DE69610109T2 - Halbleiterkomponente mit verbesserter sicherheit;halbleiterschaltkreisanordung und verfahren zur herstellung derselben - Google Patents

Halbleiterkomponente mit verbesserter sicherheit;halbleiterschaltkreisanordung und verfahren zur herstellung derselben

Info

Publication number
DE69610109T2
DE69610109T2 DE69610109T DE69610109T DE69610109T2 DE 69610109 T2 DE69610109 T2 DE 69610109T2 DE 69610109 T DE69610109 T DE 69610109T DE 69610109 T DE69610109 T DE 69610109T DE 69610109 T2 DE69610109 T2 DE 69610109T2
Authority
DE
Germany
Prior art keywords
semiconductor
circuitry
semiconductor circuit
circuit structure
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69610109T
Other languages
German (de)
English (en)
Other versions
DE69610109D1 (de
Inventor
Callum Gordon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amtel Corp
Original Assignee
Atmel Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Research filed Critical Atmel Research
Publication of DE69610109D1 publication Critical patent/DE69610109D1/de
Application granted granted Critical
Publication of DE69610109T2 publication Critical patent/DE69610109T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/341—Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/355—Personalisation of cards for use
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31719—Security aspects, e.g. preventing unauthorised access during test

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Accounting & Taxation (AREA)
  • General Business, Economics & Management (AREA)
  • Strategic Management (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
DE69610109T 1995-09-30 1996-09-19 Halbleiterkomponente mit verbesserter sicherheit;halbleiterschaltkreisanordung und verfahren zur herstellung derselben Expired - Lifetime DE69610109T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9519996A GB2307783B (en) 1995-09-30 1995-09-30 Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof
PCT/EP1996/004105 WO1997013226A1 (en) 1995-09-30 1996-09-19 Enhanced security semiconductor device, semiconductor circuit arrangement, and method of production thereof

Publications (2)

Publication Number Publication Date
DE69610109D1 DE69610109D1 (de) 2000-10-05
DE69610109T2 true DE69610109T2 (de) 2001-04-05

Family

ID=10781563

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69610109T Expired - Lifetime DE69610109T2 (de) 1995-09-30 1996-09-19 Halbleiterkomponente mit verbesserter sicherheit;halbleiterschaltkreisanordung und verfahren zur herstellung derselben

Country Status (7)

Country Link
US (1) US6404217B1 (enExample)
EP (1) EP0855071B1 (enExample)
JP (1) JP3856156B2 (enExample)
CN (1) CN1198234A (enExample)
DE (1) DE69610109T2 (enExample)
GB (1) GB2307783B (enExample)
WO (1) WO1997013226A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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DE19839807C1 (de) * 1998-09-01 1999-10-07 Siemens Ag Verfahren zum Betrieb einer integrierten Schaltung
US6624651B1 (en) * 2000-10-06 2003-09-23 International Business Machines Corporation Kerf circuit for modeling of BEOL capacitances
JP3726711B2 (ja) * 2001-05-31 2005-12-14 セイコーエプソン株式会社 半導体装置
JP2002373869A (ja) * 2001-06-13 2002-12-26 Mitsubishi Electric Corp 半導体チップ、シリコンウェハ、及び、半導体チップの製造方法
JP2003209147A (ja) * 2002-01-11 2003-07-25 Nec Microsystems Ltd チップ製造方法およびシステム
KR100487530B1 (ko) * 2002-07-26 2005-05-03 삼성전자주식회사 테스트 소자 그룹이 구비된 반도체 소자
GB0329516D0 (en) * 2003-12-19 2004-01-28 Univ Kent Canterbury Integrated circuit with debug support interface
DE102004014644A1 (de) * 2004-03-25 2005-10-13 Atmel Germany Gmbh Integrierter Schaltkreis
US8301890B2 (en) * 2006-08-10 2012-10-30 Inside Secure Software execution randomization
US7613907B2 (en) * 2006-08-11 2009-11-03 Atmel Corporation Embedded software camouflage against code reverse engineering
US7984301B2 (en) * 2006-08-17 2011-07-19 Inside Contactless S.A. Bi-processor architecture for secure systems
US7554865B2 (en) * 2006-09-21 2009-06-30 Atmel Corporation Randomizing current consumption in memory devices
US7563694B2 (en) * 2006-12-01 2009-07-21 Atmel Corporation Scribe based bond pads for integrated circuits
CN101950332B (zh) * 2010-07-12 2012-08-29 大唐微电子技术有限公司 芯片保护方法和系统
US10884951B2 (en) 2018-11-29 2021-01-05 Micron Technology, Inc. Memory disablement for data security
US20200350263A1 (en) * 2019-04-30 2020-11-05 Nxp B.V. Semiconductor devices with security features
US20200350220A1 (en) * 2019-04-30 2020-11-05 Nxp B.V. Semiconductor device with security features

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356379A (en) * 1978-01-13 1982-10-26 Burr-Brown Research Corporation Integrated heating element and method for thermal testing and compensation of integrated circuits
US4446475A (en) * 1981-07-10 1984-05-01 Motorola, Inc. Means and method for disabling access to a memory
US4439727A (en) * 1981-12-21 1984-03-27 Ibm Corporation Low capacitance pad for semiconductor chip testing
GB2206431B (en) * 1987-06-30 1991-05-29 Motorola Inc Data card circuits
US5285082A (en) * 1989-11-08 1994-02-08 U.S. Philips Corporation Integrated test circuits having pads provided along scribe lines
US5059899A (en) * 1990-08-16 1991-10-22 Micron Technology, Inc. Semiconductor dies and wafers and methods for making
EP0494782B1 (en) * 1991-01-11 1997-04-23 Texas Instruments Incorporated Wafer burn-in and test system and method of making the same
DE4120665A1 (de) 1991-06-22 1992-12-24 Teves Gmbh Alfred Elektromotorisch angetriebene hydraulikpumpe
US5442282A (en) * 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
JPH06230086A (ja) * 1992-09-22 1994-08-19 Nec Corp Ｌｓｉのテスト回路
SE501470C2 (sv) 1993-06-28 1995-02-20 Moelnlycke Ab Förfarande för att tillverka artiklar, såsom kompresser, operationskompresser eller liknande, samt medelst förfarandet tillverkad artikel
US5367763A (en) * 1993-09-30 1994-11-29 Atmel Corporation TAB testing of area array interconnected chips
JPH07169807A (ja) * 1993-12-16 1995-07-04 Nippondenso Co Ltd 半導体ウェハ
JP3529581B2 (ja) * 1997-03-14 2004-05-24 東芝マイクロエレクトロニクス株式会社 半導体ウェーハ及びｉｃカード
DE19839807C1 (de) * 1998-09-01 1999-10-07 Siemens Ag Verfahren zum Betrieb einer integrierten Schaltung

Also Published As

Publication number Publication date
JP3856156B2 (ja) 2006-12-13
GB9519996D0 (en) 1995-12-06
DE69610109D1 (de) 2000-10-05
JP2000500888A (ja) 2000-01-25
EP0855071A1 (en) 1998-07-29
EP0855071B1 (en) 2000-08-30
CN1198234A (zh) 1998-11-04
GB2307783A (en) 1997-06-04
WO1997013226A1 (en) 1997-04-10
GB2307783B (en) 2000-04-05
US6404217B1 (en) 2002-06-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AMTEL CORP., (N. D. GES. D. STAATES DELAWARE),, US