JPH0241589B2 - - Google Patents

Info

Publication number
JPH0241589B2
JPH0241589B2 JP60293667A JP29366785A JPH0241589B2 JP H0241589 B2 JPH0241589 B2 JP H0241589B2 JP 60293667 A JP60293667 A JP 60293667A JP 29366785 A JP29366785 A JP 29366785A JP H0241589 B2 JPH0241589 B2 JP H0241589B2
Authority
JP
Japan
Prior art keywords
tin
lead
electroplating
compound
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60293667A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62196391A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25113054&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH0241589(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of JPS62196391A publication Critical patent/JPS62196391A/ja
Publication of JPH0241589B2 publication Critical patent/JPH0241589B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP60293667A 1985-09-20 1985-12-28 スズ―鉛電気メッキ溶液およびそれを用いた高速電気メッキ方法 Granted JPS62196391A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US778353 1985-09-20
US06/778,353 US4617097A (en) 1983-12-22 1985-09-20 Process and electrolyte for electroplating tin, lead or tin-lead alloys

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6318994A Division JP2807637B2 (ja) 1985-09-20 1994-11-16 スズ電気メッキ溶液及びそれを用いた高速電気メッキ方法

Publications (2)

Publication Number Publication Date
JPS62196391A JPS62196391A (ja) 1987-08-29
JPH0241589B2 true JPH0241589B2 (enExample) 1990-09-18

Family

ID=25113054

Family Applications (2)

Application Number Title Priority Date Filing Date
JP60293667A Granted JPS62196391A (ja) 1985-09-20 1985-12-28 スズ―鉛電気メッキ溶液およびそれを用いた高速電気メッキ方法
JP6318994A Expired - Lifetime JP2807637B2 (ja) 1985-09-20 1994-11-16 スズ電気メッキ溶液及びそれを用いた高速電気メッキ方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP6318994A Expired - Lifetime JP2807637B2 (ja) 1985-09-20 1994-11-16 スズ電気メッキ溶液及びそれを用いた高速電気メッキ方法

Country Status (4)

Country Link
US (1) US4617097A (enExample)
EP (1) EP0216955B1 (enExample)
JP (2) JPS62196391A (enExample)
DE (1) DE3582497D1 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
JPH01149987A (ja) * 1987-12-05 1989-06-13 Kosaku:Kk スズ−コバルト、スズ−ニッケル、スズ−鉛二元合金電気めっき浴組成物
EP0652306B1 (en) * 1987-12-10 2000-09-27 LeaRonal, Inc. Tin, lead or tin/lead alloy electrolytes for high-speed electroplating
US4994155A (en) * 1988-12-09 1991-02-19 Learonal, Inc. High speed tin, lead or tin/lead alloy electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4844780A (en) * 1988-02-17 1989-07-04 Maclee Chemical Company, Inc. Brightener and aqueous plating bath for tin and/or lead
US4849059A (en) * 1988-09-13 1989-07-18 Macdermid, Incorporated Aqueous electroplating bath and method for electroplating tin and/or lead and a defoaming agent therefor
JPH0293096A (ja) * 1988-09-30 1990-04-03 Daiwa Kasei Kenkyusho:Kk 滑り軸受の表面合金層の製造法
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
DE3934866A1 (de) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten
US4985127A (en) * 1989-12-29 1991-01-15 Vaughan Daniel J Electrodialytic conversion of multivalent metal salts using sulfonate ions
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5562814A (en) * 1995-09-01 1996-10-08 Dale Electronics, Inc. Sludge-limiting tin and/or lead electroplating bath
US6342148B1 (en) 1998-12-03 2002-01-29 Lucent Technologies Inc. Tin electroplating bath
WO2000040779A1 (en) 1998-12-31 2000-07-13 Semitool, Inc. Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece
US6322686B1 (en) * 2000-03-31 2001-11-27 Shipley Company, L.L.C. Tin electrolyte
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
US20050085062A1 (en) * 2003-10-15 2005-04-21 Semitool, Inc. Processes and tools for forming lead-free alloy solder precursors
JP4389083B2 (ja) * 2004-08-10 2009-12-24 石原薬品株式会社 鉛フリーのスズ−ビスマス系合金電気メッキ浴
JP4404909B2 (ja) * 2004-12-24 2010-01-27 日鉱金属株式会社 電気スズおよびスズ合金めっき液
CN101235526B (zh) * 2007-11-01 2010-08-18 华侨大学 电镀低锑铅合金的镀液及其配制方法
EP2143828B1 (en) * 2008-07-08 2016-12-28 Enthone, Inc. Electrolyte and method for the deposition of a matt metal layer
JP5574912B2 (ja) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 スズめっき液
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode
JP5033979B1 (ja) * 2011-09-29 2012-09-26 ユケン工業株式会社 スズからなるめっき用酸性水系組成物
US9850588B2 (en) * 2015-09-09 2017-12-26 Rohm And Haas Electronic Materials Llc Bismuth electroplating baths and methods of electroplating bismuth on a substrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB555929A (en) * 1942-11-23 1943-09-13 Nathaniel L Leek Improvements in or relating to the electrodeposition of tin or tin lead alloys
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
FR2071199A5 (enExample) * 1969-12-19 1971-09-17 Ibm France
US3905878A (en) * 1970-11-16 1975-09-16 Hyogo Prefectural Government Electrolyte for and method of bright electroplating of tin-lead alloy
US4000047A (en) * 1972-11-17 1976-12-28 Lea-Ronal, Inc. Electrodeposition of tin, lead and tin-lead alloys
SU501121A1 (ru) * 1974-05-13 1976-01-30 Предприятие П/Я А-7284 Электролит дл осаждени сплава олово-свинец
DD122265A1 (enExample) * 1975-10-28 1976-09-20
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
JPS53103936A (en) * 1977-02-23 1978-09-09 Sumitomo Electric Ind Ltd Electroplating solution
JPS5428142A (en) * 1977-08-05 1979-03-02 Mita Industrial Co Ltd One component type electrophotographic developer
JPS602396B2 (ja) * 1978-11-27 1985-01-21 東洋鋼鈑株式会社 酸性錫めつき浴
JPS5629758A (en) * 1979-08-20 1981-03-25 Nec Corp Microprogram control device
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
JPS59104491A (ja) * 1982-12-03 1984-06-16 Toshihiro Takada 水系電気メツキ用光沢剤
JPS59182986A (ja) * 1983-04-01 1984-10-17 Keigo Obata スズ、鉛及びすず−鉛合金メツキ浴
JPH0233795B2 (ja) * 1983-05-16 1990-07-30 Matsugiin Rooko Inc Metsukyokusoseibutsu
JPS624895A (ja) * 1985-06-26 1987-01-10 マツクジ−ン−ロ−コ・インコ−ポレ−テツド 水性めつき浴

Also Published As

Publication number Publication date
DE3582497D1 (de) 1991-05-16
JP2807637B2 (ja) 1998-10-08
JPH07197289A (ja) 1995-08-01
JPS62196391A (ja) 1987-08-29
US4617097A (en) 1986-10-14
EP0216955A1 (en) 1987-04-08
EP0216955B1 (en) 1991-04-10

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