JP2008275630A - 流体吐出素子 - Google Patents
流体吐出素子 Download PDFInfo
- Publication number
- JP2008275630A JP2008275630A JP2008132869A JP2008132869A JP2008275630A JP 2008275630 A JP2008275630 A JP 2008275630A JP 2008132869 A JP2008132869 A JP 2008132869A JP 2008132869 A JP2008132869 A JP 2008132869A JP 2008275630 A JP2008275630 A JP 2008275630A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- strain gauge
- strain
- fluid ejection
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
- G05F3/02—Regulating voltage or current
- G05F3/08—Regulating voltage or current wherein the variable is dc
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14153—Structures including a sensor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
- G01L1/2293—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges of the semi-conductor type
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0045—Converters combining the concepts of switch-mode regulation and linear regulation, e.g. linear pre-regulator to switching converter, linear and switching converter in parallel, same converter or same transistor operating either in linear or switching mode
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Micromachines (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
【解決手段】インクジェットプリンタヘッドアセンブリの流体吐出素子130は、液滴吐出素子131の配列を含み、その中を貫通して形成される少なくとも1つの開口部141、133を有する基板140、132と、当該基板上に形成される複数の液滴吐出素子131と、前記少なくとも1つの開口部に隣接して前記基板内に形成されるひずみゲージとを含む。
【選択図】図8
Description
ただし、Rはひずみゲージの抵抗を表し、pはひずみゲージ材料のバルク抵抗率を表し、Lはひずみゲージの実効長を表し、tはひずみゲージの厚みを表し、wはひずみゲージの幅を表す。
ただし、λは各脚部の長さを表し、Nは脚部の数を表す。したがって、必要なら、所与の抵抗(R)および幅(w)の場合に、ひずみゲージ30’の実効長(L)がサイズの制約を超えるときには、それぞれが長さλのN個の脚部に分割することができる。
ただし、Lは負荷までの支持されていない距離を表し、Xはひずみゲージ位置までの支持されていない距離を表し、tは基板の厚みを表し、Yは基板の変位を表す。その場合に、基板20の変位(Y)を変化させながら、基板20内のひずみが計算される。
Vr=[(Vout/Vin)ひずみ時−(Vout/Vin)ひずみなし時]
ただし、GFはひずみゲージのゲージ率を表し、vは基板の材料のポアソン比を表す。その場合に、正のひずみは基板20内の引張応力を表し、負のひずみは基板20内の圧縮応力を表す。温度に起因する抵抗変化が全てのひずみゲージ素子の場合に等しいので、ひずみ測定回路80のひずみ出力は必然的に温度補償される。
22 第1の表面
24 第2の表面
26 開口部
30 ひずみゲージ
40 礎材
50 誘電体層
52 誘電材料
62 導電材料
130 流体吐出素子
131 液滴吐出素子
132 薄膜構造
133 流体供給孔
134 発射抵抗
135 リード
136 オリフィス層
137 前面
138 ノズル開口部
139 ノズルチャンバ
140 基板
141 流体供給構造
Claims (6)
- 流体吐出素子であって、
その中を貫通して形成される少なくとも1つの開口部を有する基板と、
前記基板上に形成される複数の液滴吐出素子と、
前記少なくとも1つの開口部に隣接して前記基板内に形成されるひずみゲージとを含むことを特徴とする流体吐出素子。 - 前記ひずみゲージはポリシリコン材料を含むことを特徴とする請求項1に記載の流体吐出素子。
- 前記基板は、前記ひずみゲージ上に配置される誘電体材料と、該誘電体材料を貫通して前記ひずみゲージと導通する導電材料とを含むことを特徴とする請求項1に記載の流体吐出素子。
- 前記基板はさらに、礎材と、該礎材の第1の表面上に形成される誘電体層とを含み、前記ひずみゲージは前記誘電体層上に形成されることを特徴とする請求項3に記載の流体吐出素子。
- 前記少なくとも1つの開口部は、前記基板を貫通する流体通路を含むことを特徴とする請求項1に記載の流体吐出素子。
- 前記流体吐出素子はインクジェットプリントヘッドを含むことを特徴とする請求項1に記載の流体吐出素子。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/384,887 US6739199B1 (en) | 2003-03-10 | 2003-03-10 | Substrate and method of forming substrate for MEMS device with strain gage |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004065493A Division JP4146812B2 (ja) | 2003-03-10 | 2004-03-09 | Mems基板およびmems基板の形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008275630A true JP2008275630A (ja) | 2008-11-13 |
