JP4038133B2 - 基板貼り合わせ装置及び方法並びに基板検出装置 - Google Patents

基板貼り合わせ装置及び方法並びに基板検出装置 Download PDF

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Publication number
JP4038133B2
JP4038133B2 JP2003025222A JP2003025222A JP4038133B2 JP 4038133 B2 JP4038133 B2 JP 4038133B2 JP 2003025222 A JP2003025222 A JP 2003025222A JP 2003025222 A JP2003025222 A JP 2003025222A JP 4038133 B2 JP4038133 B2 JP 4038133B2
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Japan
Prior art keywords
substrate
imaging device
position detection
substrates
coincidence
Prior art date
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Expired - Fee Related
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JP2003025222A
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English (en)
Japanese (ja)
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JP2003322834A5 (enExample
JP2003322834A (ja
Inventor
眞一 荻本
浩一 増田
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2003025222A priority Critical patent/JP4038133B2/ja
Priority to US10/372,453 priority patent/US20030159769A1/en
Priority to TW092104096A priority patent/TWI320494B/zh
Priority to KR1020030011891A priority patent/KR100706460B1/ko
Priority to CNB031070027A priority patent/CN1282007C/zh
Publication of JP2003322834A publication Critical patent/JP2003322834A/ja
Publication of JP2003322834A5 publication Critical patent/JP2003322834A5/ja
Application granted granted Critical
Publication of JP4038133B2 publication Critical patent/JP4038133B2/ja
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    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H1/00—Tops
    • A63H1/02—Tops with detachable winding devices
    • A63H1/04—Tops with detachable winding devices with string or band winding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F9/00—Games not otherwise provided for
    • A63F9/16—Spinning-top games
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H29/00—Drive mechanisms for toys in general
    • A63H29/22—Electric drives
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H30/00—Remote-control arrangements specially adapted for toys, e.g. for toy vehicles
    • A63H30/02—Electrical arrangements
    • A63H30/04—Electrical arrangements using wireless transmission
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/42—Toy models or toy scenery not otherwise covered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/70—Automated, e.g. using a computer or microcomputer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Multimedia (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003025222A 2002-02-28 2003-01-31 基板貼り合わせ装置及び方法並びに基板検出装置 Expired - Fee Related JP4038133B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003025222A JP4038133B2 (ja) 2002-02-28 2003-01-31 基板貼り合わせ装置及び方法並びに基板検出装置
US10/372,453 US20030159769A1 (en) 2002-02-28 2003-02-24 Substrate laminating apparatus and method thereof and substrate detecting apparatus
TW092104096A TWI320494B (en) 2002-02-28 2003-02-26 Substrate laminating apparatus and method thereof and substrate detecting apparatus
KR1020030011891A KR100706460B1 (ko) 2002-02-28 2003-02-26 기판 맞붙임장치 및 방법 및 기판 검출장치
CNB031070027A CN1282007C (zh) 2002-02-28 2003-02-28 基板贴合装置及其方法以及基板检测装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-55064 2002-02-28
JP2002055064 2002-02-28
JP2003025222A JP4038133B2 (ja) 2002-02-28 2003-01-31 基板貼り合わせ装置及び方法並びに基板検出装置

Publications (3)

Publication Number Publication Date
JP2003322834A JP2003322834A (ja) 2003-11-14
JP2003322834A5 JP2003322834A5 (enExample) 2005-08-04
JP4038133B2 true JP4038133B2 (ja) 2008-01-23

Family

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Family Applications (1)

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JP2003025222A Expired - Fee Related JP4038133B2 (ja) 2002-02-28 2003-01-31 基板貼り合わせ装置及び方法並びに基板検出装置

Country Status (5)

Country Link
US (1) US20030159769A1 (enExample)
JP (1) JP4038133B2 (enExample)
KR (1) KR100706460B1 (enExample)
CN (1) CN1282007C (enExample)
TW (1) TWI320494B (enExample)

