JP4017308B2 - 電子部品実装方法 - Google Patents
電子部品実装方法 Download PDFInfo
- Publication number
- JP4017308B2 JP4017308B2 JP2000019494A JP2000019494A JP4017308B2 JP 4017308 B2 JP4017308 B2 JP 4017308B2 JP 2000019494 A JP2000019494 A JP 2000019494A JP 2000019494 A JP2000019494 A JP 2000019494A JP 4017308 B2 JP4017308 B2 JP 4017308B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- component
- circuit board
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000019494A JP4017308B2 (ja) | 2000-01-28 | 2000-01-28 | 電子部品実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000019494A JP4017308B2 (ja) | 2000-01-28 | 2000-01-28 | 電子部品実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001210944A JP2001210944A (ja) | 2001-08-03 |
| JP2001210944A5 JP2001210944A5 (enExample) | 2005-11-04 |
| JP4017308B2 true JP4017308B2 (ja) | 2007-12-05 |
Family
ID=18546181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000019494A Expired - Fee Related JP4017308B2 (ja) | 2000-01-28 | 2000-01-28 | 電子部品実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4017308B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4703454B2 (ja) * | 2006-03-27 | 2011-06-15 | 富士通株式会社 | 光モジュール用ケージ実装構造 |
| JP6457237B2 (ja) * | 2014-10-23 | 2019-01-23 | Juki株式会社 | リード切断方法および電子部品実装装置 |
-
2000
- 2000-01-28 JP JP2000019494A patent/JP4017308B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001210944A (ja) | 2001-08-03 |
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