JP3826605B2 - 半導体装置の実装構造の製造方法、液晶装置、および電子機器 - Google Patents
半導体装置の実装構造の製造方法、液晶装置、および電子機器 Download PDFInfo
- Publication number
- JP3826605B2 JP3826605B2 JP06045999A JP6045999A JP3826605B2 JP 3826605 B2 JP3826605 B2 JP 3826605B2 JP 06045999 A JP06045999 A JP 06045999A JP 6045999 A JP6045999 A JP 6045999A JP 3826605 B2 JP3826605 B2 JP 3826605B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- electrode
- substrate
- bump
- crystal device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/1147—Manufacturing methods using a lift-off mask
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
- H01L2224/13017—Shape in side view being non uniform along the bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06045999A JP3826605B2 (ja) | 1999-03-08 | 1999-03-08 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
| TW089103081A TW444300B (en) | 1999-03-08 | 2000-02-22 | Semiconductor device, structure for mounting the semiconductor device, liquid crystal device, and electronic equipment |
| US09/519,436 US6448663B1 (en) | 1999-03-08 | 2000-03-03 | Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
| KR10-2000-0010619A KR100516597B1 (ko) | 1999-03-08 | 2000-03-03 | 반도체 장치, 반도체 장치의 실장 구조, 액정 장치 및 전자 기기 |
| CNB001041207A CN1181542C (zh) | 1999-03-08 | 2000-03-07 | 半导体装置、半导体装置的安装结构、液晶装置和电子装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06045999A JP3826605B2 (ja) | 1999-03-08 | 1999-03-08 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000260798A JP2000260798A (ja) | 2000-09-22 |
| JP2000260798A5 JP2000260798A5 (enExample) | 2005-02-24 |
| JP3826605B2 true JP3826605B2 (ja) | 2006-09-27 |
Family
ID=13142881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06045999A Expired - Lifetime JP3826605B2 (ja) | 1999-03-08 | 1999-03-08 | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6448663B1 (enExample) |
| JP (1) | JP3826605B2 (enExample) |
| KR (1) | KR100516597B1 (enExample) |
| CN (1) | CN1181542C (enExample) |
| TW (1) | TW444300B (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI240241B (en) * | 2000-05-04 | 2005-09-21 | Koninkl Philips Electronics Nv | Assembly of a display device and an illumination system |
| US6642613B1 (en) * | 2000-05-09 | 2003-11-04 | National Semiconductor Corporation | Techniques for joining an opto-electronic module to a semiconductor package |
| US6995753B2 (en) * | 2000-06-06 | 2006-02-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method of manufacturing the same |
| JP3892650B2 (ja) | 2000-07-25 | 2007-03-14 | 株式会社日立製作所 | 液晶表示装置 |
| JP3781967B2 (ja) * | 2000-12-25 | 2006-06-07 | 株式会社日立製作所 | 表示装置 |
| JP3756418B2 (ja) * | 2001-02-28 | 2006-03-15 | 株式会社日立製作所 | 液晶表示装置及びその製造方法 |
| US6806938B2 (en) * | 2001-08-30 | 2004-10-19 | Kyocera Corporation | Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device |
| JP2003121815A (ja) * | 2001-10-16 | 2003-04-23 | Nec Access Technica Ltd | Lcdの保持構造 |
| JP3573150B2 (ja) | 2002-01-25 | 2004-10-06 | セイコーエプソン株式会社 | 半導体装置及びこれを含む電気光学装置 |
| KR100499134B1 (ko) * | 2002-10-28 | 2005-07-04 | 삼성전자주식회사 | 압축 접합 방법 |
| JP2004184805A (ja) * | 2002-12-05 | 2004-07-02 | Tohoku Pioneer Corp | 導電配線の接続構造 |
| KR20040075377A (ko) * | 2003-02-20 | 2004-08-30 | 삼성전자주식회사 | 구동 아이씨 및 이를 갖는 디스플레이 장치 |
| CN1325983C (zh) * | 2003-05-27 | 2007-07-11 | 友达光电股份有限公司 | 液晶显示面板的封装结构及其制作工艺 |
| JP4004994B2 (ja) | 2003-06-05 | 2007-11-07 | 株式会社アドバンスト・ディスプレイ | 表示装置 |
| CN100356559C (zh) * | 2003-09-24 | 2007-12-19 | 财团法人工业技术研究院 | 倒装芯片封装结构及其制造方法 |
