JP3953900B2 - 積層樹脂配線基板及びその製造方法 - Google Patents

積層樹脂配線基板及びその製造方法 Download PDF

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Publication number
JP3953900B2
JP3953900B2 JP2002187257A JP2002187257A JP3953900B2 JP 3953900 B2 JP3953900 B2 JP 3953900B2 JP 2002187257 A JP2002187257 A JP 2002187257A JP 2002187257 A JP2002187257 A JP 2002187257A JP 3953900 B2 JP3953900 B2 JP 3953900B2
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Japan
Prior art keywords
metal plate
resin
hole
conductor pattern
main surface
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Expired - Fee Related
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JP2002187257A
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Japanese (ja)
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JP2004031732A (ja
JP2004031732A5 (https=
Inventor
伸治 由利
友恵 鈴木
和久 佐藤
耕三 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Publication date
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Priority to JP2002187257A priority Critical patent/JP3953900B2/ja
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Publication of JP2004031732A5 publication Critical patent/JP2004031732A5/ja
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Publication of JP3953900B2 publication Critical patent/JP3953900B2/ja
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  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2002187257A 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法 Expired - Fee Related JP3953900B2 (ja)

Priority Applications (1)

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JP2002187257A JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002187257A JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Publications (3)

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JP2004031732A JP2004031732A (ja) 2004-01-29
JP2004031732A5 JP2004031732A5 (https=) 2005-06-02
JP3953900B2 true JP3953900B2 (ja) 2007-08-08

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JP2002187257A Expired - Fee Related JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

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JP (1) JP3953900B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7765691B2 (en) * 2005-12-28 2010-08-03 Intel Corporation Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
JP5183045B2 (ja) * 2006-07-20 2013-04-17 三洋電機株式会社 回路装置
JP2008060372A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 回路装置およびその製造方法、配線基板およびその製造方法
US8436250B2 (en) 2006-11-30 2013-05-07 Sanyo Electric Co., Ltd. Metal core circuit element mounting board
JP2010278379A (ja) * 2009-06-01 2010-12-09 Murata Mfg Co Ltd 配線基板およびその製造方法
JPWO2011002031A1 (ja) 2009-06-30 2012-12-13 三洋電機株式会社 素子搭載用基板および半導体モジュール
KR101044127B1 (ko) 2009-11-16 2011-06-28 삼성전기주식회사 방열기판 및 그 제조방법
JP2012114217A (ja) 2010-11-24 2012-06-14 Nitto Denko Corp 配線回路基板の製造方法
KR101177651B1 (ko) * 2011-01-25 2012-08-27 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5178899B2 (ja) 2011-05-27 2013-04-10 太陽誘電株式会社 多層基板

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