JP4153569B2 - ヒートシンク構造を有する電子装置 - Google Patents

ヒートシンク構造を有する電子装置 Download PDF

Info

Publication number
JP4153569B2
JP4153569B2 JP04793797A JP4793797A JP4153569B2 JP 4153569 B2 JP4153569 B2 JP 4153569B2 JP 04793797 A JP04793797 A JP 04793797A JP 4793797 A JP4793797 A JP 4793797A JP 4153569 B2 JP4153569 B2 JP 4153569B2
Authority
JP
Japan
Prior art keywords
heat
chassis
absorbing portion
attached
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04793797A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09326458A5 (enExample
JPH09326458A (ja
Inventor
マシュー・エル・ウェブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compaq Computer Corp
Original Assignee
Compaq Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compaq Computer Corp filed Critical Compaq Computer Corp
Publication of JPH09326458A publication Critical patent/JPH09326458A/ja
Publication of JPH09326458A5 publication Critical patent/JPH09326458A5/ja
Application granted granted Critical
Publication of JP4153569B2 publication Critical patent/JP4153569B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP04793797A 1996-03-01 1997-03-03 ヒートシンク構造を有する電子装置 Expired - Fee Related JP4153569B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US609885 1996-03-01
US08/609,885 US5712762A (en) 1996-03-01 1996-03-01 Computer having a heat sink structure incorporated therein

Publications (3)

Publication Number Publication Date
JPH09326458A JPH09326458A (ja) 1997-12-16
JPH09326458A5 JPH09326458A5 (enExample) 2004-12-24
JP4153569B2 true JP4153569B2 (ja) 2008-09-24

Family

ID=24442747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04793797A Expired - Fee Related JP4153569B2 (ja) 1996-03-01 1997-03-03 ヒートシンク構造を有する電子装置

Country Status (2)

