JP3871486B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP3871486B2
JP3871486B2 JP37251099A JP37251099A JP3871486B2 JP 3871486 B2 JP3871486 B2 JP 3871486B2 JP 37251099 A JP37251099 A JP 37251099A JP 37251099 A JP37251099 A JP 37251099A JP 3871486 B2 JP3871486 B2 JP 3871486B2
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JP
Japan
Prior art keywords
lead
source
header
gate
mosfet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP37251099A
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English (en)
Japanese (ja)
Other versions
JP2000307017A (ja
JP2000307017A5 (enExample
Inventor
利宣 平島
宗久 岸本
俊幸 波多
靖司 ▲高▼橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
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Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP37251099A priority Critical patent/JP3871486B2/ja
Priority to US09/502,826 priority patent/US6479888B1/en
Publication of JP2000307017A publication Critical patent/JP2000307017A/ja
Priority to US10/265,324 priority patent/US6812554B2/en
Priority to US10/932,074 priority patent/US7160760B2/en
Publication of JP2000307017A5 publication Critical patent/JP2000307017A5/ja
Priority to US11/642,523 priority patent/US7385279B2/en
Application granted granted Critical
Publication of JP3871486B2 publication Critical patent/JP3871486B2/ja
Priority to US12/149,183 priority patent/US7812464B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10W74/014—
    • H10W70/415—
    • H10W70/481—
    • H10W74/016—
    • H10W72/07236—
    • H10W72/877—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/9445—
    • H10W74/00—
    • H10W90/726—
    • H10W90/736—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP37251099A 1999-02-17 1999-12-28 半導体装置 Expired - Fee Related JP3871486B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP37251099A JP3871486B2 (ja) 1999-02-17 1999-12-28 半導体装置
US09/502,826 US6479888B1 (en) 1999-02-17 2000-02-11 Semiconductor device and a method of manufacturing the same
US10/265,324 US6812554B2 (en) 1999-02-17 2002-10-07 Semiconductor device and a method of manufacturing the same
US10/932,074 US7160760B2 (en) 1999-02-17 2004-09-02 Semiconductor device and a method of manufacturing the same
US11/642,523 US7385279B2 (en) 1999-02-17 2006-12-21 Semiconductor device and a method of manufacturing the same
US12/149,183 US7812464B2 (en) 1999-02-17 2008-04-29 Semiconductor device and a method of manufacturing for high output MOSFET

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-38124 1999-02-17
JP3812499 1999-02-17
JP37251099A JP3871486B2 (ja) 1999-02-17 1999-12-28 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006065662A Division JP4450800B2 (ja) 1999-02-17 2006-03-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2000307017A JP2000307017A (ja) 2000-11-02
JP2000307017A5 JP2000307017A5 (enExample) 2005-01-20
JP3871486B2 true JP3871486B2 (ja) 2007-01-24

Family

ID=26377320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37251099A Expired - Fee Related JP3871486B2 (ja) 1999-02-17 1999-12-28 半導体装置

Country Status (2)

Country Link
US (5) US6479888B1 (enExample)
JP (1) JP3871486B2 (enExample)

