JP3655181B2 - 半導体装置およびそのパッケージ - Google Patents

半導体装置およびそのパッケージ Download PDF

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Publication number
JP3655181B2
JP3655181B2 JP2000295921A JP2000295921A JP3655181B2 JP 3655181 B2 JP3655181 B2 JP 3655181B2 JP 2000295921 A JP2000295921 A JP 2000295921A JP 2000295921 A JP2000295921 A JP 2000295921A JP 3655181 B2 JP3655181 B2 JP 3655181B2
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Prior art keywords
metal
electrode
layer
semiconductor device
electrode layer
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JP2000295921A
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English (en)
Japanese (ja)
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JP2002110981A (ja
JP2002110981A5 (enExample
Inventor
月 繁 雄 上
本 孝 朗 江
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Toshiba Corp
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Toshiba Corp
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Priority to JP2000295921A priority Critical patent/JP3655181B2/ja
Priority to US10/020,928 priority patent/US20030111739A1/en
Publication of JP2002110981A publication Critical patent/JP2002110981A/ja
Publication of JP2002110981A5 publication Critical patent/JP2002110981A5/ja
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US7193326B2 (en) 2003-06-23 2007-03-20 Denso Corporation Mold type semiconductor device
JP4857520B2 (ja) * 2004-01-07 2012-01-18 トヨタ自動車株式会社 バイポーラ半導体装置及びその製造方法
JP4628687B2 (ja) * 2004-03-09 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
JP2005303218A (ja) * 2004-04-16 2005-10-27 Renesas Technology Corp 半導体装置およびその製造方法
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US8390131B2 (en) 2004-06-03 2013-03-05 International Rectifier Corporation Semiconductor device with reduced contact resistance
US7678680B2 (en) * 2004-06-03 2010-03-16 International Rectifier Corporation Semiconductor device with reduced contact resistance
KR100844630B1 (ko) * 2006-03-29 2008-07-07 산요덴키가부시키가이샤 반도체 장치
JP4593526B2 (ja) * 2006-06-09 2010-12-08 株式会社デンソー 半導体装置のスクリーニング方法および半導体装置
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DE102014116082A1 (de) * 2014-11-04 2016-05-04 Infineon Technologies Ag Halbleitervorrichtung mit einer spannungskompensierten Chipelelektrode
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