TWI320494B - Substrate laminating apparatus and method thereof and substrate detecting apparatus - Google Patents

Substrate laminating apparatus and method thereof and substrate detecting apparatus

Info

Publication number
TWI320494B
TWI320494B TW092104096A TW92104096A TWI320494B TW I320494 B TWI320494 B TW I320494B TW 092104096 A TW092104096 A TW 092104096A TW 92104096 A TW92104096 A TW 92104096A TW I320494 B TWI320494 B TW I320494B
Authority
TW
Taiwan
Prior art keywords
substrate
detecting apparatus
laminating apparatus
laminating
substrate detecting
Prior art date
Application number
TW092104096A
Other languages
English (en)
Chinese (zh)
Other versions
TW200304016A (en
Inventor
Ogimoto Shinichi
Masuda Hirokazu
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200304016A publication Critical patent/TW200304016A/zh
Application granted granted Critical
Publication of TWI320494B publication Critical patent/TWI320494B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H1/00—Tops
    • A63H1/02—Tops with detachable winding devices
    • A63H1/04—Tops with detachable winding devices with string or band winding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F9/00—Games not otherwise provided for
    • A63F9/16—Spinning-top games
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H29/00—Drive mechanisms for toys in general
    • A63H29/22—Electric drives
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H30/00—Remote-control arrangements specially adapted for toys, e.g. for toy vehicles
    • A63H30/02—Electrical arrangements
    • A63H30/04—Electrical arrangements using wireless transmission
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H33/00—Other toys
    • A63H33/42—Toy models or toy scenery not otherwise covered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/70—Automated, e.g. using a computer or microcomputer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Multimedia (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW092104096A 2002-02-28 2003-02-26 Substrate laminating apparatus and method thereof and substrate detecting apparatus TWI320494B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002055064 2002-02-28
JP2003025222A JP4038133B2 (ja) 2002-02-28 2003-01-31 基板貼り合わせ装置及び方法並びに基板検出装置

Publications (2)

Publication Number Publication Date
TW200304016A TW200304016A (en) 2003-09-16
TWI320494B true TWI320494B (en) 2010-02-11

Family

ID=27759722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104096A TWI320494B (en) 2002-02-28 2003-02-26 Substrate laminating apparatus and method thereof and substrate detecting apparatus

Country Status (5)

Country Link
US (1) US20030159769A1 (enExample)
JP (1) JP4038133B2 (enExample)
KR (1) KR100706460B1 (enExample)
CN (1) CN1282007C (enExample)
TW (1) TWI320494B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588022B (zh) * 2013-03-22 2017-06-21 Toshiba Kk A manufacturing apparatus of a display apparatus, and a manufacturing method of the display apparatus

Families Citing this family (32)