| TWI277815B (en) * | 2004-01-16 | 2007-04-01 | Hannstar Display Corp | Liquid crystal display and manufacturing method of liquid crystal display including substrate |
| CN100416343C (zh) * | 2004-01-21 | 2008-09-03 | 友达光电股份有限公司 | 增加金属连线可靠度的结构 |
| CN1297840C (zh) * | 2004-03-25 | 2007-01-31 | 友达光电股份有限公司 | 显示器的导线结构 |
| US7767516B2 (en) * | 2005-05-31 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device, manufacturing method thereof, and manufacturing method of antenna |
| JP4851255B2 (ja) * | 2006-07-14 | 2012-01-11 | 株式会社 日立ディスプレイズ | 表示装置 |
| JP4920330B2 (ja) * | 2006-07-18 | 2012-04-18 | ソニー株式会社 | 実装構造体の実装方法、発光ダイオードディスプレイの実装方法、発光ダイオードバックライトの実装方法および電子機器の実装方法 |
| JP2008235556A (ja) * | 2007-03-20 | 2008-10-02 | Sumitomo Electric Ind Ltd | 配線板モジュール及び該配線板モジュールの製造方法 |
| KR101285273B1 (ko) * | 2007-06-15 | 2013-07-23 | 엘지디스플레이 주식회사 | 이동통신기기 |
| CN101216619B (zh) * | 2008-01-10 | 2010-09-22 | 友达光电股份有限公司 | 平面显示器及其制造方法和光电装置及其制造方法 |
| CN101556838B (zh) * | 2008-04-09 | 2011-06-01 | 北京京东方光电科技有限公司 | 各向异性导电膜 |
| TW201123377A (en) * | 2009-12-16 | 2011-07-01 | Raydium Semiconductor Corp | Electronic chip and substrate with void |
| US9142533B2 (en) * | 2010-05-20 | 2015-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate interconnections having different sizes |
| KR101375298B1 (ko) * | 2011-12-20 | 2014-03-19 | 제일모직주식회사 | 전도성 미립자 및 이를 포함하는 이방 전도성 필름 |
| US9646923B2 (en) | 2012-04-17 | 2017-05-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices |
| US9425136B2 (en) | 2012-04-17 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conical-shaped or tier-shaped pillar connections |
| US9299674B2 (en) | 2012-04-18 | 2016-03-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump-on-trace interconnect |
| US9111817B2 (en) | 2012-09-18 | 2015-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump structure and method of forming same |
| US8950011B2 (en) | 2013-05-22 | 2015-02-03 | International Business Machines Corporation | Targeted sequencing of biomolecules by pulling through a liquid-liquid interface with an atomic force microscope |
| JP6645730B2 (ja) * | 2014-01-28 | 2020-02-14 | デクセリアルズ株式会社 | 接続体及び接続体の製造方法 |
| KR20150094125A (ko) * | 2014-02-10 | 2015-08-19 | 한국전자통신연구원 | 반도체 소자 및 이를 제조하는 방법 |
| JP6476747B2 (ja) * | 2014-10-28 | 2019-03-06 | デクセリアルズ株式会社 | 異方性導電フィルム及び接続構造体 |
| US10170403B2 (en) * | 2014-12-17 | 2019-01-01 | Kinsus Interconnect Technology Corp. | Ameliorated compound carrier board structure of flip-chip chip-scale package |
| WO2016190197A1 (ja) * | 2015-05-22 | 2016-12-01 | シャープ株式会社 | 半導体装置 |
| CN106486511B (zh) * | 2015-08-25 | 2020-04-28 | 上海和辉光电有限公司 | 一种显示器件及制备有机发光二极管显示面板的方法 |
| TWI696300B (zh) * | 2016-03-15 | 2020-06-11 | 晶元光電股份有限公司 | 半導體裝置及其製造方法 |
| JP6769721B2 (ja) * | 2016-03-25 | 2020-10-14 | デクセリアルズ株式会社 | 電子部品、異方性接続構造体、電子部品の設計方法 |
| KR102761525B1 (ko) * | 2016-12-07 | 2025-02-04 | 서울바이오시스 주식회사 | 디스플레이 장치 및 그의 전극 연결 방법 |
| US11444048B2 (en) * | 2017-10-05 | 2022-09-13 | Texas Instruments Incorporated | Shaped interconnect bumps in semiconductor devices |
| CN109037998B (zh) * | 2018-08-08 | 2020-06-05 | 武汉华星光电半导体显示技术有限公司 | 电连接组件及显示装置、电连接方法 |
| US11139262B2 (en) | 2019-02-07 | 2021-10-05 | Micron Technology, Inc. | Use of pre-channeled materials for anisotropic conductors |
