JP4146709B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP4146709B2 JP4146709B2 JP2002317607A JP2002317607A JP4146709B2 JP 4146709 B2 JP4146709 B2 JP 4146709B2 JP 2002317607 A JP2002317607 A JP 2002317607A JP 2002317607 A JP2002317607 A JP 2002317607A JP 4146709 B2 JP4146709 B2 JP 4146709B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- guard
- processing liquid
- guide
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims description 228
- 238000012545 processing Methods 0.000 title claims description 136
- 239000007788 liquid Substances 0.000 claims description 154
- 239000000126 substance Substances 0.000 claims description 97
- 238000011084 recovery Methods 0.000 claims description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 38
- 230000003028 elevating effect Effects 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 description 45
- 239000000243 solution Substances 0.000 description 39
- 239000007789 gas Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 19
- 230000000903 blocking effect Effects 0.000 description 14
- 238000005530 etching Methods 0.000 description 12
- 238000005192 partition Methods 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000008155 medical solution Substances 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002317607A JP4146709B2 (ja) | 2002-10-31 | 2002-10-31 | 基板処理装置 |
| US10/659,213 US7584760B2 (en) | 2002-09-13 | 2003-09-10 | Substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002317607A JP4146709B2 (ja) | 2002-10-31 | 2002-10-31 | 基板処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005312259A Division JP4272650B2 (ja) | 2005-10-27 | 2005-10-27 | 基板処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004153078A JP2004153078A (ja) | 2004-05-27 |
| JP2004153078A5 JP2004153078A5 (enExample) | 2005-12-15 |
| JP4146709B2 true JP4146709B2 (ja) | 2008-09-10 |
Family
ID=32460959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002317607A Expired - Fee Related JP4146709B2 (ja) | 2002-09-13 | 2002-10-31 | 基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4146709B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4488506B2 (ja) | 2004-08-30 | 2010-06-23 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| KR100752246B1 (ko) | 2005-03-31 | 2007-08-29 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판처리방법 |
| WO2006107549A1 (en) | 2005-04-01 | 2006-10-12 | Fsi International, Inc. | Compact duct system incorporating moveable and nestable baffles for use in tools used to process microelectronic workpieces with one or more treatment fluids |
| KR100637719B1 (ko) | 2005-10-05 | 2006-10-25 | 세메스 주식회사 | 기판 처리 장치 |
| CN104319249B (zh) | 2006-07-07 | 2017-11-07 | Tel Fsi股份有限公司 | 用于处理微电子工件的设备 |
| KR100872877B1 (ko) | 2007-03-06 | 2008-12-10 | 세메스 주식회사 | 기판 처리 장치 |
| KR101060664B1 (ko) | 2007-08-07 | 2011-08-31 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리유체로 전자소자를 처리하는 장비의 배리어 판 및 벤튜리 시스템의 세정방법 및 관련 장치 |
| KR101652270B1 (ko) | 2008-05-09 | 2016-08-30 | 티이엘 에프에스아이, 인코포레이티드 | 개방 동작 모드와 폐쇄 동작 모드사이를 용이하게 변경하는 처리실 설계를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는 장치 및 방법 |
| KR101004432B1 (ko) * | 2008-06-10 | 2010-12-28 | 세메스 주식회사 | 매엽식 기판 처리 장치 |
| DE202010015018U1 (de) * | 2010-11-07 | 2011-04-14 | Bohnet, Hans | Anordnung zur Herstellung von strukturierten Substraten |
| JP6713893B2 (ja) * | 2016-09-26 | 2020-06-24 | 株式会社Screenホールディングス | 基板処理装置 |
| CN112936091A (zh) * | 2021-02-09 | 2021-06-11 | 华海清科(北京)科技有限公司 | 一种抛光液防溅装置、化学机械抛光系统及抛光方法 |
| CN116766046B (zh) * | 2023-08-04 | 2025-08-01 | 上海集成电路装备材料产业创新中心有限公司 | 一种升降挡圈及同心校准方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3731995B2 (ja) * | 1997-12-04 | 2006-01-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3929192B2 (ja) * | 1998-12-21 | 2007-06-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP3752136B2 (ja) * | 2000-08-14 | 2006-03-08 | 東京エレクトロン株式会社 | 現像処理装置および現像処理方法 |
| JP2002282764A (ja) * | 2001-03-27 | 2002-10-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP4078163B2 (ja) * | 2002-09-13 | 2008-04-23 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2002
- 2002-10-31 JP JP2002317607A patent/JP4146709B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004153078A (ja) | 2004-05-27 |
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