KR100227120B1 - 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지 - Google Patents

엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지 Download PDF

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KR100227120B1
KR100227120B1 KR1019970037789A KR19970037789A KR100227120B1 KR 100227120 B1 KR100227120 B1 KR 100227120B1 KR 1019970037789 A KR1019970037789 A KR 1019970037789A KR 19970037789 A KR19970037789 A KR 19970037789A KR 100227120 B1 KR100227120 B1 KR 100227120B1
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South Korea
Prior art keywords
semiconductor chip
lead
leads
package
active surface
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KR1019970037789A
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English (en)
Korean (ko)
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KR19980069880A (ko
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정도수
권오식
송영희
임민빈
Original Assignee
윤종용
삼성전자주식회사
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Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019970037789A priority Critical patent/KR100227120B1/ko
Priority to TW086115443A priority patent/TW354856B/zh
Priority to CN97121615A priority patent/CN1114948C/zh
Priority to FR9714045A priority patent/FR2760289B1/fr
Priority to DE19749539A priority patent/DE19749539B4/de
Priority to JP9314876A priority patent/JP2981194B2/ja
Publication of KR19980069880A publication Critical patent/KR19980069880A/ko
Application granted granted Critical
Publication of KR100227120B1 publication Critical patent/KR100227120B1/ko

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
KR1019970037789A 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지 KR100227120B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지
TW086115443A TW354856B (en) 1997-02-28 1997-10-20 Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads
CN97121615A CN1114948C (zh) 1997-02-28 1997-11-07 芯片上引线及标准常规引线的组合结构的半导体芯片封装
FR9714045A FR2760289B1 (fr) 1997-02-28 1997-11-07 Boitier de puce de semiconducteur ayant une structure combinee de conducteurs situes sur la puce et de conducteurs normaux standards
DE19749539A DE19749539B4 (de) 1997-02-28 1997-11-08 Halbleiterbaustein mit Leiterrahmen und Justierhilfen
JP9314876A JP2981194B2 (ja) 1997-02-28 1997-11-17 半導体チップパッケージ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1997-6505 1997-02-28
KR101997006505 1997-02-28
KR19970006505 1997-02-28
KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지

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KR19980069880A KR19980069880A (ko) 1998-10-26
KR100227120B1 true KR100227120B1 (ko) 1999-10-15

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JP (1) JP2981194B2 (de)
KR (1) KR100227120B1 (de)
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DE (1) DE19749539B4 (de)
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TW (1) TW354856B (de)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지

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KR100401536B1 (ko) * 1997-12-31 2004-01-24 주식회사 하이닉스반도체 센터 패드형 반도체 칩을 퍼리퍼럴 패드형 반도체 칩으로 변경하는 방법
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
DE10158770B4 (de) * 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
JP4222920B2 (ja) 2003-10-01 2009-02-12 株式会社ルネサステクノロジ 半導体装置
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
JP6698306B2 (ja) * 2015-09-29 2020-05-27 株式会社巴川製紙所 リードフレーム固定用接着テープ
CN110931420A (zh) * 2019-11-19 2020-03-27 苏州日月新半导体有限公司 一种加热块单元及加热装置

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Publication number Priority date Publication date Assignee Title
JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2748940B2 (ja) * 1989-06-05 1998-05-13 株式会社日立製作所 樹脂封止型半導体装置
JPH01276656A (ja) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH02132848A (ja) * 1988-11-14 1990-05-22 Nec Corp 半導体装置
JPH04372161A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp 半導体装置
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
JP2677737B2 (ja) * 1992-06-24 1997-11-17 株式会社東芝 半導体装置
US5545920A (en) * 1994-09-13 1996-08-13 Texas Instruments Incorporated Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지

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FR2760289B1 (fr) 2002-08-30
CN1114948C (zh) 2003-07-16
CN1192048A (zh) 1998-09-02
JP2981194B2 (ja) 1999-11-22
JPH10242373A (ja) 1998-09-11
KR19980069880A (ko) 1998-10-26
DE19749539A1 (de) 1998-09-10
FR2760289A1 (fr) 1998-09-04
TW354856B (en) 1999-03-21
DE19749539B4 (de) 2006-04-13

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