| US20200411416A1 (en) * | 2019-06-27 | 2020-12-31 | Texas Instruments Incorporated | Method of making a semiconductor package having projections |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5226232A (en) * | 1990-05-18 | 1993-07-13 | Hewlett-Packard Company | Method for forming a conductive pattern on an integrated circuit |
| JP3152796B2 (ja) * | 1993-05-28 | 2001-04-03 | 株式会社東芝 | 半導体装置およびその製造方法 |
| JP3225800B2 (ja) * | 1995-08-09 | 2001-11-05 | 三菱電機株式会社 | 半導体装置 |
| KR100232678B1 (ko) * | 1996-12-18 | 1999-12-01 | 구본준 | 돌기가 형성된 범프 및 그 제조방법 |
| US5903056A (en) * | 1997-04-21 | 1999-05-11 | Lucent Technologies Inc. | Conductive polymer film bonding technique |
-
1999
- 1999-03-08 JP JP06045999A patent/JP3826605B2/ja not_active Expired - Lifetime
-
2000
- 2000-02-22 TW TW089103081A patent/TW444300B/zh not_active IP Right Cessation
- 2000-03-03 US US09/519,436 patent/US6448663B1/en not_active Expired - Lifetime
- 2000-03-03 KR KR10-2000-0010619A patent/KR100516597B1/ko not_active Expired - Lifetime
- 2000-03-07 CN CNB001041207A patent/CN1181542C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR20000071406A (ko) | 2000-11-25 |
| KR100516597B1 (ko) | 2005-09-22 |
| JP2000260798A (ja) | 2000-09-22 |
| US6448663B1 (en) | 2002-09-10 |
| CN1181542C (zh) | 2004-12-22 |
| US20020100974A1 (en) | 2002-08-01 |
| TW444300B (en) | 2001-07-01 |
| CN1266283A (zh) | 2000-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3826605B2 (ja) | 半導体装置の実装構造の製造方法、液晶装置、および電子機器 | |
| JP3139549B2 (ja) | アクティブマトリクス型液晶表示装置 | |
| US6542374B1 (en) | Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board | |
| CN100349044C (zh) | 显示装置及其制造方法 | |
| KR20090058987A (ko) | 액정표시장치의 제조방법 및 액정표시장치의 필름 캐리어테이프 제조방법 | |
| JP2000260798A5 (enExample) | ||
| JP2007041389A (ja) | 表示装置及びその製造方法 | |
| JP3933094B2 (ja) | 電子部品の実装方法 | |
| CN1171117C (zh) | 电光装置、电光装置的制造方法及电子装置 | |
| TWI292073B (enExample) | ||
| US6741315B1 (en) | Liquid crystal device and electronic apparatus | |
| JP4103835B2 (ja) | 電子部品の製造方法 | |
| US20070076577A1 (en) | Mount Structure, Electro-Optical Device, Method of Manufacturing Electro-Optical Device, and Electronic Apparatus | |
| JP2000284261A (ja) | 液晶装置及び電子機器 | |
| CN114173467A (zh) | 印刷电路基板、显示装置以及显示装置的制造方法 | |
| JP2001318619A (ja) | 電気光学装置、電気光学装置の製造方法および電子機器 | |
| JP2001154601A (ja) | 表示装置及び電子機器 | |
| KR102900575B1 (ko) | 인쇄 회로 기판, 표시 장치 및 표시 장치 제조 방법 | |
| JPS60225120A (ja) | 液晶表示装置 | |
| JP3675185B2 (ja) | 配線基板、液晶装置及び電子機器 | |
| JP4267870B2 (ja) | 表示装置の製造方法 | |
| JP3760624B2 (ja) | 液晶表示装置およびそれを利用した電子機器 | |
| JP2000275672A (ja) | 液晶装置、液晶装置の製造方法及び電子機器 | |
| JP2594874Y2 (ja) | 液晶表示装置 | |
| KR20230145843A (ko) | 칩-온-필름 반도체 패키지 및 이를 포함하는 디스플레이 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040318 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040318 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041018 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060314 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060512 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060613 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060626 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100714 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110714 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110714 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120714 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120714 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130714 Year of fee payment: 7 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |