JP3649393B2 - シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック - Google Patents

シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック Download PDF

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Publication number
JP3649393B2
JP3649393B2 JP2001272356A JP2001272356A JP3649393B2 JP 3649393 B2 JP3649393 B2 JP 3649393B2 JP 2001272356 A JP2001272356 A JP 2001272356A JP 2001272356 A JP2001272356 A JP 2001272356A JP 3649393 B2 JP3649393 B2 JP 3649393B2
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Japan
Prior art keywords
silicon
silicon wafer
processing
polishing
block
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Expired - Lifetime
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JP2001272356A
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English (en)
Japanese (ja)
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JP2002176014A (ja
JP2002176014A5 (enExample
Inventor
公彦 梶本
順三 涌田
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Sharp Corp
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Sharp Corp
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Priority to JP2001272356A priority Critical patent/JP3649393B2/ja
Priority to US09/956,113 priority patent/US6679759B2/en
Priority to DE10147761A priority patent/DE10147761B4/de
Publication of JP2002176014A publication Critical patent/JP2002176014A/ja
Priority to US10/716,661 priority patent/US20040102139A1/en
Application granted granted Critical
Publication of JP3649393B2 publication Critical patent/JP3649393B2/ja
Publication of JP2002176014A5 publication Critical patent/JP2002176014A5/ja
Priority to US11/341,440 priority patent/US7637801B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B25/00—Grinding machines of universal type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Photovoltaic Devices (AREA)
JP2001272356A 2000-09-28 2001-09-07 シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック Expired - Lifetime JP3649393B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001272356A JP3649393B2 (ja) 2000-09-28 2001-09-07 シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック
US09/956,113 US6679759B2 (en) 2000-09-28 2001-09-20 Method of manufacturing silicon wafer
DE10147761A DE10147761B4 (de) 2000-09-28 2001-09-27 Verfahren zum Herstellen von Siliciumwafern
US10/716,661 US20040102139A1 (en) 2000-09-28 2003-11-20 Method of manufacturing silicon wafer
US11/341,440 US7637801B2 (en) 2000-09-28 2006-01-30 Method of making solar cell

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000296628 2000-09-28
JP2000-296628 2000-09-28
JP2001272356A JP3649393B2 (ja) 2000-09-28 2001-09-07 シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2003311423A Division JP3648239B2 (ja) 2000-09-28 2003-09-03 シリコンウエハの製造方法
JP2004264349A Division JP2004356657A (ja) 2000-09-28 2004-09-10 シリコンウエハの加工方法

Publications (3)

Publication Number Publication Date
JP2002176014A JP2002176014A (ja) 2002-06-21
JP3649393B2 true JP3649393B2 (ja) 2005-05-18
JP2002176014A5 JP2002176014A5 (enExample) 2005-06-30

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JP2001272356A Expired - Lifetime JP3649393B2 (ja) 2000-09-28 2001-09-07 シリコンウエハの加工方法、シリコンウエハおよびシリコンブロック

Country Status (3)

