JP3821171B2 - 検査装置及び検査方法 - Google Patents
検査装置及び検査方法 Download PDFInfo
- Publication number
- JP3821171B2 JP3821171B2 JP28247196A JP28247196A JP3821171B2 JP 3821171 B2 JP3821171 B2 JP 3821171B2 JP 28247196 A JP28247196 A JP 28247196A JP 28247196 A JP28247196 A JP 28247196A JP 3821171 B2 JP3821171 B2 JP 3821171B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- group
- terminals
- terminal
- electrical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title claims description 103
- 238000000034 method Methods 0.000 title claims description 63
- 239000000523 sample Substances 0.000 claims description 180
- 239000004020 conductor Substances 0.000 claims description 29
- 238000012544 monitoring process Methods 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 14
- 238000005259 measurement Methods 0.000 description 20
- 230000008859 change Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 16
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- 238000012360 testing method Methods 0.000 description 8
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- 230000003321 amplification Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 101001117317 Homo sapiens Programmed cell death 1 ligand 1 Proteins 0.000 description 1
- 102100024216 Programmed cell death 1 ligand 1 Human genes 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
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- 238000003909 pattern recognition Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28247196A JP3821171B2 (ja) | 1995-11-10 | 1996-10-24 | 検査装置及び検査方法 |
| EP96117953A EP0773445A3 (en) | 1995-11-10 | 1996-11-08 | Inspection apparatus of conductive patterns |
| US09/186,692 US6160409A (en) | 1995-11-10 | 1998-11-06 | Inspection method of conductive patterns |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7-317302 | 1995-11-10 | ||
| JP31730295 | 1995-11-10 | ||
| JP8-104150 | 1996-03-28 | ||
| JP8-104149 | 1996-03-28 | ||
| JP10415096 | 1996-03-28 | ||
| JP10414996 | 1996-03-28 | ||
| JP28247196A JP3821171B2 (ja) | 1995-11-10 | 1996-10-24 | 検査装置及び検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH09318662A JPH09318662A (ja) | 1997-12-12 |
| JPH09318662A5 JPH09318662A5 (enExample) | 2004-10-21 |
| JP3821171B2 true JP3821171B2 (ja) | 2006-09-13 |
Family
ID=27469186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28247196A Expired - Fee Related JP3821171B2 (ja) | 1995-11-10 | 1996-10-24 | 検査装置及び検査方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6160409A (enExample) |
| EP (1) | EP0773445A3 (enExample) |
| JP (1) | JP3821171B2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3214415B2 (ja) * | 1997-10-30 | 2001-10-02 | 日本電産リード株式会社 | 基板検査装置および基板検査方法 |
| US6456099B1 (en) * | 1998-12-31 | 2002-09-24 | Formfactor, Inc. | Special contact points for accessing internal circuitry of an integrated circuit |
| KR100548103B1 (ko) * | 1998-12-31 | 2006-02-02 | 폼팩터, 인크. | 반도체 제품 다이 테스트용 테스트 다이를 포함하는테스트 장치 및 반도체 제품 다이 테스트 방법 |
| US6191600B1 (en) * | 1999-01-22 | 2001-02-20 | Delaware Capital Formation, Inc. | Scan test apparatus for continuity testing of bare printed circuit boards |
| KR100368075B1 (ko) * | 2000-02-07 | 2003-01-15 | 마이크로 인스펙션 주식회사 | 로울링 와이어 프로브를 이용한 스캔방식의 검사장치 및방법 |
| JP2002156417A (ja) * | 2000-11-17 | 2002-05-31 | Oht Inc | 回路基板の検査装置及び検査方法 |
| JP2002156399A (ja) * | 2000-11-17 | 2002-05-31 | Oht Inc | 回路基板の検査装置及び検査方法 |
| US6791344B2 (en) * | 2000-12-28 | 2004-09-14 | International Business Machines Corporation | System for and method of testing a microelectronic device using a dual probe technique |
| US6631556B2 (en) * | 2001-05-30 | 2003-10-14 | Intel Corporation | Fixture to couple an integrated circuit to a circuit board |
| US6788078B2 (en) | 2001-11-16 | 2004-09-07 | Delaware Capital Formation, Inc. | Apparatus for scan testing printed circuit boards |
| JP2003344474A (ja) * | 2002-05-27 | 2003-12-03 | Oht Inc | 検査装置及び検査方法 |
| WO2007143647A2 (en) * | 2006-06-05 | 2007-12-13 | Visicon Inspection Technologies Llc | Stent inspection system |
