JP3979391B2 - 回路形成基板の製造方法および回路形成基板の製造用材料 - Google Patents

回路形成基板の製造方法および回路形成基板の製造用材料 Download PDF

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Publication number
JP3979391B2
JP3979391B2 JP2004016795A JP2004016795A JP3979391B2 JP 3979391 B2 JP3979391 B2 JP 3979391B2 JP 2004016795 A JP2004016795 A JP 2004016795A JP 2004016795 A JP2004016795 A JP 2004016795A JP 3979391 B2 JP3979391 B2 JP 3979391B2
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JP
Japan
Prior art keywords
substrate
circuit
circuit forming
forming substrate
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004016795A
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English (en)
Japanese (ja)
Other versions
JP2005209993A (ja
Inventor
利浩 西井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004016795A priority Critical patent/JP3979391B2/ja
Priority to TW094101542A priority patent/TW200527995A/zh
Priority to PCT/JP2005/000763 priority patent/WO2005072037A1/ja
Priority to KR1020057017222A priority patent/KR100736518B1/ko
Priority to US10/546,730 priority patent/US7624502B2/en
Priority to EP05703984A priority patent/EP1599079B1/en
Priority to CNB2005800002557A priority patent/CN100539813C/zh
Publication of JP2005209993A publication Critical patent/JP2005209993A/ja
Priority to US11/882,396 priority patent/US7572500B2/en
Application granted granted Critical
Publication of JP3979391B2 publication Critical patent/JP3979391B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
JP2004016795A 2004-01-26 2004-01-26 回路形成基板の製造方法および回路形成基板の製造用材料 Expired - Fee Related JP3979391B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2004016795A JP3979391B2 (ja) 2004-01-26 2004-01-26 回路形成基板の製造方法および回路形成基板の製造用材料
TW094101542A TW200527995A (en) 2004-01-26 2005-01-19 Method for producing circuit-forming board and material for producing circuit-forming board
KR1020057017222A KR100736518B1 (ko) 2004-01-26 2005-01-21 회로 형성 기판의 제조 방법 및 회로 형성 기판의 제조용재료
US10/546,730 US7624502B2 (en) 2004-01-26 2005-01-21 Method for producing circuit-forming board and material for producing circuit-forming board
PCT/JP2005/000763 WO2005072037A1 (ja) 2004-01-26 2005-01-21 回路形成基板の製造方法および回路形成基板の製造用材料
EP05703984A EP1599079B1 (en) 2004-01-26 2005-01-21 Method for producing a circuit board and material for producing a circuit board
CNB2005800002557A CN100539813C (zh) 2004-01-26 2005-01-21 电路成形基板制造方法和用于制造电路成形基板的材料
US11/882,396 US7572500B2 (en) 2004-01-26 2007-08-01 Method of manufacturing circuit-forming board and material of circuit-forming board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004016795A JP3979391B2 (ja) 2004-01-26 2004-01-26 回路形成基板の製造方法および回路形成基板の製造用材料

Publications (2)

Publication Number Publication Date
JP2005209993A JP2005209993A (ja) 2005-08-04
JP3979391B2 true JP3979391B2 (ja) 2007-09-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004016795A Expired - Fee Related JP3979391B2 (ja) 2004-01-26 2004-01-26 回路形成基板の製造方法および回路形成基板の製造用材料

Country Status (7)

