JP4084569B2 - 銅または銅合金の非電気的錫めっき方法 - Google Patents

銅または銅合金の非電気的錫めっき方法 Download PDF

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Publication number
JP4084569B2
JP4084569B2 JP2001536299A JP2001536299A JP4084569B2 JP 4084569 B2 JP4084569 B2 JP 4084569B2 JP 2001536299 A JP2001536299 A JP 2001536299A JP 2001536299 A JP2001536299 A JP 2001536299A JP 4084569 B2 JP4084569 B2 JP 4084569B2
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Japan
Prior art keywords
tin
bath
copper
liter
concentration
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Expired - Lifetime
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JP2001536299A
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English (en)
Japanese (ja)
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JP2003514120A5 (zh
JP2003514120A (ja
Inventor
ベル，ジェーン
ヘイヤー，ヨーアヒム
ユーペ，ユルゲン
カルカー，インゴ
クラインフェルト，マルリース
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エントン インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2001536299A 1999-11-12 2000-11-09 銅または銅合金の非電気的錫めっき方法 Expired - Lifetime JP4084569B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19954613.4 1999-11-12
DE19954613A DE19954613A1 (de) 1999-11-12 1999-11-12 Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
PCT/US2000/030983 WO2001034310A1 (en) 1999-11-12 2000-11-09 Process for the non-galvanic tin plating of copper or copper alloys

Publications (3)

Publication Number Publication Date
JP2003514120A JP2003514120A (ja) 2003-04-15
JP2003514120A5 JP2003514120A5 (zh) 2005-12-22
JP4084569B2 true JP4084569B2 (ja) 2008-04-30

Family

ID=7928903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001536299A Expired - Lifetime JP4084569B2 (ja) 1999-11-12 2000-11-09 銅または銅合金の非電気的錫めっき方法

Country Status (7)

Country Link
EP (1) EP1230034B1 (zh)
JP (1) JP4084569B2 (zh)
CN (1) CN1192125C (zh)
AT (1) ATE480340T1 (zh)
AU (1) AU1597501A (zh)
DE (2) DE19954613A1 (zh)
WO (1) WO2001034310A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4998704B2 (ja) 2007-01-22 2012-08-15 上村工業株式会社 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010031181A1 (de) * 2010-07-09 2012-01-12 Atotech Deutschland Gmbh Verfahren und Anordnung zum Abscheiden einer Metallschicht
JP5715411B2 (ja) * 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5830242B2 (ja) * 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
JP5937320B2 (ja) * 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 めっき液中から不純物を除去する方法
MA37931A1 (fr) * 2012-08-13 2016-07-29 Teni Boulikas Procédés améliorés permettant de traiter un cancer avec une toxicité rénale réduite

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5160422A (en) * 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
JP2833026B2 (ja) 1989-07-05 1998-12-09 上村工業株式会社 無電解錫めっき方法
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5217751A (en) * 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3274232B2 (ja) * 1993-06-01 2002-04-15 ディップソール株式会社 錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP3419995B2 (ja) 1996-05-10 2003-06-23 株式会社大和化成研究所 無電解錫−銀合金めっき浴
JP3660777B2 (ja) * 1997-03-06 2005-06-15 日本エレクトロプレイテイング・エンジニヤース株式会社 錫合金膜の形成方法およびその錫合金めっき浴

Also Published As

Publication number Publication date
ATE480340T1 (de) 2010-09-15
AU1597501A (en) 2001-06-06
CN1192125C (zh) 2005-03-09
EP1230034B1 (en) 2010-09-08
EP1230034A1 (en) 2002-08-14
DE19954613A1 (de) 2001-05-17
JP2003514120A (ja) 2003-04-15
WO2001034310A1 (en) 2001-05-17
DE60044943D1 (de) 2010-10-21
EP1230034A4 (en) 2003-01-08
CN1387465A (zh) 2002-12-25

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