JP2542783B2 - Method and apparatus for forming powder as a powder layer - Google Patents
Method and apparatus for forming powder as a powder layerInfo
- Publication number
- JP2542783B2 JP2542783B2 JP5083522A JP8352293A JP2542783B2 JP 2542783 B2 JP2542783 B2 JP 2542783B2 JP 5083522 A JP5083522 A JP 5083522A JP 8352293 A JP8352293 A JP 8352293A JP 2542783 B2 JP2542783 B2 JP 2542783B2
- Authority
- JP
- Japan
- Prior art keywords
- powder
- drum
- area
- layer
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000002441 reversible effect Effects 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 abstract description 22
- 229920000642 polymer Polymers 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000000110 selective laser sintering Methods 0.000 description 2
- 241001470502 Auzakia danava Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007528 sand casting Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
Classifications
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- G05B19/02—Programme-control systems electric
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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- B22F12/60—Planarisation devices; Compression devices
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/004—Filling molds with powder
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
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- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
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- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- G—PHYSICS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
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- Plasma & Fusion (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
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- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
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- Powder Metallurgy (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Laser Beam Processing (AREA)
- Micro-Organisms Or Cultivation Processes Thereof (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Exhaust Gas After Treatment (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Photoreceptors In Electrophotography (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Preparation Of Clay, And Manufacture Of Mixtures Containing Clay Or Cement (AREA)
- Silicon Compounds (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、粉末を粉末層として分
与する方法及び装置に関するものである。FIELD OF THE INVENTION The present invention relates to a method and apparatus for dispensing powder as a powder bed.
【0002】この方法及び装置は、とくに順次粉末層を
形成し、指向エネルギービームたとえばレーザビームを
粉末層の選択された位置に指向して選択的に焼結して所
望の部品を積層的に形成製造するコンピュータ支援レー
ザ装置における粉末層の分与、形成にとりわけ有用であ
る。The method and apparatus, in particular, sequentially form powder layers and direct a directed energy beam, eg, a laser beam, at selected locations in the powder layers to selectively sinter to form the desired components in a stack. It is particularly useful for dispensing and forming powder layers in manufacturing computer assisted laser devices.
【0003】[0003]
【発明が解決しようとする課題】基礎となる表面上に平
坦な粉末層を形成しようとする場合、厚さを均一にする
ため均らし部材を使用することが往々にしてなされてい
る。しかしながら、均らし部材を使用して平坦化させる
場合に好ましくない粉末の撹乱がおこることが多く、剪
断力(shear stress)が粉末に働き、この
ため、変形、変質しやすい材料を粉末層とする場合適切
な結果が得られなかった。とくに、ポリマーたとえばナ
イロンなどの粉末の場合、熱により凝集、粘着が起こり
やすく、このような場合には応力が働くことにより塊状
化が起こることもしばしばで、塊状化部分が平坦化した
層に生成し、厚さが薄い場合その欠落による凹部が形成
されることもあり、粉末層の均質性に問題が多かった。When attempting to form a flat powder layer on the underlying surface, it is often the case to use a leveling member to achieve a uniform thickness. However, when flattening using a leveling member, undesired disturbance of the powder often occurs, and shear force acts on the powder, so that a material that is easily deformed or deteriorated is used as the powder layer. If the proper result was not obtained. In particular, in the case of powders of polymers such as nylon, aggregation and sticking easily occur due to heat, and in such cases, agglomeration often occurs due to the action of stress, and agglomerated parts are formed in a flattened layer. However, when the thickness is thin, recesses may be formed due to the lack thereof, and there are many problems in the homogeneity of the powder layer.
【0004】とりわけ、粉末層を順次形成し、その選択
された位置にエネルギービームを指向して選択的に焼結
・融合を行わせ、この操作を反復して所望の部品を製造
する選択的・指向エネルギービーム焼結法においては、
このような問題点はぜひとも解決されなければならな
い。In particular, the powder layer is sequentially formed, the energy beam is directed to the selected position to selectively sinter and fuse, and this operation is repeated to produce a desired part. In the directed energy beam sintering method,
Such problems must be solved by all means.
