JP2000500888A5 - - Google Patents
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- Publication number
- JP2000500888A5 JP2000500888A5 JP1997513927A JP51392797A JP2000500888A5 JP 2000500888 A5 JP2000500888 A5 JP 2000500888A5 JP 1997513927 A JP1997513927 A JP 1997513927A JP 51392797 A JP51392797 A JP 51392797A JP 2000500888 A5 JP2000500888 A5 JP 2000500888A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9519996.4 | 1995-09-30 | ||
| GB9519996A GB2307783B (en) | 1995-09-30 | 1995-09-30 | Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof |
| PCT/EP1996/004105 WO1997013226A1 (en) | 1995-09-30 | 1996-09-19 | Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000500888A JP2000500888A (ja) | 2000-01-25 |
| JP2000500888A5 true JP2000500888A5 (enExample) | 2004-07-29 |
| JP3856156B2 JP3856156B2 (ja) | 2006-12-13 |
Family
ID=10781563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51392797A Expired - Lifetime JP3856156B2 (ja) | 1995-09-30 | 1996-09-19 | セキュリティを強化した半導体素子，半導体回路構成，およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6404217B1 (enExample) |
| EP (1) | EP0855071B1 (enExample) |
| JP (1) | JP3856156B2 (enExample) |
| CN (1) | CN1198234A (enExample) |
| DE (1) | DE69610109T2 (enExample) |
| GB (1) | GB2307783B (enExample) |
| WO (1) | WO1997013226A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19839807C1 (de) * | 1998-09-01 | 1999-10-07 | Siemens Ag | Verfahren zum Betrieb einer integrierten Schaltung |
| US6624651B1 (en) * | 2000-10-06 | 2003-09-23 | International Business Machines Corporation | Kerf circuit for modeling of BEOL capacitances |
| JP3726711B2 (ja) * | 2001-05-31 | 2005-12-14 | セイコーエプソン株式会社 | 半導体装置 |
| JP2002373869A (ja) * | 2001-06-13 | 2002-12-26 | Mitsubishi Electric Corp | 半導体チップ、シリコンウェハ、及び、半導体チップの製造方法 |
| JP2003209147A (ja) * | 2002-01-11 | 2003-07-25 | Nec Microsystems Ltd | チップ製造方法およびシステム |
| KR100487530B1 (ko) * | 2002-07-26 | 2005-05-03 | 삼성전자주식회사 | 테스트 소자 그룹이 구비된 반도체 소자 |
| GB0329516D0 (en) * | 2003-12-19 | 2004-01-28 | Univ Kent Canterbury | Integrated circuit with debug support interface |
| DE102004014644A1 (de) * | 2004-03-25 | 2005-10-13 | Atmel Germany Gmbh | Integrierter Schaltkreis |
| US8301890B2 (en) * | 2006-08-10 | 2012-10-30 | Inside Secure | Software execution randomization |
| US7613907B2 (en) * | 2006-08-11 | 2009-11-03 | Atmel Corporation | Embedded software camouflage against code reverse engineering |
| US7984301B2 (en) * | 2006-08-17 | 2011-07-19 | Inside Contactless S.A. | Bi-processor architecture for secure systems |
| US7554865B2 (en) * | 2006-09-21 | 2009-06-30 | Atmel Corporation | Randomizing current consumption in memory devices |
| US7563694B2 (en) * | 2006-12-01 | 2009-07-21 | Atmel Corporation | Scribe based bond pads for integrated circuits |
| CN101950332B (zh) * | 2010-07-12 | 2012-08-29 | 大唐微电子技术有限公司 | 芯片保护方法和系统 |
| US10884951B2 (en) * | 2018-11-29 | 2021-01-05 | Micron Technology, Inc. | Memory disablement for data security |
| US20200350220A1 (en) * | 2019-04-30 | 2020-11-05 | Nxp B.V. | Semiconductor device with security features |
| US20200350263A1 (en) * | 2019-04-30 | 2020-11-05 | Nxp B.V. | Semiconductor devices with security features |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4356379A (en) * | 1978-01-13 | 1982-10-26 | Burr-Brown Research Corporation | Integrated heating element and method for thermal testing and compensation of integrated circuits |
| US4446475A (en) * | 1981-07-10 | 1984-05-01 | Motorola, Inc. | Means and method for disabling access to a memory |
| US4439727A (en) * | 1981-12-21 | 1984-03-27 | Ibm Corporation | Low capacitance pad for semiconductor chip testing |
| GB2206431B (en) * | 1987-06-30 | 1991-05-29 | Motorola Inc | Data card circuits |
| US5285082A (en) * | 1989-11-08 | 1994-02-08 | U.S. Philips Corporation | Integrated test circuits having pads provided along scribe lines |
| US5059899A (en) * | 1990-08-16 | 1991-10-22 | Micron Technology, Inc. | Semiconductor dies and wafers and methods for making |
| DE69219165T2 (de) * | 1991-01-11 | 1997-08-07 | Texas Instruments Inc | Prüf- und Einbrennsystem für einen Wafer und Methode für deren Herstellung |
| DE4120665A1 (de) | 1991-06-22 | 1992-12-24 | Teves Gmbh Alfred | Elektromotorisch angetriebene hydraulikpumpe |
| US5442282A (en) * | 1992-07-02 | 1995-08-15 | Lsi Logic Corporation | Testing and exercising individual, unsingulated dies on a wafer |
| JPH06230086A (ja) * | 1992-09-22 | 1994-08-19 | Nec Corp | Ｌｓｉのテスト回路 |
| SE501470C2 (sv) | 1993-06-28 | 1995-02-20 | Moelnlycke Ab | Förfarande för att tillverka artiklar, såsom kompresser, operationskompresser eller liknande, samt medelst förfarandet tillverkad artikel |
| US5367763A (en) * | 1993-09-30 | 1994-11-29 | Atmel Corporation | TAB testing of area array interconnected chips |
| JPH07169807A (ja) * | 1993-12-16 | 1995-07-04 | Nippondenso Co Ltd | 半導体ウェハ |
| JP3529581B2 (ja) * | 1997-03-14 | 2004-05-24 | 東芝マイクロエレクトロニクス株式会社 | 半導体ウェーハ及びｉｃカード |
| DE19839807C1 (de) * | 1998-09-01 | 1999-10-07 | Siemens Ag | Verfahren zum Betrieb einer integrierten Schaltung |
-
1995
- 1995-09-30 GB GB9519996A patent/GB2307783B/en not_active Expired - Lifetime
-
1996
- 1996-09-19 US US09/029,644 patent/US6404217B1/en not_active Expired - Lifetime
- 1996-09-19 JP JP51392797A patent/JP3856156B2/ja not_active Expired - Lifetime
- 1996-09-19 CN CN96197324A patent/CN1198234A/zh active Pending
- 1996-09-19 WO PCT/EP1996/004105 patent/WO1997013226A1/en not_active Ceased
- 1996-09-19 DE DE69610109T patent/DE69610109T2/de not_active Expired - Lifetime
- 1996-09-19 EP EP96932572A patent/EP0855071B1/en not_active Expired - Lifetime