JP3938921B2 - 半導体ｉｃ内蔵モジュールの製造方法 - Google Patents

半導体ｉｃ内蔵モジュールの製造方法 Download PDF

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Publication number
JP3938921B2
JP3938921B2 JP2004191369A JP2004191369A JP3938921B2 JP 3938921 B2 JP3938921 B2 JP 3938921B2 JP 2004191369 A JP2004191369 A JP 2004191369A JP 2004191369 A JP2004191369 A JP 2004191369A JP 3938921 B2 JP3938921 B2 JP 3938921B2
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Japan
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semiconductor
built
module
transfer substrate
resin layer
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Expired - Lifetime
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JP2004191369A
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Japanese (ja)
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JP2005064470A5 (enExample
JP2005064470A (ja
Inventor
稔 高谷
寿之 阿部
圭 鈴木
弘介 高野
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TDK Corp
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TDK Corp
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Priority to JP2004191369A priority Critical patent/JP3938921B2/ja
Priority to US10/900,458 priority patent/US7547975B2/en
Priority to CNA2004100557098A priority patent/CN1578601A/zh
Priority to EP04254569.9A priority patent/EP1503409B1/en
Publication of JP2005064470A publication Critical patent/JP2005064470A/ja
Publication of JP2005064470A5 publication Critical patent/JP2005064470A5/ja
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Publication of JP3938921B2 publication Critical patent/JP3938921B2/ja
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    • H10W70/09—
    • H10W72/9413—
    • H10W74/019—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2004191369A 2003-07-30 2004-06-29 半導体ｉｃ内蔵モジュールの製造方法 Expired - Lifetime JP3938921B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004191369A JP3938921B2 (ja) 2003-07-30 2004-06-29 半導体ｉｃ内蔵モジュールの製造方法
US10/900,458 US7547975B2 (en) 2003-07-30 2004-07-28 Module with embedded semiconductor IC and method of fabricating the module
CNA2004100557098A CN1578601A (zh) 2003-07-30 2004-07-30 内置半导体ic模块及其制造方法
EP04254569.9A EP1503409B1 (en) 2003-07-30 2004-07-30 Module with embedded semiconductor IC which has a narrow electrode pitch and method of fabricating the module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003283243 2003-07-30
JP2004191369A JP3938921B2 (ja) 2003-07-30 2004-06-29 半導体ｉｃ内蔵モジュールの製造方法

Publications (3)

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JP2005064470A JP2005064470A (ja) 2005-03-10
JP2005064470A5 JP2005064470A5 (enExample) 2005-09-02
JP3938921B2 true JP3938921B2 (ja) 2007-06-27

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JP2004191369A Expired - Lifetime JP3938921B2 (ja) 2003-07-30 2004-06-29 半導体ｉｃ内蔵モジュールの製造方法

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Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7547975B2 (en) 2003-07-30 2009-06-16 Tdk Corporation Module with embedded semiconductor IC and method of fabricating the module
TW200618705A (en) 2004-09-16 2006-06-01 Tdk Corp Multilayer substrate and manufacturing method thereof
JP2006339354A (ja) 2005-06-01 2006-12-14 Tdk Corp 半導体ｉｃ及びその製造方法、並びに、半導体ｉｃ内蔵モジュール及びその製造方法
JP4535002B2 (ja) 2005-09-28 2010-09-01 Ｔｄｋ株式会社 半導体ｉｃ内蔵基板及びその製造方法
JP4835124B2 (ja) * 2005-11-29 2011-12-14 Ｔｄｋ株式会社 半導体ｉｃ内蔵基板及びその製造方法
US8188375B2 (en) 2005-11-29 2012-05-29 Tok Corporation Multilayer circuit board and method for manufacturing the same
JP2007194436A (ja) * 2006-01-19 2007-08-02 Elpida Memory Inc 半導体パッケージ、導電性ポスト付き基板、積層型半導体装置、半導体パッケージの製造方法及び積層型半導体装置の製造方法
CN101480116B (zh) * 2006-04-27 2013-02-13 日本电气株式会社 电路基板、电子器件配置及用于电路基板的制造工艺
WO2008065896A1 (en) * 2006-11-28 2008-06-05 Kyushu Institute Of Technology Method for manufacturing semiconductor device having dual-face electrode structure and semiconductor device manufactured by the method
JP4303282B2 (ja) 2006-12-22 2009-07-29 Ｔｄｋ株式会社 プリント配線板の配線構造及びその形成方法
JP4331769B2 (ja) 2007-02-28 2009-09-16 Ｔｄｋ株式会社 配線構造及びその形成方法並びにプリント配線板
JP5193503B2 (ja) * 2007-06-04 2013-05-08 新光電気工業株式会社 貫通電極付き基板及びその製造方法
JP5654109B2 (ja) * 2007-09-18 2015-01-14 オリンパス株式会社 積層実装構造体の製造方法
JP5690466B2 (ja) * 2008-01-31 2015-03-25 インヴェンサス・コーポレイション 半導体チップパッケージの製造方法
JP2009246104A (ja) * 2008-03-31 2009-10-22 Kyushu Institute Of Technology 配線用電子部品及びその製造方法
JP5268459B2 (ja) * 2008-07-10 2013-08-21 株式会社半導体エネルギー研究所 半導体装置
US8692135B2 (en) 2008-08-27 2014-04-08 Nec Corporation Wiring board capable of containing functional element and method for manufacturing same
JP5436837B2 (ja) * 2008-10-30 2014-03-05 新光電気工業株式会社 半導体装置内蔵基板の製造方法
JP5491722B2 (ja) * 2008-11-14 2014-05-14 インヴェンサス・コーポレイション 半導体装置パッケージ構造及びその製造方法
JP2010205851A (ja) * 2009-03-02 2010-09-16 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法、並びに電子装置
JPWO2011024939A1 (ja) * 2009-08-28 2013-01-31 日本電気株式会社 半導体装置およびその製造方法
JP6320681B2 (ja) * 2013-03-29 2018-05-09 ローム株式会社 半導体装置
KR102144367B1 (ko) * 2013-10-22 2020-08-14 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
JP6317629B2 (ja) * 2014-06-02 2018-04-25 株式会社東芝 半導体装置

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