JP3581310B2 - 防塵機能を備えた半導体ウェーハ処理装置 - Google Patents

防塵機能を備えた半導体ウェーハ処理装置 Download PDF

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Publication number
JP3581310B2
JP3581310B2 JP2000348196A JP2000348196A JP3581310B2 JP 3581310 B2 JP3581310 B2 JP 3581310B2 JP 2000348196 A JP2000348196 A JP 2000348196A JP 2000348196 A JP2000348196 A JP 2000348196A JP 3581310 B2 JP3581310 B2 JP 3581310B2
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JP
Japan
Prior art keywords
opening
processing apparatus
wafer
wafer processing
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000348196A
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English (en)
Japanese (ja)
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JP2002151373A (ja
JP2002151373A5 (en:Method
Inventor
勉 岡部
宏 五十嵐
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TDK Corp
Original Assignee
TDK Corp
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Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2000348196A priority Critical patent/JP3581310B2/ja
Publication of JP2002151373A publication Critical patent/JP2002151373A/ja
Priority to US10/330,092 priority patent/US7670095B2/en
Priority to US10/706,914 priority patent/US7607880B2/en
Publication of JP2002151373A5 publication Critical patent/JP2002151373A5/ja
Application granted granted Critical
Publication of JP3581310B2 publication Critical patent/JP3581310B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H10P72/3406—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
JP2000348196A 2000-08-31 2000-11-15 防塵機能を備えた半導体ウェーハ処理装置 Expired - Lifetime JP3581310B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000348196A JP3581310B2 (ja) 2000-08-31 2000-11-15 防塵機能を備えた半導体ウェーハ処理装置
US10/330,092 US7670095B2 (en) 2000-08-31 2002-12-30 Wafer processing apparatus having dust proof function
US10/706,914 US7607880B2 (en) 2000-08-31 2003-11-14 Wafer processing apparatus having dust proof function

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000262472 2000-08-31
JP2000-262472 2000-08-31
JP2000348196A JP3581310B2 (ja) 2000-08-31 2000-11-15 防塵機能を備えた半導体ウェーハ処理装置
US10/330,092 US7670095B2 (en) 2000-08-31 2002-12-30 Wafer processing apparatus having dust proof function

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003376935A Division JP4027879B2 (ja) 2000-08-31 2003-11-06 防塵機能を備えた半導体ウェーハ処理装置

Publications (3)

Publication Number Publication Date
JP2002151373A JP2002151373A (ja) 2002-05-24
JP2002151373A5 JP2002151373A5 (en:Method) 2004-10-14
JP3581310B2 true JP3581310B2 (ja) 2004-10-27

Family

ID=33424648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000348196A Expired - Lifetime JP3581310B2 (ja) 2000-08-31 2000-11-15 防塵機能を備えた半導体ウェーハ処理装置

Country Status (2)

Country Link
US (2) US7670095B2 (en:Method)
JP (1) JP3581310B2 (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227582A (ja) * 2006-02-23 2007-09-06 Hitachi High-Technologies Corp 試料搬送システム、試料搬送方法、プログラムおよび記録媒体
JP2010056296A (ja) * 2008-08-28 2010-03-11 Tdk Corp 密閉容器の蓋開閉システム及び蓋開閉方法
US7748942B2 (en) 2006-05-31 2010-07-06 Tdk Corporation Dust resistant load port apparatus and mini-environment system
JP2015130371A (ja) * 2014-01-06 2015-07-16 Tdk株式会社 ロードポート装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7360985B2 (en) * 2002-12-30 2008-04-22 Tdk Corporation Wafer processing apparatus including clean box stopping mechanism
JP4579723B2 (ja) * 2005-03-07 2010-11-10 川崎重工業株式会社 搬送系ユニットおよび分割体
JP4309935B2 (ja) * 2007-07-31 2009-08-05 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法
JP4343253B1 (ja) * 2008-03-27 2009-10-14 Ｔｄｋ株式会社 密閉容器の蓋開閉装置及び該開閉装置を用いたガス置換装置
US8915368B2 (en) * 2012-09-20 2014-12-23 Shenzhen China Star Optoelectronics Technology Co., Ltd LCD glass substrate storage tray
US20150345810A1 (en) * 2014-05-30 2015-12-03 Denso International America, Inc. Dual layer door
CN114194776B (zh) * 2021-12-15 2023-04-21 上海世禹精密设备股份有限公司 转送晶圆输送盒的设备