Family
ID=32312413
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004065493A Expired - Fee Related JP4146812B2 (ja) | 2003-03-10 | 2004-03-09 | Mems基板およびmems基板の形成方法 |
JP2008132869A Pending JP2008275630A (ja) | 2003-03-10 | 2008-05-21 | 流体吐出素子 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004065493A Expired - Fee Related JP4146812B2 (ja) | 2003-03-10 | 2004-03-09 | Mems基板およびmems基板の形成方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6739199B1 (ja) |
EP (1) | EP1457766B1 (ja) |
JP (2) | JP4146812B2 (ja) |
KR (1) | KR101083903B1 (ja) |
TW (1) | TWI306831B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013083647A (ja) * | 2011-10-07 | 2013-05-09 | Airbus Operations Ltd | コンポーネント内の残留応力を測定する方法及び装置 |
JP2017124614A (ja) * | 2016-01-08 | 2017-07-20 | キヤノン株式会社 | 液体吐出モジュールおよび液体吐出ヘッド |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004358799A (ja) * | 2003-06-04 | 2004-12-24 | Canon Inc | キャリッジ駆動制御方法 |
US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
WO2008048212A2 (en) * | 2005-07-07 | 2008-04-24 | The Regents Of The University Of California | Infrared sensor systems and devices |
CN101657747B (zh) * | 2006-12-05 | 2014-12-10 | 维斯普瑞公司 | 带有开槽金属的基板及相关方法 |
JP5026144B2 (ja) * | 2007-05-18 | 2012-09-12 | 日本電信電話株式会社 | 記憶素子 |
KR100917649B1 (ko) * | 2007-11-12 | 2009-09-17 | 주식회사 이오테크닉스 | 플렉시블 기판의 평탄화 방법 및 평탄화 장치 |
WO2010089234A1 (en) * | 2009-02-03 | 2010-08-12 | Oce-Technologies B.V. | A print head and a method for measuring on the print head |
US7938016B2 (en) * | 2009-03-20 | 2011-05-10 | Freescale Semiconductor, Inc. | Multiple layer strain gauge |
JP5632964B2 (ja) * | 2010-05-27 | 2014-11-26 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | プリントヘッド及び関連する方法及びシステム |
DE102012208492A1 (de) * | 2012-05-22 | 2013-11-28 | Continental Teves Ag & Co. Ohg | Dehnmessstreifenanordnung |
US8857271B2 (en) * | 2012-07-24 | 2014-10-14 | The Boeing Company | Wraparound strain gage assembly for brake rod |
US11135840B2 (en) | 2017-04-24 | 2021-10-05 | Hewlett-Packard Development Company, L.P. | Fluid ejection dies including strain gauge sensors |
WO2018199888A1 (en) * | 2017-04-24 | 2018-11-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection dies including strain gauge sensors |
WO2018199910A1 (en) * | 2017-04-24 | 2018-11-01 | Hewlett-Packard Development Company, L.P. | Fluid back pressure sensing with a strain sensor |
KR102271425B1 (ko) * | 2017-04-24 | 2021-06-30 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 스트레인 게이지 센서를 포함하는 유체 분사 다이 |
CN107329615B (zh) * | 2017-06-30 | 2020-06-16 | 上海天马微电子有限公司 | 显示面板及显示装置 |
WO2019017907A1 (en) | 2017-07-18 | 2019-01-24 | Hewlett-Packard Development Company, L.P. | CHIPS COMPRISING STRAIN GAUGE SENSORS AND TEMPERATURE SENSORS |
