JP3856156B2 - セキュリティを強化した半導体素子，半導体回路構成，およびその製造方法 - Google Patents

セキュリティを強化した半導体素子，半導体回路構成，およびその製造方法 Download PDF

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Publication number
JP3856156B2
JP3856156B2 JP51392797A JP51392797A JP3856156B2 JP 3856156 B2 JP3856156 B2 JP 3856156B2 JP 51392797 A JP51392797 A JP 51392797A JP 51392797 A JP51392797 A JP 51392797A JP 3856156 B2 JP3856156 B2 JP 3856156B2
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Japan
Prior art keywords
semiconductor
circuit
semiconductor circuit
wafer
access
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Expired - Lifetime
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JP51392797A
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English (en)
Japanese (ja)
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JP2000500888A5 (enExample
JP2000500888A (ja
Inventor
ゴードン，コーラム
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Atmel Research
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Atmel Research
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    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/341—Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/355—Personalisation of cards for use
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31719—Security aspects, e.g. preventing unauthorised access during test

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Business, Economics & Management (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Accounting & Taxation (AREA)
  • Strategic Management (AREA)
  • General Business, Economics & Management (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
JP51392797A 1995-09-30 1996-09-19 セキュリティを強化した半導体素子，半導体回路構成，およびその製造方法 Expired - Lifetime JP3856156B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9519996.4 1995-09-30
GB9519996A GB2307783B (en) 1995-09-30 1995-09-30 Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof
PCT/EP1996/004105 WO1997013226A1 (en) 1995-09-30 1996-09-19 Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof

Publications (3)

Publication Number Publication Date
JP2000500888A JP2000500888A (ja) 2000-01-25
JP2000500888A5 JP2000500888A5 (enExample) 2004-07-29
JP3856156B2 true JP3856156B2 (ja) 2006-12-13

Family

ID=10781563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51392797A Expired - Lifetime JP3856156B2 (ja) 1995-09-30 1996-09-19 セキュリティを強化した半導体素子，半導体回路構成，およびその製造方法

Country Status (7)

Country Link
US (1) US6404217B1 (enExample)
EP (1) EP0855071B1 (enExample)
JP (1) JP3856156B2 (enExample)
CN (1) CN1198234A (enExample)
DE (1) DE69610109T2 (enExample)
GB (1) GB2307783B (enExample)
WO (1) WO1997013226A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19839807C1 (de) * 1998-09-01 1999-10-07 Siemens Ag Verfahren zum Betrieb einer integrierten Schaltung
US6624651B1 (en) * 2000-10-06 2003-09-23 International Business Machines Corporation Kerf circuit for modeling of BEOL capacitances
JP3726711B2 (ja) * 2001-05-31 2005-12-14 セイコーエプソン株式会社 半導体装置
JP2002373869A (ja) * 2001-06-13 2002-12-26 Mitsubishi Electric Corp 半導体チップ、シリコンウェハ、及び、半導体チップの製造方法
JP2003209147A (ja) * 2002-01-11 2003-07-25 Nec Microsystems Ltd チップ製造方法およびシステム
KR100487530B1 (ko) * 2002-07-26 2005-05-03 삼성전자주식회사 테스트 소자 그룹이 구비된 반도체 소자
GB0329516D0 (en) * 2003-12-19 2004-01-28 Univ Kent Canterbury Integrated circuit with debug support interface
DE102004014644A1 (de) * 2004-03-25 2005-10-13 Atmel Germany Gmbh Integrierter Schaltkreis
US8301890B2 (en) * 2006-08-10 2012-10-30 Inside Secure Software execution randomization
US7613907B2 (en) * 2006-08-11 2009-11-03 Atmel Corporation Embedded software camouflage against code reverse engineering
US7984301B2 (en) * 2006-08-17 2011-07-19 Inside Contactless S.A. Bi-processor architecture for secure systems
US7554865B2 (en) * 2006-09-21 2009-06-30 Atmel Corporation Randomizing current consumption in memory devices
US7563694B2 (en) * 2006-12-01 2009-07-21 Atmel Corporation Scribe based bond pads for integrated circuits
CN101950332B (zh) * 2010-07-12 2012-08-29 大唐微电子技术有限公司 芯片保护方法和系统
US10884951B2 (en) 2018-11-29 2021-01-05 Micron Technology, Inc. Memory disablement for data security
US20200350263A1 (en) * 2019-04-30 2020-11-05 Nxp B.V. Semiconductor devices with security features
US20200350220A1 (en) * 2019-04-30 2020-11-05 Nxp B.V. Semiconductor device with security features

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356379A (en) * 1978-01-13 1982-10-26 Burr-Brown Research Corporation Integrated heating element and method for thermal testing and compensation of integrated circuits
US4446475A (en) * 1981-07-10 1984-05-01 Motorola, Inc. Means and method for disabling access to a memory
US4439727A (en) * 1981-12-21 1984-03-27 Ibm Corporation Low capacitance pad for semiconductor chip testing
GB2206431B (en) * 1987-06-30 1991-05-29 Motorola Inc Data card circuits
US5285082A (en) * 1989-11-08 1994-02-08 U.S. Philips Corporation Integrated test circuits having pads provided along scribe lines
US5059899A (en) * 1990-08-16 1991-10-22 Micron Technology, Inc. Semiconductor dies and wafers and methods for making
EP0494782B1 (en) * 1991-01-11 1997-04-23 Texas Instruments Incorporated Wafer burn-in and test system and method of making the same
DE4120665A1 (de) 1991-06-22 1992-12-24 Teves Gmbh Alfred Elektromotorisch angetriebene hydraulikpumpe
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
JPH06230086A (ja) * 1992-09-22 1994-08-19 Nec Corp Ｌｓｉのテスト回路
SE501470C2 (sv) 1993-06-28 1995-02-20 Moelnlycke Ab Förfarande för att tillverka artiklar, såsom kompresser, operationskompresser eller liknande, samt medelst förfarandet tillverkad artikel
US5367763A (en) * 1993-09-30 1994-11-29 Atmel Corporation TAB testing of area array interconnected chips
JPH07169807A (ja) * 1993-12-16 1995-07-04 Nippondenso Co Ltd 半導体ウェハ
JP3529581B2 (ja) * 1997-03-14 2004-05-24 東芝マイクロエレクトロニクス株式会社 半導体ウェーハ及びｉｃカード
DE19839807C1 (de) * 1998-09-01 1999-10-07 Siemens Ag Verfahren zum Betrieb einer integrierten Schaltung

Also Published As

Publication number Publication date
EP0855071A1 (en) 1998-07-29
DE69610109D1 (de) 2000-10-05
CN1198234A (zh) 1998-11-04
GB9519996D0 (en) 1995-12-06
GB2307783B (en) 2000-04-05
WO1997013226A1 (en) 1997-04-10
US6404217B1 (en) 2002-06-11
DE69610109T2 (de) 2001-04-05
GB2307783A (en) 1997-06-04
EP0855071B1 (en) 2000-08-30
JP2000500888A (ja) 2000-01-25

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