JP2017/044668 external-priority patent/WO2018142776A1/ja
Publication of CN110249076A publication Critical patent/CN110249076A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201780084824.3A 2017-01-31 2017-12-13 锡合金镀液 Pending CN110249076A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2017015219 2017-01-31
JP2017-015219 2017-01-31
JP2017-222433 2017-11-20
JP2017222433A JP6432667B2 (ja) 2017-01-31 2017-11-20 錫合金めっき液
PCT/JP2017/044668 WO2018142776A1 (ja) 2017-01-31 2017-12-13 錫合金めっき液

Publications (1)

Publication Number Publication Date
CN110249076A true CN110249076A (zh) 2019-09-17

Family

ID=63110055

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780084824.3A Pending CN110249076A (zh) 2017-01-31 2017-12-13 锡合金镀液

Country Status (6)

Country Link
US (1) US20190390357A1 (ja)
EP (1) EP3578692A4 (ja)
JP (1) JP6432667B2 (ja)
KR (1) KR102174876B1 (ja)
CN (1) CN110249076A (ja)
TW (1) TWI681084B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111188069A (zh) * 2019-12-31 2020-05-22 大连长丰实业总公司 一种镀锡铋合金溶液及其制备方法
CN112981459A (zh) * 2021-03-12 2021-06-18 昆明理工大学 一种电解精炼粗焊锡的方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7243002B2 (ja) * 2018-07-20 2023-03-22 三菱マテリアル株式会社 錫めっき液及び錫合金めっき液
US20240116861A1 (en) * 2019-12-12 2024-04-11 Mitsubishi Materials Corporation Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
CN102051645A (zh) * 2008-12-31 2011-05-11 罗门哈斯电子材料有限公司 无铅的锡合金电镀组合物及方法
JP2016148085A (ja) * 2015-02-12 2016-08-18 ユケン工業株式会社 スズ−銅めっき液および導電部材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JP3718790B2 (ja) 1998-12-24 2005-11-24 石原薬品株式会社 銀及び銀合金メッキ浴
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP4756886B2 (ja) * 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金メッキ浴
JP4162246B2 (ja) 2005-08-12 2008-10-08 石原薬品株式会社 シアン化物非含有銀系メッキ浴、メッキ体及びメッキ方法
JP6631348B2 (ja) * 2015-03-26 2020-01-15 三菱マテリアル株式会社 ホスホニウム塩を用いためっき液

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
CN102051645A (zh) * 2008-12-31 2011-05-11 罗门哈斯电子材料有限公司 无铅的锡合金电镀组合物及方法
JP2015045094A (ja) * 2008-12-31 2015-03-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 鉛を含まないスズ合金電気めっき組成物および方法
JP2016106181A (ja) * 2008-12-31 2016-06-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 鉛を含まないスズ合金電気めっき組成物および方法
JP2016148085A (ja) * 2015-02-12 2016-08-18 ユケン工業株式会社 スズ−銅めっき液および導電部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111188069A (zh) * 2019-12-31 2020-05-22 大连长丰实业总公司 一种镀锡铋合金溶液及其制备方法
CN112981459A (zh) * 2021-03-12 2021-06-18 昆明理工大学 一种电解精炼粗焊锡的方法

Also Published As

Publication number Publication date
KR102174876B1 (ko) 2020-11-05
EP3578692A1 (en) 2019-12-11
EP3578692A4 (en) 2020-12-09
JP6432667B2 (ja) 2018-12-05
TWI681084B (zh) 2020-01-01
JP2018123421A (ja) 2018-08-09
TW201833391A (zh) 2018-09-16
US20190390357A1 (en) 2019-12-26
KR20190103460A (ko) 2019-09-04

Similar Documents

Publication Publication Date Title
CN110249076A (zh) 锡合金镀液
US6607653B1 (en) Plating bath and process for depositing alloy containing tin and copper
DE69924807T2 (de) Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad
US7179362B2 (en) Electrolyte and method for depositing tin-copper alloy layers
US6165342A (en) Cyanide-free electroplating bath for the deposition of gold and gold alloys
US20060272950A1 (en) High purity electrolytic sulfonic acid solutions
US6998036B2 (en) Electrolyte and method for depositing tin-silver alloy layers
US20060113195A1 (en) Near neutral pH tin electroplating solution
US4885064A (en) Additive composition, plating bath and method for electroplating tin and/or lead
JPH1121693A (ja) 錫−銀合金めっき浴及びめっき物
CN107429415B (zh) 使用了磷盐的电镀液
WO2018142776A1 (ja) 錫合金めっき液
US20050077186A1 (en) Electrolysis bath for electrodepositing silver-tin alloys
EP0397663B1 (en) Electrodeposition of tin-bismuth alloys
TWI728396B (zh) 錫合金鍍敷液
CN112236548B (zh) 锡合金镀液
DE10046600A1 (de) Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten
US11643742B2 (en) Silver/tin electroplating bath and method of using the same
SE2250388A1 (en) Compositions, methods, and preparations of cyanide-free gold solutions, suitable for electroplating of gold deposits and alloys thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20190917

WD01 Invention patent application deemed withdrawn after publication