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KR100586787B1 (ko) * 2002-12-04 2006-06-08 시바우라 메카트로닉스 가부시키가이샤 기판 접합 장치 및 방법
JP4585206B2 (ja) * 2003-03-04 2010-11-24 芝浦メカトロニクス株式会社 基板の貼り合わせ方法及び貼り合わせ装置
ATE476386T1 (de) * 2004-06-03 2010-08-15 Oerlikon Solar Ip Ag Truebbach Tisch zur aufnahme eines werkstücks sowie verfahren zur bearbeitung eines werkstücks auf einem solchen
JP2007101905A (ja) * 2005-10-04 2007-04-19 Shibaura Mechatronics Corp 基板検出装置及び基板検出方法、並びに、これらの基板検出装置及び基板検出方法を用いた基板貼り合わせ装置及び基板貼り合わせ方法
JP4941305B2 (ja) * 2005-10-12 2012-05-30 株式会社村田製作所 接合装置
JP4941307B2 (ja) 2005-12-12 2012-05-30 株式会社村田製作所 位置合わせ装置、接合装置及び位置合わせ方法
JP4361538B2 (ja) * 2006-02-16 2009-11-11 株式会社フューチャービジョン ガラス基板の除電方法
CN100495149C (zh) * 2006-08-17 2009-06-03 株式会社爱发科 贴合方法及贴合基板制造装置
CN101925794B (zh) * 2008-01-25 2012-08-22 松下电器产业株式会社 检查装置以及检查方法
CN101957514B (zh) * 2010-08-30 2012-01-18 华映视讯（吴江）有限公司 面板组合对位系统及其对位方法
CN102673090B (zh) * 2011-03-18 2015-01-14 宸鸿科技(厦门)有限公司 多层板贴合装置及其方法
JP5791101B2 (ja) * 2011-05-16 2015-10-07 芝浦メカトロニクス株式会社 貼り合せ板状体検査装置及び方法
JP5411905B2 (ja) * 2011-09-30 2014-02-12 オリジン電気株式会社 接合部材の製造装置及び接合部材の製造方法
TWI454794B (zh) * 2011-11-11 2014-10-01 Efun Technology Co Ltd Film machine
CN102555408A (zh) * 2012-02-09 2012-07-11 华映视讯（吴江）有限公司 适用于液晶显示面板的贴合装置
JP2013218198A (ja) * 2012-04-11 2013-10-24 Hitachi High-Technologies Corp 基板貼り合わせ装置
CN102673095B (zh) * 2012-06-01 2014-09-03 深圳市华星光电技术有限公司 全世代适用的真空贴合机及其工作方法
JP5852244B2 (ja) * 2012-07-30 2016-02-03 芝浦メカトロニクス株式会社 基板貼合装置及び基板貼合方法
CN102902102B (zh) * 2012-10-30 2015-08-19 东莞市凯博美光电科技股份有限公司 裸眼3d显示屏中3d光栅的贴合方法及裸眼3d显示屏
CN102998833B (zh) * 2012-12-14 2015-05-13 京东方科技集团股份有限公司 阵列基板与彩膜基板成盒对位的方法
CN104411789B (zh) * 2013-01-30 2016-11-09 欧利生电气株式会社 构件粘贴装置
JP6100570B2 (ja) * 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法
JP6100571B2 (ja) 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法
JP6311967B2 (ja) 2014-03-06 2018-04-18 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 基板貼り合せ装置及び基板貼り合せ方法
CN105511126B (zh) * 2016-01-21 2018-11-13 京东方科技集团股份有限公司 显示面板及其制备方法和检测方法
CN107238957A (zh) * 2017-08-02 2017-10-10 业成科技（成都）有限公司 贴合设备及其贴合方法
CN109473365A (zh) * 2017-09-08 2019-03-15 李亚玲 Cvd沉膜偏移制程异常的测量与监控方法
CN107639921A (zh) * 2017-09-21 2018-01-30 歌尔股份有限公司 贴合装置
CN110632775A (zh) * 2019-09-05 2019-12-31 东莞通华液晶有限公司 一种叠合玻璃基板的对版方法
CN111524449B (zh) * 2020-04-28 2022-03-29 昆山国显光电有限公司 贴合设备校正装置及方法、显示面板贴合设备及方法
KR102840203B1 (ko) * 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
CN115732355A (zh) * 2021-08-31 2023-03-03 上海微电子装备（集团）股份有限公司 一种基片贴合设备及基片贴合方法
CN114454591B (zh) * 2022-02-09 2024-08-13 创维集团智能装备有限公司 面板贴合方法、装置、电子设备及可读存储介质

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JP3658110B2 (ja) * 1995-11-27 2005-06-08 キヤノン株式会社 画像表示装置のための製造方法及び製造装置
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Also Published As

Publication number Publication date
TWI320494B (en) 2010-02-11
KR100706460B1 (ko) 2007-04-10
US20030159769A1 (en) 2003-08-28
KR20030071519A (ko) 2003-09-03
TW200304016A (en) 2003-09-16
CN1282007C (zh) 2006-10-25
JP2003322834A (ja) 2003-11-14
CN1441294A (zh) 2003-09-10

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