Country Link
US (2) US7624502B2 (OSRAM)
EP (1) EP1599079B1 (OSRAM)
JP (1) JP3979391B2 (OSRAM)
KR (1) KR100736518B1 (OSRAM)
CN (1) CN100539813C (OSRAM)
TW (1) TW200527995A (OSRAM)
WO (1) WO2005072037A1 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4903723B2 (ja) * 2006-01-30 2012-03-28 京セラ株式会社 配線基板、および電子装置
KR100905566B1 (ko) * 2007-04-30 2009-07-02 삼성전기주식회사 회로 전사용 캐리어 부재, 이를 이용한 코어리스인쇄회로기판, 및 이들의 제조방법
CN101562952B (zh) * 2008-04-18 2012-04-11 富葵精密组件(深圳)有限公司 线路基板、线路基板的制作方法及电路板的制作方法
KR100999918B1 (ko) * 2008-09-08 2010-12-13 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR100982790B1 (ko) * 2010-07-08 2010-09-16 윤병철 금속섬유를 이용한 Ｎｏｎ-ＰＣＢ 복합재료 플레이트의 절연층의 상하면 통전 방법
KR100982791B1 (ko) * 2010-07-08 2010-09-16 윤병철 금속 스테이플을 이용한 Ｎｏｎ-ＰＣＢ 복합재료 플레이트의 절연층의 상하면 통전 방법
GB2489508B8 (en) 2011-03-31 2016-03-16 Plasyl Ltd Improvements for electrical circuits
TW201340807A (zh) * 2011-12-28 2013-10-01 松下電器產業股份有限公司 撓性配線基板與其製造方法、使用其之裝載製品、及撓性多層配線基板
KR101494090B1 (ko) * 2013-07-16 2015-02-16 삼성전기주식회사 동박적층판, 인쇄회로기판 및 그 제조 방법
CN104768326B (zh) * 2015-03-31 2017-11-24 华为技术有限公司 印刷电路板及印刷电路板制造方法
DE102018125919A1 (de) 2017-10-23 2019-04-25 Engel Austria Gmbh Verfahren zum Bewegen einer bewegbaren Formaufspannplatte
EP4215444B1 (en) * 2022-01-20 2024-11-27 Airbus Operations GmbH Method of assembling a structure in aircraft or spacecraft production
CN115837792B (zh) * 2022-12-12 2023-07-11 广东嘉元科技股份有限公司 一种铜箔自动粘合装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0247575B1 (en) * 1986-05-30 1993-07-21 Furukawa Denki Kogyo Kabushiki Kaisha Multilayer printed wiring board and method for producing the same
JPH07115280B2 (ja) * 1986-10-21 1995-12-13 日立精機株式会社 アンバランス工具測定装置
US5413838A (en) * 1991-06-18 1995-05-09 Sumitomo Bakelite Company Limited Both-side roughened copper foil with protection film
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
JP2601128B2 (ja) 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
US5403672A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Co., Ltd. Metal foil for printed wiring board and production thereof
JP3146712B2 (ja) 1993-01-12 2001-03-19 松下電器産業株式会社 両面プリント基板およびその製造方法
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5519177A (en) * 1993-05-19 1996-05-21 Ibiden Co., Ltd. Adhesives, adhesive layers for electroless plating and printed circuit boards
JP3173249B2 (ja) 1993-10-20 2001-06-04 松下電器産業株式会社 多層プリント配線板及びその製造方法
US5652042A (en) * 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US5482784A (en) * 1993-12-24 1996-01-09 Mitsui Mining And Smelting Co., Ltd. Printed circuit inner-layer copper foil and process for producing the same
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
JPH0946041A (ja) 1995-07-26 1997-02-14 Toshiba Corp 印刷配線板の製造方法
US6010768A (en) * 1995-11-10 2000-01-04 Ibiden Co., Ltd. Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler
US6085414A (en) * 1996-08-15 2000-07-11 Packard Hughes Interconnect Company Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
KR100448561B1 (ko) * 1997-04-15 2004-09-13 이비덴 가부시키가이샤 무전해 도금용 접착제, 무전해 도금용 접착제 조제용의 원료조성물 및 프린트 배선판
US6239777B1 (en) * 1997-07-22 2001-05-29 Kabushiki Kaisha Toshiba Display device
JPH11251703A (ja) 1998-02-27 1999-09-17 Matsushita Electric Ind Co Ltd 回路基板、両面回路基板、多層回路基板及び回路基板の製造方法
US6139777A (en) * 1998-05-08 2000-10-31 Matsushita Electric Industrial Co., Ltd. Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same
JP4486196B2 (ja) * 1999-12-08 2010-06-23 イビデン株式会社 多層プリント配線板用片面回路基板およびその製造方法
US6504705B2 (en) * 2000-10-12 2003-01-07 Matsushita Electric Industrial Co., Ltd. Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same
US6713688B2 (en) * 2000-12-27 2004-03-30 Matsushita Electric Industrial Co., Ltd. Circuit board and its manufacture method
JP2002217510A (ja) * 2001-01-15 2002-08-02 Matsushita Electric Ind Co Ltd 基板の接続構造とその製造方法
JP2002368043A (ja) * 2001-06-12 2002-12-20 Matsushita Electric Ind Co Ltd 導電性ペーストとそれを用いた導電性バンプおよびその形成方法、導電性バンプの接続方法、並びに回路基板とその製造方法
JP2003023250A (ja) * 2001-07-06 2003-01-24 Denso Corp 多層基板のおよびその製造方法
JP4062907B2 (ja) * 2001-11-12 2008-03-19 松下電器産業株式会社 回路基板およびその製造方法
JP2003209355A (ja) * 2002-01-15 2003-07-25 Sony Corp 配線基板の製造方法および配線基板
US6946205B2 (en) * 2002-04-25 2005-09-20 Matsushita Electric Industrial Co., Ltd. Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
JP4029759B2 (ja) * 2003-04-04 2008-01-09 株式会社デンソー 多層回路基板およびその製造方法

Also Published As

Publication number Publication date
US20060242827A1 (en) 2006-11-02
CN100539813C (zh) 2009-09-09
EP1599079B1 (en) 2012-05-09
EP1599079A1 (en) 2005-11-23
KR100736518B1 (ko) 2007-07-06
US7624502B2 (en) 2009-12-01
US7572500B2 (en) 2009-08-11
TW200527995A (en) 2005-08-16
CN1771773A (zh) 2006-05-10
EP1599079A4 (en) 2008-05-21
JP2005209993A (ja) 2005-08-04
WO2005072037A1 (ja) 2005-08-04
TWI350718B (OSRAM) 2011-10-11
US20080017403A1 (en) 2008-01-24
KR20050110001A (ko) 2005-11-22

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