Country Link
US (2) US5712762A (enExample)
JP (1) JP4153569B2 (enExample)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712762A (en) * 1996-03-01 1998-01-27 Compaq Computer Corporation Computer having a heat sink structure incorporated therein
US5973920A (en) * 1996-05-31 1999-10-26 Texas Instruments Incorporated Heat frame for portable computer
JP3251180B2 (ja) * 1996-10-11 2002-01-28 富士通株式会社 ノートブック型コンピュータの放熱構造
JP3637164B2 (ja) * 1996-10-24 2005-04-13 株式会社東芝 発熱する回路素子を有する携帯形機器
US5969944A (en) * 1996-12-31 1999-10-19 Intel Corporation Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling
US6137688A (en) * 1996-12-31 2000-10-24 Intel Corporation Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply
US6067232A (en) * 1996-12-31 2000-05-23 Intel Corporation System for connecting subsystems of dissimilar thermal properties
US6018465A (en) * 1996-12-31 2000-01-25 Intel Corporation Apparatus for mounting a chip package to a chassis of a computer
US5978228A (en) * 1996-12-31 1999-11-02 Intel Corporation Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling
US6069793A (en) * 1997-01-24 2000-05-30 Hitachi, Ltd. Circuit module and information processing apparatus
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
US6424528B1 (en) * 1997-06-20 2002-07-23 Sun Microsystems, Inc. Heatsink with embedded heat pipe for thermal management of CPU
US5982616A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6205022B1 (en) * 1997-08-27 2001-03-20 Intel Corporation Apparatus for managing heat in a computer environment or the like
US6069792A (en) * 1997-09-16 2000-05-30 Nelik; Jacob Computer component cooling assembly
US5986882A (en) * 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
US6020820A (en) * 1997-10-28 2000-02-01 Micro-Star International Co., Ltd. CPU over-heat protection detection device
US6118655A (en) * 1997-12-08 2000-09-12 Compaq Computer Corporation Cooling fan with heat pipe-defined fan housing portion
JP2911441B1 (ja) * 1998-04-03 1999-06-23 伊藤 さとみ ヒートパイプ及びその製造方法とそれを用いた放熱構造
US6055157A (en) * 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6324056B1 (en) 1998-04-08 2001-11-27 Siemens Aktiengesellschaft Device for cooling a personal computer housed in a casing
TW450381U (en) * 1998-08-07 2001-08-11 Foxconn Prec Components Co Ltd Heat sink device
US6125035A (en) * 1998-10-13 2000-09-26 Dell Usa, L.P. Heat sink assembly with rotating heat pipe
US6347035B1 (en) 1998-10-30 2002-02-12 Fujitsu Limited Low profile EMI shield with heat spreading plate
JP2000216575A (ja) * 1999-01-22 2000-08-04 Toshiba Corp 冷却装置及び冷却装置を内蔵した電子機器
SE9901319D0 (sv) * 1999-04-13 1999-04-13 Multiq Products Ab Kylanordning vid dator
US6233146B1 (en) 1999-07-28 2001-05-15 Dell Usa, L.P. Rotatable portable computer remote heat exchanger with heat pipe
JP3959495B2 (ja) * 1999-08-31 2007-08-15 富士通株式会社 情報処理装置
US6166908A (en) * 1999-10-01 2000-12-26 Intel Corporation Integrated circuit cartridge
US6256199B1 (en) 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
GB2358521A (en) * 2000-01-24 2001-07-25 Chen Yang Shiau Heat sink structure adapted for use in a computer housing
US6166906A (en) * 2000-01-31 2000-12-26 Compal Electronics, Inc Heat-dissipating module for an electronic device
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6400565B1 (en) * 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
JP3895094B2 (ja) * 2000-04-27 2007-03-22 富士通株式会社 冷却機構、ヒートシンク、電子装置及び電子装置の組み立て方法
US6367263B1 (en) 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
US6377459B1 (en) * 2000-08-04 2002-04-23 Sun Microsystems, Inc. Chip cooling management
US6542359B2 (en) * 2000-12-27 2003-04-01 International Business Machines Corporation Apparatus and method for cooling a wearable computer
US6567269B2 (en) * 2001-04-23 2003-05-20 Hewlett-Packard Development Company, L.P. Computer system having removable processor and modular thermal unit
US6900984B2 (en) 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
US6373700B1 (en) * 2001-06-18 2002-04-16 Inventec Corporation Heat sink modular structure inside an electronic product
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US7411337B2 (en) * 2001-11-16 2008-08-12 Intel Corporation Electrical energy-generating system and devices and methods related thereto
US6574963B1 (en) 2001-11-16 2003-06-10 Intel Corporation Electrical energy-generating heat sink system and method of using same to recharge an energy storage device
JP4310070B2 (ja) * 2002-04-26 2009-08-05 株式会社日立製作所 ストレージシステムの運用管理方式
US6785140B2 (en) 2002-08-28 2004-08-31 Dell Products L.P. Multiple heat pipe heat sink
US6982877B2 (en) * 2004-02-20 2006-01-03 Hewlett-Packard Development Company, L.P. Heat sink having compliant interface to span multiple components
US7190577B2 (en) * 2004-09-28 2007-03-13 Apple Computer, Inc. Cooling system with integrated passive and active components
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
US7274572B2 (en) * 2005-04-26 2007-09-25 Inventec Corporation Supporting plate
US20070236887A1 (en) * 2006-04-10 2007-10-11 Inventec Corporation Heatsink module of heat-generating electronic elements on circuit board
US7826212B2 (en) * 2006-04-27 2010-11-02 Lsi Corporation Thermal control through a channel structure
US7450381B2 (en) * 2006-12-04 2008-11-11 International Business Machines Corporation Thermal management apparatus and method for printed circuit boards
TW200910070A (en) * 2007-08-28 2009-03-01 Inventec Corp Heat dissipation module
US20090166007A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
TWI342486B (en) * 2008-04-30 2011-05-21 Asustek Comp Inc Heat-dissipation module and electronic apparatus having the same
CN101616565A (zh) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 散热装置
CN101808490A (zh) * 2009-02-17 2010-08-18 富准精密工业(深圳)有限公司 散热装置
US8699226B2 (en) 2012-04-03 2014-04-15 Google Inc. Active cooling debris bypass fin pack
US10321605B2 (en) 2013-07-22 2019-06-11 Hewlett Packard Enterprise Development Lp Heat sink
JP6473920B2 (ja) * 2014-09-22 2019-02-27 パナソニックＩｐマネジメント株式会社 電子機器
US11599168B2 (en) * 2021-07-27 2023-03-07 Dell Products L.P. Extended thermal battery for cooling portable devices
US11963288B2 (en) * 2022-06-17 2024-04-16 Apple Inc. Thermal module for a circuit board