Family Cites Families (30)

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Publication number Priority date Publication date Assignee Title
JPH0265607A (ja) 1988-08-29 1990-03-06 Toshiba Corp 低圧閉鎖配電盤
JP2745478B2 (ja) 1988-11-20 1998-04-28 株式会社リコー 文字処理装置の印刷制御装置
JPH03184479A (ja) 1989-12-13 1991-08-12 Toshiba Corp フォーカス電圧発生装置
JP2525284B2 (ja) 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
JPH05109865A (ja) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd 可搬式密閉コンテナ
KR100303075B1 (ko) 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
JP2757102B2 (ja) 1993-03-15 1998-05-25 ティーディーケイ株式会社 クリーン搬送方法及び装置
JP2722306B2 (ja) 1993-01-21 1998-03-04 ティーディーケイ株式会社 クリーン搬送方法及び装置
JP2850279B2 (ja) 1994-02-22 1999-01-27 ティーディーケイ株式会社 クリーン搬送方法及び装置
ES2229247T3 (es) 1995-03-28 2005-04-16 Brooks Automation Gmbh Estacion de carga y descarga para instalaciones de tratamiento de semiconductores.
FR2747111B1 (fr) * 1996-04-03 1998-04-30 Commissariat Energie Atomique Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet
JP2864458B2 (ja) 1996-08-07 1999-03-03 ティーディーケイ株式会社 クリーン搬送方法、クリーンボックス及びクリーン搬送装置
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP3184479B2 (ja) 1997-05-21 2001-07-09 ティーディーケイ株式会社 真空クリーンボックス、クリーン搬送方法及び装置
JP3380147B2 (ja) 1997-11-13 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
JP3417821B2 (ja) * 1997-11-17 2003-06-16 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US20010048866A1 (en) * 1997-12-01 2001-12-06 Fumio Sakiya Container and loader for substrate
DE69836425T2 (de) * 1998-04-06 2007-09-27 Dainichi Shoji K.K. Behälter
US6281516B1 (en) * 1998-07-13 2001-08-28 Newport Corporation FIMS transport box load interface
JP4142183B2 (ja) 1998-11-27 2008-08-27 株式会社ルネサステクノロジ 半導体装置の製造方法
EP1052692B1 (en) * 1998-12-02 2006-07-12 Dainichi Shoji K.K. Container for dust free articles (FOUP)
JP3794861B2 (ja) * 1999-03-16 2006-07-12 Ｔｄｋ株式会社 クリーン搬送方法及び装置
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
JP3193026B2 (ja) * 1999-11-25 2001-07-30 株式会社半導体先端テクノロジーズ 基板処理装置のロードポートシステム及び基板の処理方法
US6641350B2 (en) * 2000-04-17 2003-11-04 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
JP4476457B2 (ja) 2000-08-31 2010-06-09 平田機工株式会社 Ｆｏｕｐオープナ
JP3910821B2 (ja) * 2000-10-26 2007-04-25 東京エレクトロン株式会社 基板の処理装置
JP3699348B2 (ja) * 2000-11-30 2005-09-28 平田機工株式会社 駆動部隔離ｆｏｕｐオープナ
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door
US20040069409A1 (en) * 2002-10-11 2004-04-15 Hippo Wu Front opening unified pod door opener with dust-proof device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227582A (ja) * 2006-02-23 2007-09-06 Hitachi High-Technologies Corp 試料搬送システム、試料搬送方法、プログラムおよび記録媒体
US7748942B2 (en) 2006-05-31 2010-07-06 Tdk Corporation Dust resistant load port apparatus and mini-environment system
JP2010056296A (ja) * 2008-08-28 2010-03-11 Tdk Corp 密閉容器の蓋開閉システム及び蓋開閉方法
JP2015130371A (ja) * 2014-01-06 2015-07-16 Tdk株式会社 ロードポート装置

Also Published As

Publication number Publication date
US20040127028A1 (en) 2004-07-01
US7607880B2 (en) 2009-10-27
US7670095B2 (en) 2010-03-02
US20040147122A1 (en) 2004-07-29
JP2002151373A (ja) 2002-05-24

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