JP3984655B2 - 少なくとも２層の糸の角交差を利用した薄片カット用の糸によるスライス装置 - Google Patents

少なくとも２層の糸の角交差を利用した薄片カット用の糸によるスライス装置 Download PDF

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Publication number
JP3984655B2
JP3984655B2 JP54785998A JP54785998A JP3984655B2 JP 3984655 B2 JP3984655 B2 JP 3984655B2 JP 54785998 A JP54785998 A JP 54785998A JP 54785998 A JP54785998 A JP 54785998A JP 3984655 B2 JP3984655 B2 JP 3984655B2
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Japan
Prior art keywords
yarn
angle
cylinders
layers
thread
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JP54785998A
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English (en)
Japanese (ja)
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JP2001524035A (ja
JP2001524035A5 (enExample
Inventor
シャルル オーゼル
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アシュセテ シェーピング システムズ ソシエテ アノニム
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9473—For rectilinearly reciprocating tool
    • Y10T83/9483—Adjustable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9488—Adjustable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP54785998A 1997-05-07 1998-02-13 少なくとも２層の糸の角交差を利用した薄片カット用の糸によるスライス装置 Expired - Fee Related JP3984655B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1067/97 1997-05-07
CH106797 1997-05-07
PCT/IB1998/000180 WO1998050209A1 (fr) 1997-05-07 1998-02-13 Dispositif de sciage par fil pour la decoupe de tranches fines utilisant le croisement angulaire d'au moins deux nappes de fils

Publications (3)

Publication Number Publication Date
JP2001524035A JP2001524035A (ja) 2001-11-27
JP2001524035A5 JP2001524035A5 (enExample) 2005-10-06
JP3984655B2 true JP3984655B2 (ja) 2007-10-03

Family

ID=4201678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54785998A Expired - Fee Related JP3984655B2 (ja) 1997-05-07 1998-02-13 少なくとも２層の糸の角交差を利用した薄片カット用の糸によるスライス装置

Country Status (5)

Country Link
US (1) US6371101B1 (enExample)
EP (1) EP0980303B1 (enExample)
JP (1) JP3984655B2 (enExample)
DE (1) DE69808072T2 (enExample)
WO (1) WO1998050209A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH692485A5 (fr) 1998-02-13 2002-07-15 Hct Shaping Systems Sa Dispositif de sciage par fil.
CH697024A5 (fr) * 2000-09-28 2008-03-31 Hct Shaping Systems Sa Dispositif de sciage par fil.
CH696431A5 (fr) * 2003-04-01 2007-06-15 Hct Shaping Systems Sa Procédé et dispositif de sciage par fil.
WO2006061043A1 (de) * 2004-12-10 2006-06-15 Freiberger Compound Materials Gmbh Werkstückhalterung und verfahren zum drahtsägen
JP5072204B2 (ja) * 2005-08-31 2012-11-14 信越半導体株式会社 ウエーハの表面のナノトポグラフィを改善する方法及びワイヤソー装置
DE102007016334B4 (de) * 2007-04-04 2011-04-21 Siemens Ag Drahtsäge und Verfahren zur Herstellung einer Drahtsäge
DE102007019566B4 (de) * 2007-04-25 2012-11-29 Siltronic Ag Drahtführungsrolle für Drahtsäge
DE102009047027B3 (de) * 2009-11-23 2011-07-28 J. Schmalz GmbH, 72293 Vorrichtung zum Herstellen von Materialscheiben
JP2013008769A (ja) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法
JP5590001B2 (ja) * 2011-10-04 2014-09-17 信越半導体株式会社 ワークの切断方法及びワイヤソー
EP2664402A1 (en) 2012-05-18 2013-11-20 Meyer Burger AG Wire saw and process for cutting work pieces, in particular work pieces of hard and brittle material
JP6741491B2 (ja) * 2016-06-29 2020-08-19 川崎重工業株式会社 研磨装置
CN106079106B (zh) * 2016-08-15 2018-02-09 山东金瑞诺华兴机械有限公司 多根金刚石串珠绳锯机及其切割工艺
CN106313352A (zh) * 2016-11-21 2017-01-11 宁晋松宫电子材料有限公司 一种提高硅片切割厚度均匀性的方法
DE102017203160B4 (de) 2017-02-27 2020-03-19 Zae Bayern Bay. Zentrum Für Angewandte Energieforschung E.V. Vorrichtung zum Schneiden von streifen- oder plattenförmigen Filzelementen
USD839038S1 (en) 2017-11-10 2019-01-29 Furrion Property Holding Limited Oven
USD851979S1 (en) 2018-04-30 2019-06-25 Furrion Property Holding Limited Oven bracket
US11181282B2 (en) * 2018-05-14 2021-11-23 Furrion Property Holding Limited Flat top gas range, a counter containing, and a vehicle containing
DE102018221922A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
CN109648723A (zh) * 2019-02-03 2019-04-19 玉田县昌通电子有限公司 一种多线切割机用的刀架及其多线切割机
CN110509445A (zh) * 2019-08-16 2019-11-29 西安奕斯伟硅片技术有限公司 一种多线切割装置
CN112775492A (zh) * 2021-01-31 2021-05-11 刘沛蕾 一种铝合金门窗的加工机构
CN116714126B (zh) * 2023-07-31 2025-09-23 安徽微芯长江半导体材料有限公司 一种不规则碳化硅晶锭快速磨切装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE154646C (enExample) *
US4084469A (en) * 1976-12-17 1978-04-18 Herbert Ray Gray Web cutting device
US4393450A (en) * 1980-08-11 1983-07-12 Trustees Of Dartmouth College Three-dimensional model-making system
US4494523A (en) * 1983-08-05 1985-01-22 Motorola, Inc. Wire saw
DE3405252C2 (de) * 1984-01-20 1986-05-22 Münchow und Hühne Maschinenbaugesellschaft mbH, 4100 Duisburg Vorrichtung zum Zerschneiden eines Schaumkunststoffkörpers
JPS61288995A (ja) * 1985-06-13 1986-12-19 株式会社　ハイト ワイヤスライサ
JPH0635107B2 (ja) * 1987-12-26 1994-05-11 株式会社タカトリハイテック ワイヤソー
US5031497A (en) * 1989-06-29 1991-07-16 Continental Baking Company Bread slicing machine cleaner
WO1991012915A1 (fr) * 1990-03-01 1991-09-05 Charles Hauser Dispositif pour un sciage industriel de pieces en tranches fines
CH690845A5 (de) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür.
JP2885270B2 (ja) * 1995-06-01 1999-04-19 信越半導体株式会社 ワイヤーソー装置及びワークの切断方法
JP3107143B2 (ja) * 1995-07-14 2000-11-06 株式会社東京精密 ワイヤソーのワイヤトラバース装置
CZ283541B6 (cs) * 1996-03-06 1998-04-15 Trimex Tesla, S.R.O. Způsob řezání ingotů z tvrdých materiálů na desky a pila k provádění tohoto způsobu
CH690907A5 (fr) * 1996-05-23 2001-02-28 Hct Shaping Systems Sa Dispositif de sciage par fil

Also Published As

Publication number Publication date
WO1998050209A1 (fr) 1998-11-12
JP2001524035A (ja) 2001-11-27
DE69808072D1 (de) 2002-10-24
US6371101B1 (en) 2002-04-16
EP0980303B1 (fr) 2002-09-18
DE69808072T2 (de) 2003-05-08
EP0980303A1 (fr) 2000-02-23

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