【0005】[0005]
【課題を解決するための手段】前述の問題点は大部分、
本発明の方法および装置によって解決される。本発明は
おいては、目標区域上に粉末を分与して平坦粉末層を形
成する場合、たとえばその区域の一端部にある量の粉末
を供給し、端部から粉末層に求められる必要な厚さの間
隔を保持して目標区域に沿ってドラムを上記一端部から
他端部に向けて移動させてドラム通過後に平坦層を残す
よう操作させ、このドラムを、その移動方向とは逆(c
ounter)方向に回転させること、すなわちカウン
ター・ローテーションを行うことを特徴とする。ドラム
は、逆回転されながら目標区域に沿って移動し、前面の
粉末の山と接触して粉末を前記運動方向に放出し、ドラ
ムの背後に、所望の間隔の厚さを有する粉末層を残す。Most of the problems mentioned above are
It is solved by the method and device of the present invention. In the present invention, when the powder is dispensed onto the target area to form a flat powder layer, for example, a certain amount of powder is supplied at one end of the area and the required thickness of the powder layer is obtained from the end. The drum is moved along the target area from the one end to the other end while keeping a certain distance, and the drum is operated so as to leave a flat layer after passing through the drum.
It is characterized by rotating in the (outer) direction, that is, performing counter rotation. The drum moves along the target area while being counter-rotated and comes into contact with the pile of powder on the front surface to expel the powder in said direction of movement, leaving behind the drum a powder layer with a desired spacing thickness .
【0006】本発明の粉末を分与し、粉末層として形成
する方法及び装置は、とくに、たとえばレーザビームな
どの指向エネルギービームにより、逐次形成する粉末層
の選択された部分を選択的に焼結して積層的に所望の部
品を製造する方法に適当である。このような選択的焼結
のための装置は、部品を製造する目標区域にビームを選
択的に放出するレーザまたはその他の指向性エネルギー
源を含む。粉末分与系が目標区域上に粉末を堆積する。
目標区域上に展張された粉末層を焼結するために、レー
ザ制御機構がレーザビームの標的を移動させ、またレー
ザを変調する。制御機構は、部品の所望の層を生じるよ
うに、限定された境界内部の粉末のみを選択的に焼結す
る。制御機構によってレーザが粉末層を逐次に選択的に
焼結して、相互に焼結された複数層から成る全体部品を
形成する。各焼結区域の境界が部品のそれぞれの断面区
域に対応する。好ましくは、制御機構は、各層について
境界を特定するためのコンピュータ、例えばCAD/C
AM系を含む。すなわち、コンピュータは部品の全体寸
法と形状のデータを与えられると、各層について境界を
特定し、特定された境界に対応してレーザ制御機構を作
動する。あるいは、最初から各層の特定の境界をコンピ
ュータにプログラミング入力する事ができる。The method and apparatus for dispensing the powder of the present invention to form a powder layer is, in particular, to selectively sinter selected portions of the powder layer to be successively formed by a directed energy beam such as a laser beam. It is suitable for a method of producing desired parts in a laminated manner. Equipment for such selective sintering includes a laser or other directional energy source that selectively emits a beam to a target area where the component is manufactured. A powder dispensing system deposits powder on the target area.
A laser control mechanism moves the target of the laser beam and also modulates the laser to sinter the powder layer spread on the target area. The control mechanism selectively sinters only the powder within the limited boundaries to produce the desired layer of the part. A control mechanism causes a laser to selectively sinter the powder layers sequentially to form an overall part made up of layers that are sintered together. The boundaries of each sintering zone correspond to a respective cross-sectional area of the part. Preferably, the control mechanism is a computer, such as CAD / C, for identifying boundaries for each layer.
Including AM system. That is, the computer, given the data of the overall size and shape of the part, specifies the boundary for each layer and operates the laser control mechanism corresponding to the specified boundary. Alternatively, the specific boundaries of each layer can be programmed into the computer from scratch.
