JP3945951B2 - レーザ加工方法およびレーザ加工機 - Google Patents

レーザ加工方法およびレーザ加工機 Download PDF

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Publication number
JP3945951B2
JP3945951B2 JP2000003698A JP2000003698A JP3945951B2 JP 3945951 B2 JP3945951 B2 JP 3945951B2 JP 2000003698 A JP2000003698 A JP 2000003698A JP 2000003698 A JP2000003698 A JP 2000003698A JP 3945951 B2 JP3945951 B2 JP 3945951B2
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JP
Japan
Prior art keywords
laser
turned
processing
laser beam
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000003698A
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English (en)
Japanese (ja)
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JP2000263271A5 (OSRAM
JP2000263271A (ja
Inventor
邦夫 荒井
文雄 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Priority to JP2000003698A priority Critical patent/JP3945951B2/ja
Priority to US09/623,809 priority patent/US6521866B1/en
Priority to EP00900364.1A priority patent/EP1095726B1/en
Priority to KR1020007009932A priority patent/KR100625221B1/ko
Priority to PCT/JP2000/000124 priority patent/WO2000041839A1/ja
Publication of JP2000263271A publication Critical patent/JP2000263271A/ja
Publication of JP2000263271A5 publication Critical patent/JP2000263271A5/ja
Application granted granted Critical
Publication of JP3945951B2 publication Critical patent/JP3945951B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2000003698A 1999-01-14 2000-01-12 レーザ加工方法およびレーザ加工機 Expired - Lifetime JP3945951B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000003698A JP3945951B2 (ja) 1999-01-14 2000-01-12 レーザ加工方法およびレーザ加工機
US09/623,809 US6521866B1 (en) 1999-01-14 2000-01-13 Laser beam machining and laser beam machine
EP00900364.1A EP1095726B1 (en) 1999-01-14 2000-01-13 Laser beam machining and laser beam machine
KR1020007009932A KR100625221B1 (ko) 1999-01-14 2000-01-13 레이저 가공방법 및 레이저 가공기
PCT/JP2000/000124 WO2000041839A1 (fr) 1999-01-14 2000-01-13 Procede et dispositif d'usinage laser

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP825299 1999-01-14
JP11-8252 1999-01-14
JP2000003698A JP3945951B2 (ja) 1999-01-14 2000-01-12 レーザ加工方法およびレーザ加工機

Publications (3)

Publication Number Publication Date
JP2000263271A JP2000263271A (ja) 2000-09-26
JP2000263271A5 JP2000263271A5 (OSRAM) 2006-01-05
JP3945951B2 true JP3945951B2 (ja) 2007-07-18

Family

ID=26342741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000003698A Expired - Lifetime JP3945951B2 (ja) 1999-01-14 2000-01-12 レーザ加工方法およびレーザ加工機

Country Status (5)

Country Link
US (1) US6521866B1 (OSRAM)
EP (1) EP1095726B1 (OSRAM)
JP (1) JP3945951B2 (OSRAM)
KR (1) KR100625221B1 (OSRAM)
WO (1) WO2000041839A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112867578A (zh) * 2019-01-31 2021-05-28 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法及使用其加工工件的方法

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Also Published As

Publication number Publication date
US6521866B1 (en) 2003-02-18
WO2000041839A1 (fr) 2000-07-20
KR100625221B1 (ko) 2006-09-18
KR20010041709A (ko) 2001-05-25
JP2000263271A (ja) 2000-09-26
EP1095726A1 (en) 2001-05-02
EP1095726A4 (en) 2009-04-22
EP1095726B1 (en) 2014-07-16

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