JP4146812B2 - Mems基板およびmems基板の形成方法 - Google Patents

Mems基板およびmems基板の形成方法 Download PDF

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Publication number
JP4146812B2
JP4146812B2 JP2004065493A JP2004065493A JP4146812B2 JP 4146812 B2 JP4146812 B2 JP 4146812B2 JP 2004065493 A JP2004065493 A JP 2004065493A JP 2004065493 A JP2004065493 A JP 2004065493A JP 4146812 B2 JP4146812 B2 JP 4146812B2
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JP
Japan
Prior art keywords
strain gauge
substrate
mems
angle
strain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004065493A
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English (en)
Japanese (ja)
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JP2004271527A (ja
JP2004271527A5 (enExample
Inventor
リー ニッケル エリック
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of JP2004271527A publication Critical patent/JP2004271527A/ja
Publication of JP2004271527A5 publication Critical patent/JP2004271527A5/ja
Application granted granted Critical
Publication of JP4146812B2 publication Critical patent/JP4146812B2/ja
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Expired - Fee Related legal-status Critical Current

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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05FSYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02Regulating voltage or current
    • G05F3/08Regulating voltage or current wherein the variable is DC
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14153Structures including a sensor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G01L1/2293Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/0045Converters combining the concepts of switch-mode regulation and linear regulation, e.g. linear pre-regulator to switching converter, linear and switching converter in parallel, same converter or same transistor operating either in linear or switching mode

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Micromachines (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2004065493A 2003-03-10 2004-03-09 Mems基板およびmems基板の形成方法 Expired - Fee Related JP4146812B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/384,887 US6739199B1 (en) 2003-03-10 2003-03-10 Substrate and method of forming substrate for MEMS device with strain gage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008132869A Division JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Publications (3)

Publication Number Publication Date
JP2004271527A JP2004271527A (ja) 2004-09-30
JP2004271527A5 JP2004271527A5 (enExample) 2007-08-23
JP4146812B2 true JP4146812B2 (ja) 2008-09-10

Family

ID=32312413

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004065493A Expired - Fee Related JP4146812B2 (ja) 2003-03-10 2004-03-09 Mems基板およびmems基板の形成方法
JP2008132869A Pending JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008132869A Pending JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Country Status (5)

Country Link
US (1) US6739199B1 (enExample)
EP (1) EP1457766B1 (enExample)
JP (2) JP4146812B2 (enExample)
KR (1) KR101083903B1 (enExample)
TW (1) TWI306831B (enExample)

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* Cited by examiner, † Cited by third party
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JP2004358799A (ja) * 2003-06-04 2004-12-24 Canon Inc キャリッジ駆動制御方法
US6988412B1 (en) * 2004-11-30 2006-01-24 Endevco Corporation Piezoresistive strain concentrator
WO2008048212A2 (en) * 2005-07-07 2008-04-24 The Regents Of The University Of California Infrared sensor systems and devices
CN101657747B (zh) * 2006-12-05 2014-12-10 维斯普瑞公司 带有开槽金属的基板及相关方法
JP5026144B2 (ja) * 2007-05-18 2012-09-12 日本電信電話株式会社 記憶素子
KR100917649B1 (ko) * 2007-11-12 2009-09-17 주식회사 이오테크닉스 플렉시블 기판의 평탄화 방법 및 평탄화 장치
WO2010089234A1 (en) * 2009-02-03 2010-08-12 Oce-Technologies B.V. A print head and a method for measuring on the print head
US7938016B2 (en) * 2009-03-20 2011-05-10 Freescale Semiconductor, Inc. Multiple layer strain gauge
KR101656915B1 (ko) * 2010-05-27 2016-09-12 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 인쇄헤드와 그에 관련된 방법 및 시스템
GB201117343D0 (en) * 2011-10-07 2011-11-23 Airbus Uk Ltd Method and apparatus for measuring residual stresses in a component
DE102012208492A1 (de) * 2012-05-22 2013-11-28 Continental Teves Ag & Co. Ohg Dehnmessstreifenanordnung
US8857271B2 (en) * 2012-07-24 2014-10-14 The Boeing Company Wraparound strain gage assembly for brake rod
JP6987497B2 (ja) * 2016-01-08 2022-01-05 キヤノン株式会社 液体吐出モジュールおよび液体吐出ヘッド
WO2018199910A1 (en) * 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Fluid back pressure sensing with a strain sensor
CN110446612B (zh) * 2017-04-24 2020-10-16 惠普发展公司,有限责任合伙企业 包括应变计传感器的流体喷射管芯
WO2018199888A1 (en) * 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Fluid ejection dies including strain gauge sensors
EP3562678B1 (en) * 2017-04-24 2024-10-23 Hewlett-Packard Development Company, L.P. Fluid ejection dies including strain gauge sensors
CN107329615B (zh) * 2017-06-30 2020-06-16 上海天马微电子有限公司 显示面板及显示装置
EP3609710B1 (en) * 2017-07-18 2022-11-09 Hewlett-Packard Development Company, L.P. Dies including strain gauge sensors and temperature sensors
CN108731858B (zh) * 2018-06-01 2019-07-30 中国石油大学(华东) 一种mems压力传感器及其制作方法
CN113795386B (zh) * 2019-05-15 2023-09-01 惠普发展公司,有限责任合伙企业 包括应变仪传感器的集成电路
CZ308886B6 (cs) * 2019-10-11 2021-08-04 4Dot Mechatronic Systems S.R.O. Snímač přetvoření a sestava pro měření přetvoření obsahující tento snímač
US11630018B2 (en) * 2021-03-18 2023-04-18 Becs Technology, Inc. Calibrated load cell
EP4155488A1 (en) * 2021-09-23 2023-03-29 U-Shin Italia S.p.A. Detection device and detection system for activating at least on function of an apparatus, and apparatus comprising the detection system

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US4462018A (en) 1982-11-05 1984-07-24 Gulton Industries, Inc. Semiconductor strain gauge with integral compensation resistors
JPS59217375A (ja) 1983-05-26 1984-12-07 Toyota Central Res & Dev Lab Inc 半導体機械−電気変換装置
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Also Published As

Publication number Publication date
JP2004271527A (ja) 2004-09-30
TWI306831B (en) 2009-03-01
JP2008275630A (ja) 2008-11-13
TW200417503A (en) 2004-09-16
US6739199B1 (en) 2004-05-25
EP1457766A1 (en) 2004-09-15
KR101083903B1 (ko) 2011-11-15
KR20040081312A (ko) 2004-09-21
EP1457766B1 (en) 2013-05-08

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