【0007】すなわち、この選択的焼結法では、粉末の
第1部分を目標面上に堆積する段階と、目標面に沿って
指向エネルギービーム(好ましくはレーザビーム)の標
的を走査する段階と、第1粉末部分の第1層を目標面上
において焼結する段階とを含む。第1層は、部分の第1
断面区域に相当する。レーザビームの標的が第1層を画
成する境界内部にある時に指向エネルギー源を走査する
事によって粉末を焼結する。粉末の第2部分を第1焼結
層の上に堆積させ、レーザビームの標的を第1焼結層の
表面に沿って走査する。レーザビームの標的が第2粉末
部分の第2層の境界内部にある時に指向エネルギー源を
走査する事によって、第2層を焼結する。第2層の焼結
は同時に第1層と第2層を接合させ一体として結合体
(cohesive mass)を形成する。先に焼結
された層の上に逐次に粉末部分を堆積させ、各堆積層を
逐次焼結させる。1つの実施態様として、粉末を連続的
に目標区域の中に堆積させる。That is, in the selective sintering method, a step of depositing a first portion of powder on a target surface and a step of scanning a target of a directed energy beam (preferably a laser beam) along the target surface, Sintering the first layer of the first powder portion on the target surface. The first layer is the first of the portions
Corresponds to the section area. Sintering the powder by scanning the directional energy source when the laser beam target is within the boundary defining the first layer. A second portion of the powder is deposited on the first sintered layer and a laser beam target is scanned along the surface of the first sintered layer. Sintering the second layer by scanning the directional energy source when the target of the laser beam is inside the boundary of the second layer of the second powder portion. The sintering of the second layer simultaneously joins the first and second layers to form a cohesive mass as a unit. The powder portions are sequentially deposited on the previously sintered layers and each deposited layer is sequentially sintered. In one embodiment, the powder is continuously deposited in the target area.
【0008】レーザビームの標的がそれぞれの層の境界
内部に指向されている時に粉末が焼結されるように、レ
ーザビームがラスタ走査中にオンオフ変調される。好ま
しくはレーザビームはコンピュータによって制御され
る。このコンピュータはCAD/CAM系を含み、この
場合、製造される部品の全体寸法と形状に関するデータ
をコンピュータに与え、このコンピュータが部品の各目
標区域の境界を確定する。コンピュータは、確定された
境界を使用して、部品の断面区域に対応して各層の焼結
を制御する。他の実施態様においては、コンピュータは
部品の各断面区域の境界データのみをプログラミングさ
れる。The laser beam is modulated on and off during the raster scan so that the powder is sintered when the target of the laser beam is directed inside the boundaries of the respective layers. Preferably the laser beam is controlled by a computer. The computer includes a CAD / CAM system which provides the computer with data regarding the overall size and shape of the part to be manufactured, which computer defines the boundaries of each target area of the part. The computer uses the determined boundaries to control the sintering of each layer corresponding to the cross-sectional area of the part. In another embodiment, the computer is programmed with only boundary data for each cross sectional area of the part.
【0009】選択的・指向エネルギービーム焼結法で
は、粉末温度を調整するための下向き送気機構が配備さ
れることが好ましい。この機構は、目標区域を画成する
支持体と、目標区域に空気を送る機構と、目標区域に達
する前に空気温度を制御する機構とを含む。支持体は、
粉末を堆積させる多孔媒体と、この媒体に隣接するプレ
ナムとを含む。このようにして、温度制御された空気が
目標区域中の粉末に送られ、目標区域中の焼結粉末と非
焼結粉末の温度制御を進行させる。In the selective and directed energy beam sintering method, it is preferable to provide a downward air feeding mechanism for adjusting the powder temperature. The mechanism includes a support defining a target area, a mechanism for delivering air to the target area, and a mechanism for controlling the air temperature before reaching the target area. The support is
It includes a porous medium for depositing the powder and a plenum adjacent to the medium. In this way, temperature-controlled air is delivered to the powder in the target area, promoting temperature control of the sintered and non-sintered powder in the target area.