CN108731858B (zh) * | 2018-06-01 | 2019-07-30 | 中国石油大学(华东) | 一种mems压力传感器及其制作方法 |
EP3969287A1 (en) * | 2019-05-15 | 2022-03-23 | Hewlett-Packard Development Company, L.P. | Integrated circuits including strain gauge sensors |
CZ308886B6 (cs) * | 2019-10-11 | 2021-08-04 | 4Dot Mechatronic Systems S.R.O. | Snímač přetvoření a sestava pro měření přetvoření obsahující tento snímač |
US11630018B2 (en) * | 2021-03-18 | 2023-04-18 | Becs Technology, Inc. | Calibrated load cell |
EP4155488A1 (en) * | 2021-09-23 | 2023-03-29 | U-Shin Italia S.p.A. | Detection device and detection system for activating at least on function of an apparatus, and apparatus comprising the detection system |
Citations (5)
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JPS6276783A (ja) * | 1985-09-30 | 1987-04-08 | Toyota Central Res & Dev Lab Inc | 半導体圧力センサ及びその製造方法 |
JPH03111729A (ja) * | 1989-09-26 | 1991-05-13 | Matsushita Electric Works Ltd | 圧力測定装置 |
JPH11129472A (ja) * | 1997-10-31 | 1999-05-18 | Seiko Epson Corp | インクジェットヘッド、インクエンド検出器、インクジェット記録装置及びその制御方法 |
JP2001138519A (ja) * | 1999-11-10 | 2001-05-22 | Casio Comput Co Ltd | インクジェットプリンタヘッド |
US6398329B1 (en) * | 2000-11-13 | 2002-06-04 | Hewlett-Packard Company | Thermal inkjet pen having a backpressure sensor |
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2003
- 2003-03-10 US US10/384,887 patent/US6739199B1/en not_active Expired - Lifetime
- 2003-09-25 TW TW092126532A patent/TWI306831B/zh not_active IP Right Cessation
-
2004
- 2004-03-09 KR KR1020040015821A patent/KR101083903B1/ko active IP Right Grant
- 2004-03-09 JP JP2004065493A patent/JP4146812B2/ja not_active Expired - Fee Related
- 2004-03-09 EP EP04251352.3A patent/EP1457766B1/en not_active Expired - Fee Related
-
2008
- 2008-05-21 JP JP2008132869A patent/JP2008275630A/ja active Pending
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JPS6276783A (ja) * | 1985-09-30 | 1987-04-08 | Toyota Central Res & Dev Lab Inc | 半導体圧力センサ及びその製造方法 |
JPH03111729A (ja) * | 1989-09-26 | 1991-05-13 | Matsushita Electric Works Ltd | 圧力測定装置 |
JPH11129472A (ja) * | 1997-10-31 | 1999-05-18 | Seiko Epson Corp | インクジェットヘッド、インクエンド検出器、インクジェット記録装置及びその制御方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013083647A (ja) * | 2011-10-07 | 2013-05-09 | Airbus Operations Ltd | コンポーネント内の残留応力を測定する方法及び装置 |
JP2017124614A (ja) * | 2016-01-08 | 2017-07-20 | キヤノン株式会社 | 液体吐出モジュールおよび液体吐出ヘッド |
Also Published As
Publication number | Publication date |
---|---|
TWI306831B (en) | 2009-03-01 |
EP1457766A1 (en) | 2004-09-15 |
EP1457766B1 (en) | 2013-05-08 |
US6739199B1 (en) | 2004-05-25 |
JP4146812B2 (ja) | 2008-09-10 |
JP2004271527A (ja) | 2004-09-30 |
TW200417503A (en) | 2004-09-16 |
KR101083903B1 (ko) | 2011-11-15 |
KR20040081312A (ko) | 2004-09-21 |
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