JP2981194B2 - 半導体チップパッケージ - Google Patents

半導体チップパッケージ

Info

Publication number
JP2981194B2
JP2981194B2 JP9314876A JP31487697A JP2981194B2 JP 2981194 B2 JP2981194 B2 JP 2981194B2 JP 9314876 A JP9314876 A JP 9314876A JP 31487697 A JP31487697 A JP 31487697A JP 2981194 B2 JP2981194 B2 JP 2981194B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
lead
internal
leads
chip package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9314876A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10242373A (ja
Inventor
道秀 鄭
五植 權
泳僖 宋
旻彬 任
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sansei Denshi Co Ltd
Original Assignee
Sansei Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansei Denshi Co Ltd filed Critical Sansei Denshi Co Ltd
Publication of JPH10242373A publication Critical patent/JPH10242373A/ja
Application granted granted Critical
Publication of JP2981194B2 publication Critical patent/JP2981194B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L23/495—Lead-frames or other flat leads
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP9314876A 1997-02-28 1997-11-17 半導体チップパッケージ Expired - Fee Related JP2981194B2 (ja)

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KR19970006505 1997-02-28
KR1997P6505 1997-08-07
KR1997P37789 1997-08-07
KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지

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KR100401536B1 (ko) * 1997-12-31 2004-01-24 주식회사 하이닉스반도체 센터 패드형 반도체 칩을 퍼리퍼럴 패드형 반도체 칩으로 변경하는 방법
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
DE10158770B4 (de) * 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지
JP4222920B2 (ja) 2003-10-01 2009-02-12 株式会社ルネサステクノロジ 半導体装置
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
JP6698306B2 (ja) * 2015-09-29 2020-05-27 株式会社巴川製紙所 リードフレーム固定用接着テープ
CN110931420A (zh) * 2019-11-19 2020-03-27 苏州日月新半导体有限公司 一种加热块单元及加热装置

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JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2748940B2 (ja) * 1989-06-05 1998-05-13 株式会社日立製作所 樹脂封止型半導体装置
JPH01276656A (ja) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH02132848A (ja) * 1988-11-14 1990-05-22 Nec Corp 半導体装置
JPH04372161A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp 半導体装置
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
JP2677737B2 (ja) * 1992-06-24 1997-11-17 株式会社東芝 半導体装置
US5545920A (en) * 1994-09-13 1996-08-13 Texas Instruments Incorporated Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity

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FR2760289B1 (fr) 2002-08-30
CN1114948C (zh) 2003-07-16
CN1192048A (zh) 1998-09-02
JPH10242373A (ja) 1998-09-11
KR19980069880A (ko) 1998-10-26
KR100227120B1 (ko) 1999-10-15
DE19749539A1 (de) 1998-09-10
FR2760289A1 (fr) 1998-09-04
TW354856B (en) 1999-03-21
DE19749539B4 (de) 2006-04-13

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