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4503483A (en) * 1982-05-03 1985-03-05 Hughes Aircraft Company Heat pipe cooling module for high power circuit boards
JPH0563385A (ja) * 1991-08-30 1993-03-12 Hitachi Ltd ヒートパイプ付き電子機器及び計算機
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5471850A (en) * 1993-07-09 1995-12-05 Acurex Corporation Refrigeration system and method for very large scale integrated circuits
US5412535A (en) * 1993-08-24 1995-05-02 Convex Computer Corporation Apparatus and method for cooling electronic devices
US5430609A (en) * 1993-09-02 1995-07-04 Kikinis; Dan Microprocessor cooling in a portable computer
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5424913A (en) * 1994-01-11 1995-06-13 Dell Usa, L.P. Heat sink/component access door for portable computers
US5612852A (en) * 1994-03-02 1997-03-18 Sun Microsystems, Inc. Compact housing for a computer workstation
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5581443A (en) * 1994-09-14 1996-12-03 Kabushiki Kaisha Toshiba Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
JPH08204373A (ja) * 1995-01-27 1996-08-09 Diamond Electric Mfg Co Ltd 放熱装置
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5559675A (en) * 1995-03-28 1996-09-24 Twinhead International Corp. Computer CPU heat dissipating and protecting device
US5568360A (en) * 1995-03-29 1996-10-22 Dell Usa, L.P. Heat pipe device and method for attaching same to a computer keyboard
US5734550A (en) * 1995-03-29 1998-03-31 Dell Usa, L.P. Computer having a heat transfer system operably connected during assembly of a computer keyboard upon the computer
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
US5621613A (en) * 1995-05-16 1997-04-15 Intel Corporation Apparatus for dissipating heat in a hinged computing device
US5646822A (en) * 1995-08-30 1997-07-08 Intel Corporation Heat pipe exchanger system for cooling a hinged computing device
US5673176A (en) * 1995-12-06 1997-09-30 Dell Usa, L.P. Integrated circuit dual cooling paths and method for constructing same
US5712762A (en) * 1996-03-01 1998-01-27 Compaq Computer Corporation Computer having a heat sink structure incorporated therein

Also Published As

Publication number Publication date
US5712762A (en) 1998-01-27
US5875095A (en) 1999-02-23
JPH09326458A (ja) 1997-12-16

Similar Documents

Publication Publication Date Title
JP4153569B2 (ja) ヒートシンク構造を有する電子装置
US6549414B1 (en) Computers
US5966286A (en) Cooling system for thin profile electronic and computer devices
KR100310099B1 (ko) 반도체집적회로장치용방열장치및그것을구비하는휴대용컴퓨터
JP3786446B2 (ja) 送風装置
US5559675A (en) Computer CPU heat dissipating and protecting device
KR19980071649A (ko) 히트 싱크 및 그를 탑재한 정보 처리 장치
US6608751B2 (en) Electronic device
JP3734895B2 (ja) ヒートシンク
JPH09293985A (ja) 電子機器
JP2003209385A (ja) パソコン冷却装置
JP3939868B2 (ja) 電子素子の冷却構造
JPH1168367A (ja) 発熱素子の冷却構造
CN217037774U (zh) 一种具有散热结构的通信设备
JPH09232488A (ja) 電子素子の冷却構造
JP3481500B2 (ja) 磁気ディスク装置
CN220858179U (zh) 一种液晶电视机散热片
JP2004164667A (ja) 電子装置の放熱ヒンジ構造
CN216083625U (zh) 一种热电制冷笔记本电脑风冷系统
JP3579266B2 (ja) 薄型電子装置の放熱装置
KR100264370B1 (ko) 히트싱크장치
JP3953213B2 (ja) 電子素子用冷却器
JP3953211B2 (ja) 電子素子の放熱構造
JPH0876892A (ja) 携帯型情報装置
JP3933326B2 (ja) 冷却モジュール

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070123

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20070124

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20070129

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070723

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071220

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080418

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080521

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080604

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080616

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080625

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080704

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110711

Year of fee payment: 3

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080616

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110711

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120711

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120711

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130711

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees