JP2738195B2 - 不揮発性半導体記憶装置 - Google Patents

不揮発性半導体記憶装置

Info

Publication number
JP2738195B2
JP2738195B2 JP3359812A JP35981291A JP2738195B2 JP 2738195 B2 JP2738195 B2 JP 2738195B2 JP 3359812 A JP3359812 A JP 3359812A JP 35981291 A JP35981291 A JP 35981291A JP 2738195 B2 JP2738195 B2 JP 2738195B2
Authority
JP
Japan
Prior art keywords
sector
redundant
data
memory cell
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3359812A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05182491A (ja
Inventor
潔和 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP3359812A priority Critical patent/JP2738195B2/ja
Priority to US07/985,607 priority patent/US5329488A/en
Priority to EP92311210A priority patent/EP0549193B1/en
Priority to DE69230281T priority patent/DE69230281T2/de
Priority to KR1019920025605A priority patent/KR950014802B1/ko
Publication of JPH05182491A publication Critical patent/JPH05182491A/ja
Application granted granted Critical
Publication of JP2738195B2 publication Critical patent/JP2738195B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/70—Masking faults in memories by using spares or by reconfiguring
    • G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
    • G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
    • G11C29/808—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout using a flexible replacement scheme

Landscapes

  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
JP3359812A 1991-12-27 1991-12-27 不揮発性半導体記憶装置 Expired - Fee Related JP2738195B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP3359812A JP2738195B2 (ja) 1991-12-27 1991-12-27 不揮発性半導体記憶装置
US07/985,607 US5329488A (en) 1991-12-27 1992-12-03 Nonvolatile semiconductor memory device with redundancy circuit
EP92311210A EP0549193B1 (en) 1991-12-27 1992-12-09 Nonvolatile semiconductor memory device with redundancy
DE69230281T DE69230281T2 (de) 1991-12-27 1992-12-09 Nichtflüchtiges Halbleiterspeichergerät mit Redundanz
KR1019920025605A KR950014802B1 (ko) 1991-12-27 1992-12-26 불휘발성 반도체 메모리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3359812A JP2738195B2 (ja) 1991-12-27 1991-12-27 不揮発性半導体記憶装置

Publications (2)

Publication Number Publication Date
JPH05182491A JPH05182491A (ja) 1993-07-23
JP2738195B2 true JP2738195B2 (ja) 1998-04-08

Family

ID=18466420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3359812A Expired - Fee Related JP2738195B2 (ja) 1991-12-27 1991-12-27 不揮発性半導体記憶装置

Country Status (5)

