JP3782869B2 - 錫−銀合金めっき浴 - Google Patents

錫−銀合金めっき浴 Download PDF

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Publication number
JP3782869B2
JP3782869B2 JP18895397A JP18895397A JP3782869B2 JP 3782869 B2 JP3782869 B2 JP 3782869B2 JP 18895397 A JP18895397 A JP 18895397A JP 18895397 A JP18895397 A JP 18895397A JP 3782869 B2 JP3782869 B2 JP 3782869B2
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JP
Japan
Prior art keywords
silver
tin
acid
group
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP18895397A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1121693A (ja
JPH1121693A5 (https=
Inventor
征史 正木
孝夫 武内
哲也 近藤
惠吾 小幡
和博 青木
秀美 縄舟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Fine Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Daiwa Fine Chemicals Co Ltd filed Critical Ishihara Chemical Co Ltd
Priority to JP18895397A priority Critical patent/JP3782869B2/ja
Publication of JPH1121693A publication Critical patent/JPH1121693A/ja
Publication of JPH1121693A5 publication Critical patent/JPH1121693A5/ja
Application granted granted Critical
Publication of JP3782869B2 publication Critical patent/JP3782869B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
JP18895397A 1997-07-01 1997-07-01 錫−銀合金めっき浴 Expired - Lifetime JP3782869B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18895397A JP3782869B2 (ja) 1997-07-01 1997-07-01 錫−銀合金めっき浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18895397A JP3782869B2 (ja) 1997-07-01 1997-07-01 錫−銀合金めっき浴

Publications (3)

Publication Number Publication Date
JPH1121693A JPH1121693A (ja) 1999-01-26
JPH1121693A5 JPH1121693A5 (https=) 2004-08-19
JP3782869B2 true JP3782869B2 (ja) 2006-06-07

Family

ID=16232819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18895397A Expired - Lifetime JP3782869B2 (ja) 1997-07-01 1997-07-01 錫−銀合金めっき浴

Country Status (1)

Country Link
JP (1) JP3782869B2 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
JP3352422B2 (ja) 1999-02-10 2002-12-03 セントラル硝子株式会社 銀被膜形成用薬液および銀被膜形成方法
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP3181571B2 (ja) * 2000-01-27 2001-07-03 日本エレクトロプレイテイング・エンジニヤース株式会社 金メッキ液及びそれを用いた金メッキ方法
DE10026680C1 (de) * 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
US6448281B1 (en) 2000-07-06 2002-09-10 Boehringer Ingelheim (Canada) Ltd. Viral polymerase inhibitors
FR2825764B1 (fr) * 2001-06-07 2003-09-19 Hispano Suiza Sa Palier lisse muni d'un revetement de frottement et procede de realisation
US7273540B2 (en) 2002-07-25 2007-09-25 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
AU2003252677A1 (en) * 2002-07-25 2004-02-16 Shinryo Electronics Co., Ltd. Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
JP3741709B1 (ja) * 2005-02-07 2006-02-01 Ｆｃｍ株式会社 Ｓｎ−Ａｇ−Ｃｕ三元合金薄膜を形成する方法
WO2006043578A1 (ja) * 2004-10-21 2006-04-27 Fcm Co., Ltd. 基材上にＳｎ－Ａｇ－Ｃｕ三元合金薄膜を形成する方法
JP4756887B2 (ja) * 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金電気メッキ浴
JP4756886B2 (ja) * 2005-03-22 2011-08-24 石原薬品株式会社 非シアン系のスズ−銀合金メッキ浴
US7713859B2 (en) * 2005-08-15 2010-05-11 Enthone Inc. Tin-silver solder bumping in electronics manufacture
EP1918426A1 (de) 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気錫めっき液および電気錫めっき方法
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
JP2017025382A (ja) * 2015-07-23 2017-02-02 奥野製薬工業株式会社 黒色光沢スズ−ニッケル合金めっき浴、スズ−ニッケル合金めっき方法、黒色光沢スズ−ニッケル合金めっき皮膜及び該皮膜を有する物品
JP7009679B2 (ja) * 2015-07-29 2022-01-26 石原ケミカル株式会社 電気スズ及び電気スズ合金メッキ浴、当該メッキ浴を用いた電着物の形成方法
JP6834070B2 (ja) * 2016-06-13 2021-02-24 石原ケミカル株式会社 電気スズ及びスズ合金メッキ浴、当該メッキ浴を用いて電着物を形成した電子部品の製造方法

Also Published As

Publication number Publication date
JPH1121693A (ja) 1999-01-26

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