| US20080144918A1 (en) * | 2006-09-21 | 2008-06-19 | Kan Li | System and method for tube scarf detection |
| JP4861860B2 (ja) * | 2007-03-08 | 2012-01-25 | 新光電気工業株式会社 | プリント基板検査用治具及びプリント基板検査装置 |
| JP4843071B2 (ja) * | 2009-06-04 | 2011-12-21 | マイクロクラフト株式会社 | プリント配線板の検査装置及び検査方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1538131A1 (de) * | 1965-01-23 | 1969-09-25 | Sacer Dipl Ing F Joze | Planungsverfahren zur Ausgestaltung eines elektrischen Netzes |
| US3562643A (en) * | 1969-01-21 | 1971-02-09 | Ostby & Barton Co | Spring loaded test probe assembly |
| CA1038042A (en) * | 1975-03-03 | 1978-09-05 | Motorola | Programmable probe fixture and method of connecting units under test with test equipment |
| US4035722A (en) | 1975-03-17 | 1977-07-12 | Anatoly Leonidovich Ryabov | Multiprobe head for checking electrical parameters of semiconductor instruments and microcircuits |
| US4342957A (en) * | 1980-03-28 | 1982-08-03 | Honeywell Information Systems Inc. | Automatic test equipment test probe contact isolation detection apparatus and method |
| US4342958A (en) * | 1980-03-28 | 1982-08-03 | Honeywell Information Systems Inc. | Automatic test equipment test probe contact isolation detection method |
| US4471298A (en) * | 1981-12-11 | 1984-09-11 | Cirdyne, Inc. | Apparatus for automatically electrically testing printed circuit boards |
| US4565966A (en) * | 1983-03-07 | 1986-01-21 | Kollmorgen Technologies Corporation | Method and apparatus for testing of electrical interconnection networks |
| JPH0619404B2 (ja) * | 1988-06-17 | 1994-03-16 | 共栄制御機器株式会社 | 液晶電極基板の通電検出装置 |
| JPH02168164A (ja) * | 1988-12-22 | 1990-06-28 | Nec Corp | プローブ |
| US5214375A (en) * | 1989-02-06 | 1993-05-25 | Giga Probe, Inc. | Multi-point probe assembly for testing electronic device |
| US5006808A (en) * | 1989-03-21 | 1991-04-09 | Bath Scientific Limited | Testing electrical circuits |
| JPH03113375A (ja) * | 1989-09-28 | 1991-05-14 | Nec Kyushu Ltd | プローブ |
| US5003254A (en) * | 1989-11-02 | 1991-03-26 | Huntron, Inc. | Multi-axis universal circuit board test fixture |
| US5408189A (en) * | 1990-05-25 | 1995-04-18 | Everett Charles Technologies, Inc. | Test fixture alignment system for printed circuit boards |
| DE9014236U1 (de) * | 1990-10-13 | 1990-12-20 | Feinmetall Gmbh, 7033 Herrenberg | Kontaktiervorrichtung für die elektrische Verbindung einer Prüfeinrichtung mit einem Prüfling |
| JPH05196681A (ja) * | 1991-06-26 | 1993-08-06 | Digital Equip Corp <Dec> | 連続移動する電気回路の相互接続試験方法及び装置 |
| US5256975A (en) * | 1992-06-01 | 1993-10-26 | Digital Equipment Corporation | Manually-operated continuity/shorts test probe for bare interconnection packages |
| US5357191A (en) * | 1992-11-09 | 1994-10-18 | Probot, Inc. | Method and apparatus for testing circuit boards |
| US5420500A (en) * | 1992-11-25 | 1995-05-30 | Hewlett-Packard Company | Pacitive electrode system for detecting open solder joints in printed circuit assemblies |
| TW227644B (enExample) * | 1992-12-18 | 1994-08-01 | Tesukon Kk | |
| US5467020A (en) * | 1994-03-29 | 1995-11-14 | International Business Machines Corporation | Testing fixture and method for circuit traces on a flexible substrate |
| US5461324A (en) * | 1994-08-08 | 1995-10-24 | International Business Machines Corporation | Split-fixture configuration and method for testing circuit traces on a flexible substrate |
| JPH08189939A (ja) * | 1995-01-10 | 1996-07-23 | Iwaki Electron Corp Ltd | プロービング特性試験装置 |
-
1996
- 1996-10-24 JP JP28247196A patent/JP3821171B2/ja not_active Expired - Fee Related
- 1996-11-08 EP EP96117953A patent/EP0773445A3/en not_active Withdrawn
-
1998
- 1998-11-06 US US09/186,692 patent/US6160409A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09318662A (ja) | 1997-12-12 |
| EP0773445A3 (en) | 1999-08-25 |
| US6160409A (en) | 2000-12-12 |
| EP0773445A2 (en) | 1997-05-14 |
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