JP3923696B2 - 基板回転装置 - Google Patents

基板回転装置 Download PDF

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Publication number
JP3923696B2
JP3923696B2 JP36955899A JP36955899A JP3923696B2 JP 3923696 B2 JP3923696 B2 JP 3923696B2 JP 36955899 A JP36955899 A JP 36955899A JP 36955899 A JP36955899 A JP 36955899A JP 3923696 B2 JP3923696 B2 JP 3923696B2
Authority
JP
Japan
Prior art keywords
magnetic bearing
rotor
substrate
axial magnetic
electromagnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP36955899A
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English (en)
Japanese (ja)
Other versions
JP2001093967A5 (ko
JP2001093967A (ja
Inventor
弘行 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP36955899A priority Critical patent/JP3923696B2/ja
Priority to TW089114234A priority patent/TW517277B/zh
Priority to US09/617,779 priority patent/US6373159B1/en
Priority to KR1020000041397A priority patent/KR100726016B1/ko
Priority to EP00115587A priority patent/EP1071118B1/en
Priority to DE60040320T priority patent/DE60040320D1/de
Publication of JP2001093967A publication Critical patent/JP2001093967A/ja
Publication of JP2001093967A5 publication Critical patent/JP2001093967A5/ja
Application granted granted Critical
Publication of JP3923696B2 publication Critical patent/JP3923696B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
    • F16C32/0406—Magnetic bearings
    • F16C32/044—Active magnetic bearings
    • F16C32/047—Details of housings; Mounting of active magnetic bearings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2300/00—Application independent of particular apparatuses
    • F16C2300/40—Application independent of particular apparatuses related to environment, i.e. operating conditions
    • F16C2300/42—Application independent of particular apparatuses related to environment, i.e. operating conditions corrosive, i.e. with aggressive media or harsh conditions
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2300/00—Application independent of particular apparatuses
    • F16C2300/40—Application independent of particular apparatuses related to environment, i.e. operating conditions
    • F16C2300/62—Application independent of particular apparatuses related to environment, i.e. operating conditions low pressure, e.g. elements operating under vacuum conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP36955899A 1999-07-19 1999-12-27 基板回転装置 Expired - Fee Related JP3923696B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP36955899A JP3923696B2 (ja) 1999-07-19 1999-12-27 基板回転装置
US09/617,779 US6373159B1 (en) 1999-07-19 2000-07-17 Substrate rotating apparatus
TW089114234A TW517277B (en) 1999-07-19 2000-07-17 Substrate rotating apparatus
EP00115587A EP1071118B1 (en) 1999-07-19 2000-07-19 Substrate rotating apparatus
KR1020000041397A KR100726016B1 (ko) 1999-07-19 2000-07-19 기판 회전 장치
DE60040320T DE60040320D1 (de) 1999-07-19 2000-07-19 Substratdrehvorrichtung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-205374 1999-07-19
JP20537499 1999-07-19
JP36955899A JP3923696B2 (ja) 1999-07-19 1999-12-27 基板回転装置

Publications (3)

Publication Number Publication Date
JP2001093967A JP2001093967A (ja) 2001-04-06
JP2001093967A5 JP2001093967A5 (ko) 2004-12-02
JP3923696B2 true JP3923696B2 (ja) 2007-06-06

Family

ID=26515036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36955899A Expired - Fee Related JP3923696B2 (ja) 1999-07-19 1999-12-27 基板回転装置

Country Status (6)

