JP3953900B2 - 積層樹脂配線基板及びその製造方法 - Google Patents
積層樹脂配線基板及びその製造方法 Download PDFInfo
- Publication number
- JP3953900B2 JP3953900B2 JP2002187257A JP2002187257A JP3953900B2 JP 3953900 B2 JP3953900 B2 JP 3953900B2 JP 2002187257 A JP2002187257 A JP 2002187257A JP 2002187257 A JP2002187257 A JP 2002187257A JP 3953900 B2 JP3953900 B2 JP 3953900B2
- Authority
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- Prior art keywords
- metal plate
- resin
- hole
- conductor pattern
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 130
- 239000011347 resin Substances 0.000 title claims description 130
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 131
- 239000002184 metal Substances 0.000 claims description 131
- 239000004020 conductor Substances 0.000 claims description 101
- 238000009413 insulation Methods 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 23
- 230000000149 penetrating effect Effects 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 239000000758 substrate Substances 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 238000007747 plating Methods 0.000 description 18
- 239000000956 alloy Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000011162 core material Substances 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 238000001259 photo etching Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000000805 composite resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229920001955 polyphenylene ether Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910017888 Cu—P Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910018104 Ni-P Inorganic materials 0.000 description 2
- 229910018536 Ni—P Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017767 Cu—Al Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical compound [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187257A JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002187257A JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031732A JP2004031732A (ja) | 2004-01-29 |
| JP2004031732A5 JP2004031732A5 (enExample) | 2005-06-02 |
| JP3953900B2 true JP3953900B2 (ja) | 2007-08-08 |
Family
ID=31182345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002187257A Expired - Fee Related JP3953900B2 (ja) | 2002-06-27 | 2002-06-27 | 積層樹脂配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3953900B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7765691B2 (en) * | 2005-12-28 | 2010-08-03 | Intel Corporation | Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate |
| JP5183045B2 (ja) * | 2006-07-20 | 2013-04-17 | 三洋電機株式会社 | 回路装置 |
| JP2008060372A (ja) * | 2006-08-31 | 2008-03-13 | Sanyo Electric Co Ltd | 回路装置およびその製造方法、配線基板およびその製造方法 |
| JPWO2008069260A1 (ja) * | 2006-11-30 | 2010-03-25 | 三洋電機株式会社 | 回路素子実装用の基板、これを用いた回路装置およびエアコンディショナ |
| JP2010278379A (ja) * | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | 配線基板およびその製造方法 |
| JPWO2011002031A1 (ja) | 2009-06-30 | 2012-12-13 | 三洋電機株式会社 | 素子搭載用基板および半導体モジュール |
| KR101044127B1 (ko) | 2009-11-16 | 2011-06-28 | 삼성전기주식회사 | 방열기판 및 그 제조방법 |
| JP2012114217A (ja) | 2010-11-24 | 2012-06-14 | Nitto Denko Corp | 配線回路基板の製造方法 |
| KR101177651B1 (ko) * | 2011-01-25 | 2012-08-27 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| JP5178899B2 (ja) * | 2011-05-27 | 2013-04-10 | 太陽誘電株式会社 | 多層基板 |
-
2002
- 2002-06-27 JP JP2002187257A patent/JP3953900B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004031732A (ja) | 2004-01-29 |
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