【0010】図面は選択的・指向エネルギービーム焼結
法を説明するものである。図1は同方法による装置全体
の分解斜視図を示す。全体として、装置10はレーザ1
2と、粉末分与器14と、レーザ制御手段16とを含
む。さらに詳しくは、粉末分与器14は、粉末22を受
けるホッパ20を有し、このホッパは排出口24を有す
る。この排出口24は粉末を目標区域26の中に分与す
るように配向され、この区域26は図1においては全体
的に包囲構造28によって画成される。もちろん、粉末
22を分与するために他の多くの実施態様が可能であ
る。The drawings illustrate a selective directed energy beam sintering process. FIG. 1 shows an exploded perspective view of the entire apparatus by the same method. Overall, the device 10 is a laser 1
2, powder dispenser 14, and laser control means 16. More specifically, the powder dispenser 14 has a hopper 20 for receiving the powder 22, the hopper having an outlet 24. The outlet 24 is oriented to dispense the powder into a target area 26, which area 26 is generally defined in FIG. Of course, many other embodiments are possible for dispensing the powder 22.
【0011】レーザ12の構成要素を図1において多少
略示的に示し、これはレーザヘッド30、安全シャッタ
32およびフロントミラー組立体34とを含む。使用さ
れるレーザの型は多くのファクタに依存し、特に焼結さ
れる粉末22の型に依存している。図1の実施態様にお
いては、Nd:YAGレーザ(レーザメトリックス95
00Q)を使用した。これは、連続モードの100ワッ
ト最高出力を有し、連続モードまたはパルスモードで作
動する事ができる。レーザ12のレーザビーム出力は、
赤外線に近い約1060nMの波長を有する。図1に図
示のレーザ12は、約1キロヘルツ乃至40キロヘルツ
の選択範囲と約6ナノ秒の持続時間とを有する内部パル
スレート発生器を含む。パルスモードまたは連続モード
のいずれにせよ、レーザ12は図1の矢印によって示さ
れた通路に沿って走行するレーザビームを選択的に発生
するように、オンオフ変調される事ができる。The components of the laser 12 are shown somewhat schematically in FIG. 1, which includes a laser head 30, a safety shutter 32 and a front mirror assembly 34. The type of laser used depends on many factors, especially the type of powder 22 to be sintered. In the embodiment of FIG. 1, an Nd: YAG laser (laser metrics 95
00Q) was used. It has a maximum output of 100 watts in continuous mode and can operate in continuous mode or pulsed mode. The laser beam output of the laser 12 is
It has a wavelength of about 1060 nM, which is close to infrared light. The laser 12 illustrated in FIG. 1 includes an internal pulse rate generator having a selected range of about 1 kilohertz to 40 kilohertz and a duration of about 6 nanoseconds. In either pulsed mode or continuous mode, the laser 12 can be on-off modulated to selectively generate a laser beam traveling along the path indicated by the arrows in FIG.
【0012】レーザビームを焦点合わせするため、集束
レンズ36と38が図1に図示のようにレーザビームの
走路に沿って配置されている。集束レンズ38を使用す
るだけでは、この集束レンズ38とレーザ12との間隔
を変動する事によって真焦点の位置を容易に調節する事
ができない。レーザ12と集束レンズ38との間に配置
された集束レンズ36は、この集束レンズ36とレーザ
12との間に虚焦点を作る。集束レンズ38と虚焦点と
の間隔を変動させる事により、集束レンズ38のレーザ
12と反対側のレーザビーム走路に沿って真焦点を制御
する事ができる。近年、光学分野で多くの進歩が成さ
れ、レーザビームを一定の位置に効率的に焦点合わせす
るためのその他の多くの方法が存在する。To focus the laser beam, focusing lenses 36 and 38 are placed along the path of the laser beam as shown in FIG. Only by using the focusing lens 38, the position of the true focal point cannot be easily adjusted by changing the distance between the focusing lens 38 and the laser 12. The focusing lens 36 arranged between the laser 12 and the focusing lens 38 creates an imaginary focal point between the focusing lens 36 and the laser 12. By varying the distance between the focusing lens 38 and the imaginary focus, the true focus can be controlled along the laser beam path of the focusing lens 38 on the side opposite to the laser 12. In recent years, many advances have been made in the optics field, and there are many other ways to efficiently focus a laser beam at a fixed location.
