JP4096990B2 - セラミック多層基板およびその製造方法 - Google Patents

セラミック多層基板およびその製造方法 Download PDF

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Publication number
JP4096990B2
JP4096990B2 JP2006552410A JP2006552410A JP4096990B2 JP 4096990 B2 JP4096990 B2 JP 4096990B2 JP 2006552410 A JP2006552410 A JP 2006552410A JP 2006552410 A JP2006552410 A JP 2006552410A JP 4096990 B2 JP4096990 B2 JP 4096990B2
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JP
Japan
Prior art keywords
ceramic
layer
ceramic green
conductive paste
multilayer substrate
Prior art date
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Active
Application number
JP2006552410A
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English (en)
Japanese (ja)
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JPWO2007032167A1 (ja
Inventor
正人 野宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
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Publication of JP4096990B2 publication Critical patent/JP4096990B2/ja
Publication of JPWO2007032167A1 publication Critical patent/JPWO2007032167A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0269—Non-uniform distribution or concentration of particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
JP2006552410A 2005-09-16 2006-08-11 セラミック多層基板およびその製造方法 Active JP4096990B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005270703 2005-09-16
JP2005270703 2005-09-16
PCT/JP2006/315927 WO2007032167A1 (ja) 2005-09-16 2006-08-11 セラミック多層基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP4096990B2 true JP4096990B2 (ja) 2008-06-04
JPWO2007032167A1 JPWO2007032167A1 (ja) 2009-03-19

Family

ID=37864765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006552410A Active JP4096990B2 (ja) 2005-09-16 2006-08-11 セラミック多層基板およびその製造方法

Country Status (6)

Country Link
US (1) US7691469B2 (zh)
JP (1) JP4096990B2 (zh)
CN (1) CN101268725B (zh)
DE (1) DE112006002451B4 (zh)
TW (1) TW200714163A (zh)
WO (1) WO2007032167A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101836511B (zh) * 2007-10-26 2013-04-03 纳幕尔杜邦公司 非对称的介电薄膜
KR100896601B1 (ko) * 2007-11-05 2009-05-08 삼성전기주식회사 무수축 세라믹 기판의 제조방법 및 이를 이용한 무수축세라믹 기판
TW201037803A (en) * 2009-04-13 2010-10-16 High Conduction Scient Co Ltd Multi-layer packaging substrate, method for making the packaging substrate, and package structure of light-emitting semiconductor
JP5644945B2 (ja) * 2011-06-29 2014-12-24 株式会社村田製作所 多層セラミック基板およびその製造方法
EP2738799A4 (en) * 2011-07-29 2015-06-17 Ngk Insulators Ltd MULTI-LAYER FRITTED CERAMIC PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR ASSEMBLY COMPRISING THE PRINTED CIRCUIT BOARD
JP6065355B2 (ja) * 2011-09-20 2017-01-25 株式会社村田製作所 多層セラミック基板およびその製造方法
WO2013089128A1 (ja) * 2011-12-16 2013-06-20 株式会社村田製作所 導電性組成物、多層セラミック基板およびその製造方法
US20130229777A1 (en) * 2012-03-01 2013-09-05 Infineon Technologies Ag Chip arrangements and methods for forming a chip arrangement
WO2014104035A1 (ja) * 2012-12-27 2014-07-03 富士フイルム株式会社 反射基板
JP5941588B2 (ja) * 2014-09-01 2016-06-29 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
JP2017050391A (ja) * 2015-09-01 2017-03-09 株式会社デンソー 多層基板およびその製造方法
WO2017047647A1 (ja) * 2015-09-18 2017-03-23 株式会社村田製作所 セラミック多層基板
JP2017220525A (ja) * 2016-06-06 2017-12-14 株式会社村田製作所 積層セラミック電子部品
JP2017220522A (ja) * 2016-06-06 2017-12-14 株式会社村田製作所 積層セラミック電子部品
WO2018037842A1 (ja) 2016-08-22 2018-03-01 株式会社村田製作所 セラミック基板及び電子部品内蔵モジュール
US11667585B2 (en) 2018-09-19 2023-06-06 Apple, Inc. Ceramic substrate with glass fill for decoration and housing materials
KR102211998B1 (ko) * 2019-04-10 2021-02-04 주식회사 디아이티 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868034A (en) 1988-02-11 1989-09-19 Heraeus Incorporated Cermalloy Division Non-oxidizing copper thick film conductors
US5130280A (en) * 1988-10-14 1992-07-14 Raychem Corporation Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same
US5188886A (en) * 1988-10-14 1993-02-23 Raychem Corporation Metal oxide dielectric dense bodies, precursor powders therefor, and methods for preparing same
JPH05242724A (ja) * 1992-02-27 1993-09-21 Taiyo Yuden Co Ltd 導電性ペースト
JPH06204512A (ja) 1993-01-07 1994-07-22 Dai Ichi Kogyo Seiyaku Co Ltd 半導体基板用電極ペースト
TW341022B (en) * 1995-11-29 1998-09-21 Nippon Electric Co Interconnection structures and method of making same
JPH09241862A (ja) 1996-03-01 1997-09-16 Murata Mfg Co Ltd 銅粉末及び銅ペースト並びにセラミック電子部品
JPH109226A (ja) 1996-06-21 1998-01-13 Suzuki Motor Corp 板金製クランプ
JPH1092226A (ja) 1996-09-11 1998-04-10 Murata Mfg Co Ltd 導電性組成物
JPH10242644A (ja) 1997-02-26 1998-09-11 Hitachi Ltd 導体回路付グリーンシートおよびその製造法並びにこれを用いた多層配線セラミック基板
JP3656484B2 (ja) 1999-03-03 2005-06-08 株式会社村田製作所 セラミック多層基板の製造方法
JP2002095244A (ja) 2000-09-18 2002-03-29 Toshiba Corp レギュレータ回路
JP3669255B2 (ja) * 2000-09-19 2005-07-06 株式会社村田製作所 セラミック多層基板の製造方法および未焼成セラミック積層体

Also Published As

Publication number Publication date
TWI331890B (zh) 2010-10-11
TW200714163A (en) 2007-04-01
DE112006002451T5 (de) 2008-07-10
WO2007032167A1 (ja) 2007-03-22
CN101268725B (zh) 2012-07-18
DE112006002451B4 (de) 2016-08-18
JPWO2007032167A1 (ja) 2009-03-19
US7691469B2 (en) 2010-04-06
CN101268725A (zh) 2008-09-17
US20080156413A1 (en) 2008-07-03

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