* Cited by examiner, † Cited by third party
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KR100586787B1 (ko) * 2002-12-04 2006-06-08 시바우라 메카트로닉스 가부시키가이샤 기판 접합 장치 및 방법
JP4585206B2 (ja) * 2003-03-04 2010-11-24 芝浦メカトロニクス株式会社 基板の貼り合わせ方法及び貼り合わせ装置
ATE476386T1 (de) * 2004-06-03 2010-08-15 Oerlikon Solar Ip Ag Truebbach Tisch zur aufnahme eines werkstücks sowie verfahren zur bearbeitung eines werkstücks auf einem solchen
JP2007101905A (ja) * 2005-10-04 2007-04-19 Shibaura Mechatronics Corp 基板検出装置及び基板検出方法、並びに、これらの基板検出装置及び基板検出方法を用いた基板貼り合わせ装置及び基板貼り合わせ方法
JP4941305B2 (ja) * 2005-10-12 2012-05-30 株式会社村田製作所 接合装置
JP4941307B2 (ja) 2005-12-12 2012-05-30 株式会社村田製作所 位置合わせ装置、接合装置及び位置合わせ方法
JP4361538B2 (ja) * 2006-02-16 2009-11-11 株式会社フューチャービジョン ガラス基板の除電方法
CN100495149C (zh) * 2006-08-17 2009-06-03 株式会社爱发科 贴合方法及贴合基板制造装置
CN101925794B (zh) * 2008-01-25 2012-08-22 松下电器产业株式会社 检查装置以及检查方法
CN101957514B (zh) * 2010-08-30 2012-01-18 华映视讯（吴江）有限公司 面板组合对位系统及其对位方法
CN102673090B (zh) * 2011-03-18 2015-01-14 宸鸿科技(厦门)有限公司 多层板贴合装置及其方法
JP5791101B2 (ja) * 2011-05-16 2015-10-07 芝浦メカトロニクス株式会社 貼り合せ板状体検査装置及び方法
JP5411905B2 (ja) * 2011-09-30 2014-02-12 オリジン電気株式会社 接合部材の製造装置及び接合部材の製造方法
TWI454794B (zh) * 2011-11-11 2014-10-01 Efun Technology Co Ltd Film machine
CN102555408A (zh) * 2012-02-09 2012-07-11 华映视讯（吴江）有限公司 适用于液晶显示面板的贴合装置
JP2013218198A (ja) * 2012-04-11 2013-10-24 Hitachi High-Technologies Corp 基板貼り合わせ装置
CN102673095B (zh) * 2012-06-01 2014-09-03 深圳市华星光电技术有限公司 全世代适用的真空贴合机及其工作方法
JP5852244B2 (ja) * 2012-07-30 2016-02-03 芝浦メカトロニクス株式会社 基板貼合装置及び基板貼合方法
CN102902102B (zh) * 2012-10-30 2015-08-19 东莞市凯博美光电科技股份有限公司 裸眼3d显示屏中3d光栅的贴合方法及裸眼3d显示屏
CN102998833B (zh) * 2012-12-14 2015-05-13 京东方科技集团股份有限公司 阵列基板与彩膜基板成盒对位的方法
CN104411789B (zh) * 2013-01-30 2016-11-09 欧利生电气株式会社 构件粘贴装置
JP6100571B2 (ja) 2013-03-22 2017-03-22 株式会社東芝 表示装置の製造装置、および表示装置の製造方法
JP6311967B2 (ja) 2014-03-06 2018-04-18 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 基板貼り合せ装置及び基板貼り合せ方法
CN105511126B (zh) * 2016-01-21 2018-11-13 京东方科技集团股份有限公司 显示面板及其制备方法和检测方法
CN107238957A (zh) * 2017-08-02 2017-10-10 业成科技（成都）有限公司 贴合设备及其贴合方法
CN109473365A (zh) * 2017-09-08 2019-03-15 李亚玲 Cvd沉膜偏移制程异常的测量与监控方法
CN107639921A (zh) * 2017-09-21 2018-01-30 歌尔股份有限公司 贴合装置
CN110632775A (zh) * 2019-09-05 2019-12-31 东莞通华液晶有限公司 一种叠合玻璃基板的对版方法
CN111524449B (zh) * 2020-04-28 2022-03-29 昆山国显光电有限公司 贴合设备校正装置及方法、显示面板贴合设备及方法
KR102840203B1 (ko) * 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
CN115732355A (zh) * 2021-08-31 2023-03-03 上海微电子装备（集团）股份有限公司 一种基片贴合设备及基片贴合方法
CN114454591B (zh) * 2022-02-09 2024-08-13 创维集团智能装备有限公司 面板贴合方法、装置、电子设备及可读存储介质

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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US5499127A (en) * 1992-05-25 1996-03-12 Sharp Kabushiki Kaisha Liquid crystal display device having a larger gap between the substrates in the display area than in the sealant area
US5407519A (en) * 1993-07-07 1995-04-18 Interserv Corp. Apparatus for manufacturing liquid crystal display screens
JP3658110B2 (ja) * 1995-11-27 2005-06-08 キヤノン株式会社 画像表示装置のための製造方法及び製造装置
KR100669096B1 (ko) * 2000-02-21 2007-01-16 엘지.필립스 엘시디 주식회사 기판 합착 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588022B (zh) * 2013-03-22 2017-06-21 Toshiba Kk A manufacturing apparatus of a display apparatus, and a manufacturing method of the display apparatus

Also Published As

Publication number Publication date
KR100706460B1 (ko) 2007-04-10
US20030159769A1 (en) 2003-08-28
KR20030071519A (ko) 2003-09-03
JP4038133B2 (ja) 2008-01-23
TW200304016A (en) 2003-09-16
CN1282007C (zh) 2006-10-25
JP2003322834A (ja) 2003-11-14
CN1441294A (zh) 2003-09-10

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MM4A Annulment or lapse of patent due to non-payment of fees