Country Link
US (2) US6679759B2 (enExample)
JP (1) JP3649393B2 (enExample)
DE (1) DE10147761B4 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7637801B2 (en) 2000-09-28 2009-12-29 Sharp Kabushiki Kaisha Method of making solar cell
JP2003069055A (ja) * 2001-06-13 2003-03-07 Sharp Corp 太陽電池セルとその製造方法
JP2004127987A (ja) * 2002-09-30 2004-04-22 Sharp Corp 太陽電池セルおよびその製造方法
JP4133935B2 (ja) * 2004-06-07 2008-08-13 シャープ株式会社 シリコンウエハの加工方法
JP5079508B2 (ja) * 2005-05-11 2012-11-21 三菱電機株式会社 シリコンウェハの製造方法
JP4667263B2 (ja) * 2006-02-02 2011-04-06 シャープ株式会社 シリコンウエハの製造方法
JP2007332022A (ja) * 2006-06-13 2007-12-27 Young Sang Cho 多結晶シリコンインゴット製造装置
DE102006060195A1 (de) * 2006-12-18 2008-06-26 Jacobs University Bremen Ggmbh Kantenverrundung von Wafern
US7909678B2 (en) * 2007-08-27 2011-03-22 Schott Ag Method for manufacturing silicone wafers
DE102007040390A1 (de) 2007-08-27 2009-03-05 Schott Ag Verfahren zur Herstellung von Siliziumwafern
DE102007040385A1 (de) 2007-08-27 2009-03-05 Schott Ag Verfahren zur Herstellung von Siliziumwafern
CN102161179B (zh) * 2010-12-30 2014-03-26 青岛嘉星晶电科技股份有限公司 晶片研磨装置
JP5808208B2 (ja) 2011-09-15 2015-11-10 株式会社サイオクス 窒化物半導体基板の製造方法
CN102581771A (zh) * 2012-02-23 2012-07-18 上海超日(洛阳)太阳能有限公司 一种硅棒表面处理方法
CN107498456B (zh) * 2017-10-03 2024-06-04 德清晶生光电科技有限公司 可用于单面打磨的游星轮
CN109926908A (zh) * 2017-12-15 2019-06-25 有研半导体材料有限公司 一种硅环的加工方法
CN108081153A (zh) * 2017-12-26 2018-05-29 苏州贝尔纳德铁路设备有限公司 一种用于铁路机车车辆轮对的除锈方法
CN110076390A (zh) * 2019-03-13 2019-08-02 国家电投集团西安太阳能电力有限公司 一种打磨组件铝型材毛刺的装置
CN111604808B (zh) * 2020-06-15 2021-07-20 中车石家庄车辆有限公司 研磨机及其使用方法
CN114178710B (zh) * 2020-08-24 2024-11-26 奥特斯(中国)有限公司 部件承载件及其制造方法
CN113385989B (zh) * 2021-06-10 2022-08-30 安徽光智科技有限公司 一种非粘接性的多片磨边滚圆方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4084354A (en) * 1977-06-03 1978-04-18 International Business Machines Corporation Process for slicing boules of single crystal material
JPH07101679B2 (ja) * 1988-11-01 1995-11-01 三菱電機株式会社 電子デバイス用ウエハ，ウエハ用棒状基材および電子デバイス
JP3083832B2 (ja) * 1990-06-29 2000-09-04 ホーヤ株式会社 研摩方法及び装置
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
JPH0645301A (ja) * 1992-07-22 1994-02-18 Hitachi Ltd 半導体素子用シリコンウェハ及びその製造方法
JP2903916B2 (ja) * 1992-11-30 1999-06-14 信越半導体株式会社 半導体インゴット加工方法
JP2789983B2 (ja) * 1993-01-28 1998-08-27 信越半導体株式会社 加工誤差補正装置
JP3390842B2 (ja) * 1993-04-26 2003-03-31 勝代 田原 板状ワークの面取り研磨および鏡面研磨方法
US5595522A (en) * 1994-01-04 1997-01-21 Texas Instruments Incorporated Semiconductor wafer edge polishing system and method
JPH09168953A (ja) * 1995-12-16 1997-06-30 M Tec Kk 半導体ウェーハのエッジ研摩方法及び装置
JPH1034528A (ja) * 1996-05-22 1998-02-10 Sony Corp 研磨装置と研磨方法
JP3527075B2 (ja) 1996-09-30 2004-05-17 Ｈｏｙａ株式会社 磁気記録媒体用ガラス基板、磁気記録媒体、及びそれらの製造方法
JPH10189510A (ja) * 1996-12-27 1998-07-21 Sumitomo Sitix Corp 半導体ウェーハの面取り部鏡面化方法とその装置
JP3858462B2 (ja) * 1998-07-30 2006-12-13 株式会社日立製作所 半導体装置の製造方法
JP3502551B2 (ja) * 1998-10-21 2004-03-02 ユーテック株式会社 液晶パネルの面取り装置
JP3648239B2 (ja) * 2000-09-28 2005-05-18 シャープ株式会社 シリコンウエハの製造方法

Also Published As

Publication number Publication date
DE10147761B4 (de) 2010-01-14
US20020036182A1 (en) 2002-03-28
JP2002176014A (ja) 2002-06-21
US20040102139A1 (en) 2004-05-27
US6679759B2 (en) 2004-01-20
DE10147761A1 (de) 2002-05-16

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