TW354856B - Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads - Google Patents

Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads

Info

Publication number
TW354856B
TW354856B TW086115443A TW86115443A TW354856B TW 354856 B TW354856 B TW 354856B TW 086115443 A TW086115443 A TW 086115443A TW 86115443 A TW86115443 A TW 86115443A TW 354856 B TW354856 B TW 354856B
Authority
TW
Taiwan
Prior art keywords
leads
chip
semiconductor chip
active surface
lead
Prior art date
Application number
TW086115443A
Other languages
English (en)
Chinese (zh)
Inventor
Do-Soo Jeong
Oh-Sik Kwon
Young-Hee Song
Min-Bin Yim
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW354856B publication Critical patent/TW354856B/zh

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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW086115443A 1997-02-28 1997-10-20 Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads TW354856B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR19970006505 1997-02-28
KR1019970037789A KR100227120B1 (ko) 1997-02-28 1997-08-07 엘오씨(loc)리드와 표준형 리드가 복합된 구조를 갖는 반도체 칩 패키지

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TW354856B true TW354856B (en) 1999-03-21

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TW086115443A TW354856B (en) 1997-02-28 1997-10-20 Semiconductor chip package having combined structure of lead-on-chip leads on chip leads and standard normal leads

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JP (1) JP2981194B2 (de)
KR (1) KR100227120B1 (de)
CN (1) CN1114948C (de)
DE (1) DE19749539B4 (de)
FR (1) FR2760289B1 (de)
TW (1) TW354856B (de)

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KR100401536B1 (ko) * 1997-12-31 2004-01-24 주식회사 하이닉스반도체 센터 패드형 반도체 칩을 퍼리퍼럴 패드형 반도체 칩으로 변경하는 방법
JP2002076233A (ja) 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
DE10158770B4 (de) 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
KR100525091B1 (ko) * 2001-12-28 2005-11-02 주식회사 하이닉스반도체 반도체 패키지
JP4222920B2 (ja) 2003-10-01 2009-02-12 株式会社ルネサステクノロジ 半導体装置
KR100654338B1 (ko) * 2003-10-04 2006-12-07 삼성전자주식회사 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
JP6698306B2 (ja) * 2015-09-29 2020-05-27 株式会社巴川製紙所 リードフレーム固定用接着テープ
CN110931420A (zh) * 2019-11-19 2020-03-27 苏州日月新半导体有限公司 一种加热块单元及加热装置

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JPH06105721B2 (ja) * 1985-03-25 1994-12-21 日立超エル・エス・アイエンジニアリング株式会社 半導体装置
JP2748940B2 (ja) * 1989-06-05 1998-05-13 株式会社日立製作所 樹脂封止型半導体装置
JPH01276656A (ja) * 1988-04-27 1989-11-07 Mitsubishi Electric Corp 樹脂封止型半導体装置
JPH02132848A (ja) * 1988-11-14 1990-05-22 Nec Corp 半導体装置
JPH04372161A (ja) * 1991-06-21 1992-12-25 Mitsubishi Electric Corp 半導体装置
KR100276781B1 (ko) * 1992-02-03 2001-01-15 비센트 비. 인그라시아 리드-온-칩 반도체장치 및 그 제조방법
JP2677737B2 (ja) * 1992-06-24 1997-11-17 株式会社東芝 半導体装置
US5545920A (en) * 1994-09-13 1996-08-13 Texas Instruments Incorporated Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity

Also Published As

Publication number Publication date
CN1114948C (zh) 2003-07-16
CN1192048A (zh) 1998-09-02
FR2760289A1 (fr) 1998-09-04
DE19749539B4 (de) 2006-04-13
JP2981194B2 (ja) 1999-11-22
KR19980069880A (ko) 1998-10-26
FR2760289B1 (fr) 2002-08-30
DE19749539A1 (de) 1998-09-10
JPH10242373A (ja) 1998-09-11
KR100227120B1 (ko) 1999-10-15

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