JP3407715B2 - レーザ加工装置 - Google Patents

レーザ加工装置

Info

Publication number
JP3407715B2
JP3407715B2 JP2000168539A JP2000168539A JP3407715B2 JP 3407715 B2 JP3407715 B2 JP 3407715B2 JP 2000168539 A JP2000168539 A JP 2000168539A JP 2000168539 A JP2000168539 A JP 2000168539A JP 3407715 B2 JP3407715 B2 JP 3407715B2
Authority
JP
Japan
Prior art keywords
laser
positioning
section
control
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000168539A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001347385A (ja
Inventor
健治 川添
克一 浮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000168539A priority Critical patent/JP3407715B2/ja
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to US09/873,299 priority patent/US6721343B2/en
Priority to TW090113577A priority patent/TW492901B/zh
Priority to NO20012759A priority patent/NO320136B1/no
Priority to KR1020010031324A priority patent/KR100796078B1/ko
Priority to DE60136246T priority patent/DE60136246D1/de
Priority to EP01113828A priority patent/EP1162025B8/fr
Priority to CNB011211245A priority patent/CN1179818C/zh
Priority to AT01113828T priority patent/ATE411872T1/de
Publication of JP2001347385A publication Critical patent/JP2001347385A/ja
Application granted granted Critical
Publication of JP3407715B2 publication Critical patent/JP3407715B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/416—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control of velocity, acceleration or deceleration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45035—Printed circuit boards, also holes to be drilled in a plate
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45139—Laser drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
  • Surgical Instruments (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Laser Surgery Devices (AREA)
JP2000168539A 2000-06-06 2000-06-06 レーザ加工装置 Expired - Fee Related JP3407715B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000168539A JP3407715B2 (ja) 2000-06-06 2000-06-06 レーザ加工装置
TW090113577A TW492901B (en) 2000-06-06 2001-06-05 Laser processing apparatus
NO20012759A NO320136B1 (no) 2000-06-06 2001-06-05 Anordning for laserbehandling
KR1020010031324A KR100796078B1 (ko) 2000-06-06 2001-06-05 레이저 가공 장치
US09/873,299 US6721343B2 (en) 2000-06-06 2001-06-05 Laser processing apparatus with position controller
DE60136246T DE60136246D1 (de) 2000-06-06 2001-06-06 Laserbearbeitungsvorrichtung
EP01113828A EP1162025B8 (fr) 2000-06-06 2001-06-06 Appareil de traitement laser
CNB011211245A CN1179818C (zh) 2000-06-06 2001-06-06 激光加工装置
AT01113828T ATE411872T1 (de) 2000-06-06 2001-06-06 Laserbearbeitungsvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000168539A JP3407715B2 (ja) 2000-06-06 2000-06-06 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2001347385A JP2001347385A (ja) 2001-12-18
JP3407715B2 true JP3407715B2 (ja) 2003-05-19

Family

ID=18671529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000168539A Expired - Fee Related JP3407715B2 (ja) 2000-06-06 2000-06-06 レーザ加工装置

Country Status (9)