Country Link
US (1) US6373159B1 (ko)
EP (1) EP1071118B1 (ko)
JP (1) JP3923696B2 (ko)
KR (1) KR100726016B1 (ko)
DE (1) DE60040320D1 (ko)
TW (1) TW517277B (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001182746A (ja) * 1999-12-27 2001-07-06 Ebara Corp 磁気軸受装置
DE20006302U1 (de) * 2000-04-06 2001-10-25 Band Zink Gmbh Beschichtungsvorrichtung
JP2002093724A (ja) * 2000-09-18 2002-03-29 Tokyo Electron Ltd 熱処理装置
JP2002212729A (ja) * 2001-01-17 2002-07-31 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
US6770146B2 (en) * 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
JP2004528721A (ja) * 2001-05-29 2004-09-16 アイクストロン、アーゲー 支持体およびその上にガス支持され回転駆動される基板保持器から構成される装置
US6876122B2 (en) * 2002-09-16 2005-04-05 Lockheed Martin Corporation Circular rail linear induction motor
KR100439276B1 (ko) * 2003-11-24 2004-07-30 코닉 시스템 주식회사 급속열처리 장치
JP2006179613A (ja) * 2004-12-21 2006-07-06 Rigaku Corp 半導体ウエハ縦型熱処理装置用磁性流体シールユニット
DE102005032184A1 (de) * 2005-07-09 2007-01-18 Saurer Gmbh & Co. Kg Verfahren zum Betreiben eines elektromotorischen Antriebs
JP4885000B2 (ja) * 2007-02-13 2012-02-29 株式会社ニューフレアテクノロジー 気相成長装置および気相成長方法
KR101532060B1 (ko) 2007-06-27 2015-06-26 브룩스 오토메이션 인코퍼레이티드 셀프 베어링 모터를 위한 위치 피드백
WO2009012396A2 (en) * 2007-07-17 2009-01-22 Brooks Automation, Inc. Substrate processing apparatus with motors integral to chamber walls
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP5533335B2 (ja) * 2009-07-22 2014-06-25 東京エレクトロン株式会社 処理装置及びその動作方法
KR101288483B1 (ko) * 2010-04-21 2013-07-26 주성엔지니어링(주) 기판 처리장치
KR101312962B1 (ko) * 2011-09-07 2013-10-01 스미도모쥬기가이고교 가부시키가이샤 반송장치
EP2904635B1 (en) * 2012-10-05 2016-06-08 Koninklijke Philips N.V. Rotary positioning device
US9394938B2 (en) 2013-06-19 2016-07-19 Applied Materials, Inc. Internal chamber rotation motor, alternative rotation
DE102013011873B4 (de) 2013-07-17 2015-10-08 Mecatronix Ag Positioniervorrichtung und Verfahren zum Bewegen eines Substrats
JP6387863B2 (ja) * 2015-03-05 2018-09-12 株式会社島津製作所 磁気軸受装置
CN109099065B (zh) * 2018-09-30 2020-02-18 珠海格力电器股份有限公司 焊接防护套和磁悬浮轴向轴承
CN114072586B (zh) * 2019-07-19 2023-11-03 株式会社易威奇 泵
KR20230091507A (ko) * 2021-12-16 2023-06-23 에이피시스템 주식회사 자기부상 회전 장치 및 자기부상 회전 방법
JP2024002304A (ja) * 2022-06-23 2024-01-11 東京エレクトロン株式会社 成膜装置
CN117005025B (zh) * 2023-09-01 2024-03-19 苏州中科重仪半导体材料有限公司 一种磁悬浮自转公转反应室装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2377549A1 (fr) 1977-01-12 1978-08-11 Europ Propulsion Montage de rotor court de grand diametre
GB2239295B (en) * 1989-08-04 1993-04-21 Glacier Metal Co Ltd Magnetic bearings
US5471105A (en) * 1992-09-25 1995-11-28 Magnetic Bearing Technologies, Inc. Null flux magnetic bearing with cross-connected loop portions
JPH0758036A (ja) * 1993-08-16 1995-03-03 Ebara Corp 薄膜形成装置
TW331652B (en) 1995-06-16 1998-05-11 Ebara Corp Thin film vapor deposition apparatus
JPH0931656A (ja) 1995-07-24 1997-02-04 Ebara Corp 薄膜気相成長装置
US5818137A (en) * 1995-10-26 1998-10-06 Satcon Technology, Inc. Integrated magnetic levitation and rotation system
US5965047A (en) 1997-10-24 1999-10-12 Steag Ast Rapid thermal processing (RTP) system with rotating substrate

Also Published As

Publication number Publication date
EP1071118A2 (en) 2001-01-24
KR100726016B1 (ko) 2007-06-08
US6373159B1 (en) 2002-04-16
EP1071118B1 (en) 2008-09-24
TW517277B (en) 2003-01-11
EP1071118A3 (en) 2005-10-26
JP2001093967A (ja) 2001-04-06
DE60040320D1 (de) 2008-11-06
KR20010029971A (ko) 2001-04-16

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