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US6791172B2 (en) 2001-04-25 2004-09-14 General Semiconductor Of Taiwan, Ltd. Power semiconductor device manufactured using a chip-size package
US7323361B2 (en) * 2002-03-29 2008-01-29 Fairchild Semiconductor Corporation Packaging system for semiconductor devices
EP1357594A1 (en) * 2002-04-23 2003-10-29 General Semiconductor of Taiwan, Ltd. Power semiconductor device manufactured using a chip-size package
JP3780230B2 (ja) * 2002-07-03 2006-05-31 株式会社日立製作所 半導体モジュール及び電力変換装置
JP2004055812A (ja) * 2002-07-19 2004-02-19 Renesas Technology Corp 半導体装置
US8884361B2 (en) 2002-07-19 2014-11-11 Renesas Electronics Corporation Semiconductor device
US7061077B2 (en) * 2002-08-30 2006-06-13 Fairchild Semiconductor Corporation Substrate based unmolded package including lead frame structure and semiconductor die
US7312526B2 (en) * 2002-10-07 2007-12-25 Nxp B.V. Semiconductor device and method of manufacturing thereof
JP2004349347A (ja) * 2003-05-20 2004-12-09 Rohm Co Ltd 半導体装置
JP4819320B2 (ja) * 2003-05-28 2011-11-24 株式会社オクテック 半導体装置の製造方法
DE10329101A1 (de) * 2003-06-27 2005-01-27 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
JP4294405B2 (ja) * 2003-07-31 2009-07-15 株式会社ルネサステクノロジ 半導体装置
JP4628687B2 (ja) * 2004-03-09 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
US7196313B2 (en) * 2004-04-02 2007-03-27 Fairchild Semiconductor Corporation Surface mount multi-channel optocoupler
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JP4498170B2 (ja) * 2005-03-02 2010-07-07 三菱電機株式会社 半導体装置及びその製造方法
US7557432B2 (en) * 2005-03-30 2009-07-07 Stats Chippac Ltd. Thermally enhanced power semiconductor package system
US7230333B2 (en) 2005-04-21 2007-06-12 International Rectifier Corporation Semiconductor package
JP2006324320A (ja) * 2005-05-17 2006-11-30 Renesas Technology Corp 半導体装置
KR101297645B1 (ko) * 2005-06-30 2013-08-20 페어차일드 세미컨덕터 코포레이션 반도체 다이 패키지 및 그의 제조 방법
US7622796B2 (en) * 2005-09-13 2009-11-24 Alpha And Omega Semiconductor Limited Semiconductor package having a bridged plate interconnection
US20070075406A1 (en) * 2005-09-30 2007-04-05 Yueh-Se Ho Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die
TWI320594B (en) * 2006-05-04 2010-02-11 Cyntec Co Ltd Package structure
TW200836315A (en) * 2007-02-16 2008-09-01 Richtek Techohnology Corp Electronic package structure and method thereof
JP4871171B2 (ja) * 2007-02-28 2012-02-08 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
US20080237814A1 (en) * 2007-03-26 2008-10-02 National Semiconductor Corporation Isolated solder pads
GB2451077A (en) * 2007-07-17 2009-01-21 Zetex Semiconductors Plc Semiconductor chip package
JP2009043820A (ja) 2007-08-07 2009-02-26 Rohm Co Ltd 高効率モジュール
US7705476B2 (en) * 2007-11-06 2010-04-27 National Semiconductor Corporation Integrated circuit package
US20090160039A1 (en) * 2007-12-20 2009-06-25 National Semiconductor Corporation Method and leadframe for packaging integrated circuits
US7962631B2 (en) * 2007-12-21 2011-06-14 Yahoo! Inc. Method for determining network proximity for global traffic load balancing using passive TCP performance instrumentation
US20090245114A1 (en) * 2008-04-01 2009-10-01 Jayanth Vijayaraghavan Methods for collecting and analyzing network performance data
US8680658B2 (en) * 2008-05-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Conductive clip for semiconductor device package
US7960800B2 (en) * 2008-12-12 2011-06-14 Fairchild Semiconductor Corporation Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
US7973393B2 (en) 2009-02-04 2011-07-05 Fairchild Semiconductor Corporation Stacked micro optocouplers and methods of making the same
US9093391B2 (en) * 2009-09-17 2015-07-28 Stats Chippac Ltd. Integrated circuit packaging system with fan-in package and method of manufacture thereof
US20110075392A1 (en) * 2009-09-29 2011-03-31 Astec International Limited Assemblies and Methods for Directly Connecting Integrated Circuits to Electrically Conductive Sheets
JP5271861B2 (ja) * 2009-10-07 2013-08-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP2012054449A (ja) 2010-09-02 2012-03-15 Aisin Aw Co Ltd 電気的接続装置
JP5822468B2 (ja) * 2011-01-11 2015-11-24 ローム株式会社 半導体装置
US8304871B2 (en) * 2011-04-05 2012-11-06 Texas Instruments Incorporated Exposed die package for direct surface mounting
US9000576B2 (en) * 2011-04-22 2015-04-07 Cyntec Co., Ltd. Package structure and manufacturing method thereof
US8269330B1 (en) * 2011-04-22 2012-09-18 Cyntec Co., Ltd. MOSFET pair with stack capacitor and manufacturing method thereof
US20130075891A1 (en) * 2011-09-23 2013-03-28 Formosa Microsemi Co., Ltd. Flip chip type full wave rectification semiconductor device and its manufacturing method
JP2013149779A (ja) * 2012-01-19 2013-08-01 Semiconductor Components Industries Llc 半導体装置
EP2677540A1 (en) * 2012-06-19 2013-12-25 Nxp B.V. Electronic device and method of manufacturing the same
US8921986B2 (en) * 2013-03-15 2014-12-30 Microchip Technology Incorporated Insulated bump bonding
JP6394489B2 (ja) * 2015-05-11 2018-09-26 株式会社デンソー 半導体装置
JP6677616B2 (ja) * 2016-09-29 2020-04-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US10431538B2 (en) 2017-06-30 2019-10-01 Hamilton Sundstrand Corporation Transistor packages
EP3703119B1 (en) * 2017-10-26 2022-06-08 Shindengen Electric Manufacturing Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP7408804B2 (ja) * 2019-11-27 2024-01-05 ザ・ノコ・カンパニー 半導体デバイス、プリント回路基板（ｐｃｂ）、および電池管理システム（ｂｍｓ）における、パワー半導体デバイス（ｍｏｓｆｅｔ）の制御ピン（ゲートピン）をプリント回路基板（ｐｃｂ）にインターフェースする方法
US12080634B2 (en) * 2019-11-27 2024-09-03 The Noco Company Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)
US20230146758A1 (en) * 2020-03-30 2023-05-11 Rohm Co., Ltd. Semiconductor device
DE102020130617B4 (de) * 2020-11-19 2025-03-06 Infineon Technologies Ag Halbleiterpackages mit elektrischen Umverteilungsschichten unterschiedlicher Dicken und Verfahren zu deren Herstellung

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Also Published As

Publication number Publication date
US20050023671A1 (en) 2005-02-03
US6479888B1 (en) 2002-11-12
US6812554B2 (en) 2004-11-02
US7385279B2 (en) 2008-06-10
JP2000307017A (ja) 2000-11-02
US7160760B2 (en) 2007-01-09
US20030038360A1 (en) 2003-02-27
US20070158819A1 (en) 2007-07-12
US7812464B2 (en) 2010-10-12
US20080211082A1 (en) 2008-09-04

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