CN1114948C - 芯片上引线及标准常规引线的组合结构的半导体芯片封装 - Google Patents

芯片上引线及标准常规引线的组合结构的半导体芯片封装 Download PDF

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Publication number
CN1114948C
CN1114948C CN97121615A CN97121615A CN1114948C CN 1114948 C CN1114948 C CN 1114948C CN 97121615 A CN97121615 A CN 97121615A CN 97121615 A CN97121615 A CN 97121615A CN 1114948 C CN1114948 C CN 1114948C
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lead
semiconductor chip
die package
electrode pad
semiconductor die
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CN97121615A
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Chinese (zh)
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CN1192048A (zh
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郑道秀
权五植
宋泳僖
任旻彬
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CN97121615A 1997-02-28 1997-11-07 芯片上引线及标准常规引线的组合结构的半导体芯片封装 Expired - Fee Related CN1114948C (zh)

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KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지

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KR (1) KR100227120B1 (de)
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KR100401536B1 (ko) * 1997-12-31 2004-01-24 주식회사 하이닉스반도체 센터 패드형 반도체 칩을 퍼리퍼럴 패드형 반도체 칩으로 변경하는 방법
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
DE10158770B4 (de) * 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지
JP4222920B2 (ja) 2003-10-01 2009-02-12 株式会社ルネサステクノロジ 半導体装置
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
JP6698306B2 (ja) * 2015-09-29 2020-05-27 株式会社巴川製紙所 リードフレーム固定用接着テープ
CN110931420A (zh) * 2019-11-19 2020-03-27 苏州日月新半导体有限公司 一种加热块单元及加热装置

Citations (2)

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Publication number Priority date Publication date Assignee Title
EP0554742A2 (de) * 1992-02-03 1993-08-11 Motorola, Inc. Halbleiteranordnung mit Überchipanschlüssen
US5589420A (en) * 1994-09-13 1996-12-31 Texas Instruments Incorporated Method for a hybrid leadframe-over-chip semiconductor package

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JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2748940B2 (ja) * 1989-06-05 1998-05-13 株式会社日立製作所 樹脂封止型半導体装置
JPH01276656A (ja) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH02132848A (ja) * 1988-11-14 1990-05-22 Nec Corp 半導体装置
JPH04372161A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp 半導体装置
JP2677737B2 (ja) * 1992-06-24 1997-11-17 株式会社東芝 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0554742A2 (de) * 1992-02-03 1993-08-11 Motorola, Inc. Halbleiteranordnung mit Überchipanschlüssen
US5589420A (en) * 1994-09-13 1996-12-31 Texas Instruments Incorporated Method for a hybrid leadframe-over-chip semiconductor package

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CN1192048A (zh) 1998-09-02
JP2981194B2 (ja) 1999-11-22
JPH10242373A (ja) 1998-09-11
KR19980069880A (ko) 1998-10-26
KR100227120B1 (ko) 1999-10-15
DE19749539A1 (de) 1998-09-10
FR2760289A1 (fr) 1998-09-04
TW354856B (en) 1999-03-21
DE19749539B4 (de) 2006-04-13

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