JP4041831B2 - 基板検査用治具及びこの治具における接続電極部の電極構造 - Google Patents

基板検査用治具及びこの治具における接続電極部の電極構造 Download PDF

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Publication number
JP4041831B2
JP4041831B2 JP2006135867A JP2006135867A JP4041831B2 JP 4041831 B2 JP4041831 B2 JP 4041831B2 JP 2006135867 A JP2006135867 A JP 2006135867A JP 2006135867 A JP2006135867 A JP 2006135867A JP 4041831 B2 JP4041831 B2 JP 4041831B2
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JP
Japan
Prior art keywords
contact
connection electrode
substrate inspection
holding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006135867A
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English (en)
Japanese (ja)
Other versions
JP2007309648A (ja
Inventor
清 沼田
穣 加藤
正美 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2006135867A priority Critical patent/JP4041831B2/ja
Priority to KR1020087027510A priority patent/KR101021744B1/ko
Priority to PCT/JP2007/059685 priority patent/WO2007132739A1/fr
Priority to CN2007800174904A priority patent/CN101443669B/zh
Priority to TW096117254A priority patent/TWI442070B/zh
Publication of JP2007309648A publication Critical patent/JP2007309648A/ja
Application granted granted Critical
Publication of JP4041831B2 publication Critical patent/JP4041831B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2006135867A 2006-05-15 2006-05-15 基板検査用治具及びこの治具における接続電極部の電極構造 Expired - Fee Related JP4041831B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006135867A JP4041831B2 (ja) 2006-05-15 2006-05-15 基板検査用治具及びこの治具における接続電極部の電極構造
KR1020087027510A KR101021744B1 (ko) 2006-05-15 2007-05-10 기판검사용 지그 및 이 지그에 있어서의 접속전극부의 전극구조
PCT/JP2007/059685 WO2007132739A1 (fr) 2006-05-15 2007-05-10 Gabarit d'inspection de substrat et structure d'électrode d'une unité d'électrode de connexion dans le gabarit
CN2007800174904A CN101443669B (zh) 2006-05-15 2007-05-10 基板检查用夹具及其中的连接电极部的电极结构
TW096117254A TWI442070B (zh) 2006-05-15 2007-05-15 A substrate inspection jig and an electrode structure of the connecting electrode portion of the jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006135867A JP4041831B2 (ja) 2006-05-15 2006-05-15 基板検査用治具及びこの治具における接続電極部の電極構造

Publications (2)

Publication Number Publication Date
JP2007309648A JP2007309648A (ja) 2007-11-29
JP4041831B2 true JP4041831B2 (ja) 2008-02-06

Family

ID=38693833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006135867A Expired - Fee Related JP4041831B2 (ja) 2006-05-15 2006-05-15 基板検査用治具及びこの治具における接続電極部の電極構造

Country Status (5)

Country Link
JP (1) JP4041831B2 (fr)
KR (1) KR101021744B1 (fr)
CN (1) CN101443669B (fr)
TW (1) TWI442070B (fr)
WO (1) WO2007132739A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009250917A (ja) * 2008-04-10 2009-10-29 Nidec-Read Corp 基板検査用治具及び検査用接触子
JP5504698B2 (ja) * 2009-06-02 2014-05-28 日本電産リード株式会社 検査用治具及び検査用接触子
WO2012108066A1 (fr) * 2011-02-10 2012-08-16 日本電産リード株式会社 Montage d'essais
JP2013100994A (ja) * 2011-11-07 2013-05-23 Nidec-Read Corp 基板検査治具、治具ベースユニット及び基板検査装置
JP5986397B2 (ja) * 2012-02-28 2016-09-06 日本電産リード株式会社 検査用治具
JP2013257195A (ja) * 2012-06-12 2013-12-26 Nidec-Read Corp 基板検査治具及び基板検査装置
JP6221358B2 (ja) * 2013-06-04 2017-11-01 日本電産リード株式会社 基板検査方法、及び基板検査装置
JP6283929B2 (ja) * 2013-10-08 2018-02-28 日本電産リード株式会社 検査用治具及び検査用治具の製造方法
CN105510758A (zh) * 2015-11-27 2016-04-20 湖北三江航天红峰控制有限公司 一种用于低电阻导通的设备
KR101656047B1 (ko) 2016-03-23 2016-09-09 주식회사 나노시스 기판 검사용 지그
CN114325296A (zh) 2020-09-30 2022-04-12 揖斐电株式会社 导通检查用治具和印刷布线板的检查方法
KR102245761B1 (ko) * 2021-01-13 2021-04-28 엘엠디지털 주식회사 멀티 그리드 베이스가 구비된 인쇄회로기판 검사용 지그
KR102649845B1 (ko) * 2023-11-29 2024-03-21 주식회사 나노시스 반도체 소자 테스터 지그

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065639Y2 (ja) * 1986-03-20 1994-02-09 松下電器産業株式会社 コンタクトピン
JPH0656401B2 (ja) * 1986-12-19 1994-07-27 東京エレクトロン株式会社 検査装置
TW392074B (en) * 1997-11-05 2000-06-01 Feinmetall Gmbh Test head for microstructures with interface
JP2001133483A (ja) * 1999-11-04 2001-05-18 Takashi Nansai Ｗストロークプリント基板検査機用治具
JP3899075B2 (ja) * 2002-03-05 2007-03-28 リカ デンシ アメリカ， インコーポレイテッド 電子パッケージと試験機器をインターフェースするための装置
CN1482468A (zh) * 2002-09-13 2004-03-17 中芯国际集成电路制造（上海）有限公 检测探针接触电阻的测试结构与方法

Also Published As

Publication number Publication date
KR20080112365A (ko) 2008-12-24
KR101021744B1 (ko) 2011-03-15
CN101443669B (zh) 2012-01-25
TW200815776A (en) 2008-04-01
JP2007309648A (ja) 2007-11-29
WO2007132739A1 (fr) 2007-11-22
CN101443669A (zh) 2009-05-27
TWI442070B (zh) 2014-06-21

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