JP3275390B2 - 可搬式密閉コンテナ流通式の自動搬送システム - Google Patents

可搬式密閉コンテナ流通式の自動搬送システム

Info

Publication number
JP3275390B2
JP3275390B2 JP26767092A JP26767092A JP3275390B2 JP 3275390 B2 JP3275390 B2 JP 3275390B2 JP 26767092 A JP26767092 A JP 26767092A JP 26767092 A JP26767092 A JP 26767092A JP 3275390 B2 JP3275390 B2 JP 3275390B2
Authority
JP
Japan
Prior art keywords
automatic
transfer
closed container
window
unmanned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP26767092A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06115617A (ja
Inventor
哲平 山下
正直 村田
幹 田中
日也 森田
等 河野
Original Assignee
神鋼電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17447900&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3275390(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 神鋼電機株式会社 filed Critical 神鋼電機株式会社
Priority to JP26767092A priority Critical patent/JP3275390B2/ja
Priority to KR1019930020013A priority patent/KR100281971B1/ko
Priority to TW082107990A priority patent/TW267149B/zh
Priority to FR9311846A priority patent/FR2696429B1/fr
Priority to US08/132,333 priority patent/US5431600A/en
Publication of JPH06115617A publication Critical patent/JPH06115617A/ja
Application granted granted Critical
Publication of JP3275390B2 publication Critical patent/JP3275390B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Platform Screen Doors And Railroad Systems (AREA)
  • Warehouses Or Storage Devices (AREA)
JP26767092A 1992-10-06 1992-10-06 可搬式密閉コンテナ流通式の自動搬送システム Expired - Fee Related JP3275390B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26767092A JP3275390B2 (ja) 1992-10-06 1992-10-06 可搬式密閉コンテナ流通式の自動搬送システム
KR1019930020013A KR100281971B1 (ko) 1992-10-06 1993-09-28 가반식밀폐컨테이너 유통식의 자동반송시스템
TW082107990A TW267149B (en:Method) 1992-10-06 1993-09-29
FR9311846A FR2696429B1 (fr) 1992-10-06 1993-10-05 Système de transfert automatique utilisant un récipient fermé portable.
US08/132,333 US5431600A (en) 1992-10-06 1993-10-06 Automatic transferring system using portable closed container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26767092A JP3275390B2 (ja) 1992-10-06 1992-10-06 可搬式密閉コンテナ流通式の自動搬送システム

Publications (2)

Publication Number Publication Date
JPH06115617A JPH06115617A (ja) 1994-04-26
JP3275390B2 true JP3275390B2 (ja) 2002-04-15

Family

ID=17447900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26767092A Expired - Fee Related JP3275390B2 (ja) 1992-10-06 1992-10-06 可搬式密閉コンテナ流通式の自動搬送システム

Country Status (5)

Country Link
US (1) US5431600A (en:Method)
JP (1) JP3275390B2 (en:Method)
KR (1) KR100281971B1 (en:Method)
FR (1) FR2696429B1 (en:Method)
TW (1) TW267149B (en:Method)

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DE19544328B4 (de) 1994-11-29 2014-03-20 Ebara Corp. Poliervorrichtung
EP0735573B1 (de) * 1995-03-28 2004-09-08 BROOKS Automation GmbH Be- und Entladestation für Halbleiterbearbeitungsanlagen
DE19516849C2 (de) * 1995-05-11 1997-09-25 Chiron Werke Gmbh Maschinenzentrum mit Werkzeugmaschinen und einer Ladevorrichtung
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US5607276A (en) * 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
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SE510957C2 (sv) * 1997-11-10 1999-07-12 Holmstrands Automation Ab Maskin för behandling av skivformigt gods med olika medier och godsbärare för användning i en sådan maskin
US6704998B1 (en) * 1997-12-24 2004-03-16 Asyst Technologies, Inc. Port door removal and wafer handling robotic system
DE19805624A1 (de) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
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DE19821338B4 (de) * 1998-05-13 2004-06-17 Audi Ag Transportsystem und Verfahren zum Transportieren von Gegenständen in einen Arbeitsraum hinein oder aus einem Arbeitsraum heraus
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US6604624B2 (en) 1998-09-22 2003-08-12 Hirata Corporation Work conveying system
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JP3917777B2 (ja) * 1999-04-12 2007-05-23 村田機械株式会社 光データ伝送装置
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US6917852B2 (en) * 2002-01-24 2005-07-12 Hewlett-Packard Development Company, L.P. Automated input/output job distribution through the use of mobile input/output bins
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CN100495824C (zh) 2002-03-04 2009-06-03 住友电气工业株式会社 各向异性导电膜及其制造方法
JP2003332402A (ja) * 2002-05-10 2003-11-21 Kondo Kogyo Kk ミニエンバライメント方式の半導体製造装置
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Also Published As

Publication number Publication date
KR100281971B1 (ko) 2001-03-02
JPH06115617A (ja) 1994-04-26
KR940010263A (ko) 1994-05-24
TW267149B (en:Method) 1996-01-01
US5431600A (en) 1995-07-11
FR2696429A1 (fr) 1994-04-08
FR2696429B1 (fr) 1995-01-27

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