Country Link
US (1) US5329488A (cg-RX-API-DMAC7.html)
EP (1) EP0549193B1 (cg-RX-API-DMAC7.html)
JP (1) JP2738195B2 (cg-RX-API-DMAC7.html)
KR (1) KR950014802B1 (cg-RX-API-DMAC7.html)
DE (1) DE69230281T2 (cg-RX-API-DMAC7.html)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950013342B1 (ko) * 1992-10-06 1995-11-02 삼성전자주식회사 반도체 메모리장치의 결함구제회로
US5359570A (en) * 1992-11-13 1994-10-25 Silicon Storage Technology, Inc. Solid state peripheral storage device
US5349558A (en) * 1993-08-26 1994-09-20 Advanced Micro Devices, Inc. Sector-based redundancy architecture
US5442586A (en) * 1993-09-10 1995-08-15 Intel Corporation Method and apparatus for controlling the output current provided by a charge pump circuit
EP0686978B1 (en) * 1994-06-07 2001-03-07 STMicroelectronics S.r.l. A method for in-factory testing of flash EEPROM devices
US5517138A (en) * 1994-09-30 1996-05-14 Intel Corporation Dual row selection using multiplexed tri-level decoder
US5559742A (en) * 1995-02-23 1996-09-24 Micron Technology, Inc. Flash memory having transistor redundancy
JPH08293197A (ja) * 1995-04-21 1996-11-05 Nec Corp 不揮発性半導体記憶装置
KR100217910B1 (ko) * 1995-08-17 1999-09-01 김영환 플래쉬 메모리셀의 리페어 회로 및 리페어 방법
US5576985A (en) * 1996-03-25 1996-11-19 Holtz; Klaus Integrated content addressable read only memory
US5896393A (en) * 1996-05-23 1999-04-20 Advanced Micro Devices, Inc. Simplified file management scheme for flash memory
US5828599A (en) * 1996-08-06 1998-10-27 Simtek Corporation Memory with electrically erasable and programmable redundancy
US5996106A (en) 1997-02-04 1999-11-30 Micron Technology, Inc. Multi bank test mode for memory devices
US5913928A (en) * 1997-05-09 1999-06-22 Micron Technology, Inc. Data compression test mode independent of redundancy
KR100280451B1 (ko) * 1998-03-12 2001-02-01 김영환 메모리 셀의 동작이 섹터 단위로 수행되는 플래쉬 메모리
TW446876B (en) * 1998-08-27 2001-07-21 Sanyo Electric Co Non-volatile semiconductor memory
US6026021A (en) * 1998-09-10 2000-02-15 Winbond Electronics Corp. America Semiconductor memory array partitioned into memory blocks and sub-blocks and method of addressing
JP2002063797A (ja) * 2000-08-22 2002-02-28 Mitsubishi Electric Corp 不揮発性半導体記憶装置
US7162668B2 (en) 2001-04-19 2007-01-09 Micron Technology, Inc. Memory with element redundancy
US6865702B2 (en) 2001-04-09 2005-03-08 Micron Technology, Inc. Synchronous flash memory with test code input
US7640465B2 (en) * 2001-04-19 2009-12-29 Micron Technology, Inc. Memory with element redundancy
KR100504114B1 (ko) * 2002-08-23 2005-07-27 삼성전자주식회사 불량 셀 구제 기능을 갖는 롬 메모리 장치 및 불량 셀구제 방법
JP2004110870A (ja) * 2002-09-13 2004-04-08 Fujitsu Ltd 半導体記憶装置
KR100578141B1 (ko) 2004-11-22 2006-05-10 삼성전자주식회사 읽기 속도를 향상시킬 수 있는 낸드 플래시 메모리 장치
JP4727273B2 (ja) * 2005-03-31 2011-07-20 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
US8072834B2 (en) 2005-08-25 2011-12-06 Cypress Semiconductor Corporation Line driver circuit and method with standby mode of operation
JP2008097696A (ja) * 2006-10-11 2008-04-24 Elpida Memory Inc 半導体装置
US7958390B2 (en) * 2007-05-15 2011-06-07 Sandisk Corporation Memory device for repairing a neighborhood of rows in a memory array using a patch table
US7966518B2 (en) * 2007-05-15 2011-06-21 Sandisk Corporation Method for repairing a neighborhood of rows in a memory array using a patch table
TW201019333A (en) * 2008-11-12 2010-05-16 Skymedi Corp Defect processing method for multi-channel flash memory storage device
US9082057B2 (en) * 2009-08-19 2015-07-14 Intelleflex Corporation RF device with tamper detection
US10062440B1 (en) * 2017-06-20 2018-08-28 Winbond Electronics Corp. Non-volatile semiconductor memory device and reading method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5928560Y2 (ja) * 1979-11-13 1984-08-17 富士通株式会社 冗長ビットを有する記憶装置
US4547867A (en) * 1980-10-01 1985-10-15 Intel Corporation Multiple bit dynamic random-access memory
JPH0670880B2 (ja) * 1983-01-21 1994-09-07 株式会社日立マイコンシステム 半導体記憶装置
JP2590897B2 (ja) * 1987-07-20 1997-03-12 日本電気株式会社 半導体メモリ
JPH01109599A (ja) * 1987-10-22 1989-04-26 Nec Corp 書込み・消去可能な半導体記憶装置
US4885720A (en) * 1988-04-01 1989-12-05 International Business Machines Corporation Memory device and method implementing wordline redundancy without an access time penalty
JP2698834B2 (ja) * 1988-11-22 1998-01-19 株式会社日立製作所 不揮発性記憶装置
NL8900026A (nl) * 1989-01-06 1990-08-01 Philips Nv Matrixgeheugen, bevattende standaardblokken, standaardsubblokken, een redundant blok, en redundante subblokken, alsmede geintegreerde schakeling bevattende meerdere van zulke matrixgeheugens.
JPH02208898A (ja) * 1989-02-08 1990-08-20 Seiko Epson Corp 半導体記憶装置
JPH05109292A (ja) * 1991-10-14 1993-04-30 Toshiba Corp 不揮発性半導体記憶装置

Also Published As

Publication number Publication date
DE69230281T2 (de) 2000-07-13
US5329488A (en) 1994-07-12
DE69230281D1 (de) 1999-12-16
EP0549193B1 (en) 1999-11-10
EP0549193A2 (en) 1993-06-30
KR930014612A (ko) 1993-07-23
JPH05182491A (ja) 1993-07-23
EP0549193A3 (cg-RX-API-DMAC7.html) 1994-04-27
KR950014802B1 (ko) 1995-12-14

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