JP2004031732A5 - - Google Patents

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Publication number
JP2004031732A5
JP2004031732A5 JP2002187257A JP2002187257A JP2004031732A5 JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5 JP 2002187257 A JP2002187257 A JP 2002187257A JP 2002187257 A JP2002187257 A JP 2002187257A JP 2004031732 A5 JP2004031732 A5 JP 2004031732A5
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JP
Japan
Prior art keywords
groove
incidentally
rolled
shifting
overlap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002187257A
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English (en)
Japanese (ja)
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JP3953900B2 (ja
JP2004031732A (ja
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Publication date
Application filed filed Critical
Priority to JP2002187257A priority Critical patent/JP3953900B2/ja
Priority claimed from JP2002187257A external-priority patent/JP3953900B2/ja
Publication of JP2004031732A publication Critical patent/JP2004031732A/ja
Publication of JP2004031732A5 publication Critical patent/JP2004031732A5/ja
Application granted granted Critical
Publication of JP3953900B2 publication Critical patent/JP3953900B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002187257A 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法 Expired - Fee Related JP3953900B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002187257A JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002187257A JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2004031732A JP2004031732A (ja) 2004-01-29
JP2004031732A5 true JP2004031732A5 (enExample) 2005-06-02
JP3953900B2 JP3953900B2 (ja) 2007-08-08

Family

ID=31182345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002187257A Expired - Fee Related JP3953900B2 (ja) 2002-06-27 2002-06-27 積層樹脂配線基板及びその製造方法

Country Status (1)

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JP (1) JP3953900B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7765691B2 (en) * 2005-12-28 2010-08-03 Intel Corporation Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
JP5183045B2 (ja) * 2006-07-20 2013-04-17 三洋電機株式会社 回路装置
JP2008060372A (ja) * 2006-08-31 2008-03-13 Sanyo Electric Co Ltd 回路装置およびその製造方法、配線基板およびその製造方法
JPWO2008069260A1 (ja) * 2006-11-30 2010-03-25 三洋電機株式会社 回路素子実装用の基板、これを用いた回路装置およびエアコンディショナ
JP2010278379A (ja) * 2009-06-01 2010-12-09 Murata Mfg Co Ltd 配線基板およびその製造方法
JPWO2011002031A1 (ja) 2009-06-30 2012-12-13 三洋電機株式会社 素子搭載用基板および半導体モジュール
KR101044127B1 (ko) 2009-11-16 2011-06-28 삼성전기주식회사 방열기판 및 그 제조방법
JP2012114217A (ja) 2010-11-24 2012-06-14 Nitto Denko Corp 配線回路基板の製造方法
KR101177651B1 (ko) * 2011-01-25 2012-08-27 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5178899B2 (ja) * 2011-05-27 2013-04-10 太陽誘電株式会社 多層基板

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