Country Link
US (1) US6721343B2 (fr)
EP (1) EP1162025B8 (fr)
JP (1) JP3407715B2 (fr)
KR (1) KR100796078B1 (fr)
CN (1) CN1179818C (fr)
AT (1) ATE411872T1 (fr)
DE (1) DE60136246D1 (fr)
NO (1) NO320136B1 (fr)
TW (1) TW492901B (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3666435B2 (ja) * 2001-09-28 2005-06-29 松下電器産業株式会社 光照射装置と光加工装置およびその加工方法
EP1525069B1 (fr) * 2002-07-25 2009-04-15 Panasonic Corporation Systeme et procede de percage laser au moyen d'une profondeur de foyer optimisee
KR100818138B1 (ko) * 2004-05-20 2008-04-01 고마쓰 산기 가부시끼가이샤 절단기 및 절단 헤드의 이동 방법
WO2007077630A1 (fr) * 2006-01-06 2007-07-12 Mitsubishi Denki Kabushiki Kaisha Systeme de traitement de materiau par laser, dispositif de creation de programme et procede de traitement de materiau par laser
JP4630853B2 (ja) 2006-03-30 2011-02-09 日立ビアメカニクス株式会社 移動体の位置決め制御装置及びレーザ加工装置
JP5405244B2 (ja) * 2009-09-07 2014-02-05 株式会社キーエンス レーザ加工装置
JP5460420B2 (ja) * 2010-03-30 2014-04-02 三菱電機株式会社 加工制御装置およびレーザ加工装置
JP5459255B2 (ja) * 2011-04-08 2014-04-02 株式会社安川電機 ロボットシステム
CN103163828B (zh) * 2011-12-15 2016-03-16 大族激光科技产业集团股份有限公司 一种pwm信号控制方法、系统及数控激光加工机床
JP5943627B2 (ja) * 2012-02-14 2016-07-05 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
TW201544222A (zh) * 2014-02-21 2015-12-01 Panasonic Ip Man Co Ltd 雷射加工裝置
JP5941108B2 (ja) * 2014-08-27 2016-06-29 ファナック株式会社 高速位置決め機能を有するレーザ加工装置
CN105676790B (zh) * 2016-03-28 2019-01-25 大族激光科技产业集团股份有限公司 激光加工控制方法和装置
CN106041335B (zh) * 2016-07-22 2018-01-23 深圳市德堡数控技术有限公司 一种激光切割机和激光切割多层复合材料的能量控制系统
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161123A (ja) 1984-08-31 1986-03-28 Fuji Photo Film Co Ltd ガルバノメ−タミラ−駆動装置
US5450202A (en) * 1988-11-17 1995-09-12 Tisue; James G. Adaptive resonant positioner having random access capability
US5168454A (en) 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
US5302798A (en) 1991-04-01 1994-04-12 Canon Kabushiki Kaisha Method of forming a hole with a laser and an apparatus for forming a hole with a laser
JPH07112287A (ja) 1993-10-15 1995-05-02 Fanuc Ltd Ｎｃレーザ装置
JP3179963B2 (ja) * 1994-04-26 2001-06-25 松下電器産業株式会社 レーザ加工装置とレーザ加工方法
JP2682475B2 (ja) * 1994-11-17 1997-11-26 日本電気株式会社 ビームスキャン式レーザマーキング方法および装置
JP3235389B2 (ja) 1995-01-31 2001-12-04 三菱電機株式会社 レーザ加工装置および加工方法
US5923418A (en) * 1995-02-21 1999-07-13 Clark-Mxr, Inc. Apparatus for controlling the position and direction of a laser beam
KR100446052B1 (ko) * 1997-05-15 2004-10-14 스미도모쥬기가이고교 가부시키가이샤 다수의갈바노스캐너를사용한레이저빔가공장치
JP4049459B2 (ja) 1998-10-09 2008-02-20 松下電器産業株式会社 レーザ加工方法
US6222870B1 (en) * 1999-02-22 2001-04-24 Presstek, Inc. Pumped laser diode assembly with optically coupled heat sink
JP4205282B2 (ja) * 2000-03-03 2009-01-07 住友重機械工業株式会社 レーザ加工方法及び加工装置
JP2002040356A (ja) * 2000-07-28 2002-02-06 Sumitomo Heavy Ind Ltd ガルバノ制御方法及び制御装置

Also Published As

Publication number Publication date
DE60136246D1 (de) 2008-12-04
EP1162025B8 (fr) 2008-12-31
TW492901B (en) 2002-07-01
JP2001347385A (ja) 2001-12-18
NO20012759L (no) 2001-12-07
US6721343B2 (en) 2004-04-13
ATE411872T1 (de) 2008-11-15
NO20012759D0 (no) 2001-06-05
NO320136B1 (no) 2005-10-31
EP1162025B1 (fr) 2008-10-22
EP1162025A2 (fr) 2001-12-12
CN1179818C (zh) 2004-12-15
KR100796078B1 (ko) 2008-01-21
US20010048701A1 (en) 2001-12-06
EP1162025A3 (fr) 2003-01-15
CN1327898A (zh) 2001-12-26
KR20010110322A (ko) 2001-12-13

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