【0013】さらに詳しくは、レーザ制御手段16はコ
ンピュータ40と走査系42とを含む。好ましい実施態
様において、コンピュータ40はレーザ制御用マイクロ
プロセッサと、データ発生用CAD/CAMシステムを
含む。図1に図示の実施態様において、パソコンが使用
され(Commodore64)、その主アトリビュー
トはアクセシブルインターフェースポートと、ノンマス
カブル割り込みを発生するフラグラインとを含む。More specifically, the laser control means 16 includes a computer 40 and a scanning system 42. In the preferred embodiment, computer 40 includes a laser control microprocessor and a CAD / CAM system for data generation. In the embodiment illustrated in FIG. 1, a personal computer is used (Commodore 64), the main attributes of which include an accessible interface port and a flag line which generates a non-maskable interrupt.
【0014】図1に図示のように、走査系42は、レー
ザビームの走路を方向変換するプリズム44を含む。も
ちろん装置10の具体的レイアウトが、レーザビーム走
路の操作のために単数のプリズムを必要とするか複数の
プリズム44を必要とするかを決定する際の基本的ファ
クタである。また走査系42はそれぞれの検流計48、
49によって駆動される一対の反射鏡46、47を含
む。検流計48、49は、それぞれの反射鏡46、47
を選択的に配向するようにそれぞれの反射鏡に連結され
る。検流計48、49は相互に直角に取り付けられ、従
って反射鏡46、47が相互に直角に取り付けられる。
関数発生ドライバー50が検流計48の運動を制御し
(検流計49は検流計48の運動に従属させられる)、
従ってレーザビームの標的(図1において矢印で示す)
が目標区域26の中において制御される。図1に図示の
ように、ドライバー50はコンピュータ40に対して作
動的に連結されている。走査系42として使用するた
め、他の走査法、例えば音響−光学スキャンナー、回転
多角形反射鏡、および共鳴反射鏡スキャンナーを使用す
る事ができる。As shown in FIG. 1, the scanning system 42 includes a prism 44 that redirects the path of the laser beam. Of course, the specific layout of the apparatus 10 is a fundamental factor in determining whether a single prism or multiple prisms 44 are required for steering the laser beam path. Further, the scanning system 42 is a galvanometer 48,
It includes a pair of reflectors 46, 47 driven by 49. The galvanometers 48 and 49 are the reflecting mirrors 46 and 47, respectively.
Are connected to respective reflecting mirrors so as to selectively orient. The galvanometers 48, 49 are mounted at right angles to each other and therefore the reflectors 46, 47 are mounted at right angles to each other.
The function generating driver 50 controls the movement of the galvanometer 48 (the galvanometer 49 is subordinate to the movement of the galvanometer 48),
Therefore the target of the laser beam (indicated by the arrow in FIG. 1)
Are controlled in the target area 26. As shown in FIG. 1, the driver 50 is operably connected to the computer 40. Other scanning methods can be used for use as the scanning system 42, such as acousto-optic scanners, rotating polygon mirrors, and resonant mirror scanners.
【0015】図2は同方法によって製造される物品の一
部および目標区域に対するレーザビームのラスタパタン
を示す斜視図である。図2において、部品52の一部が
略示され、これは4層54−57から成る。レーザビー
ム64の標的はラスタ走査パタン66である。この明細
書において、「標的」は方向を示す中立的用語であっ
て、レーザ12の変調状態を意味するものではない。便
宜上、軸線68は急速走査軸線とし、軸線70は低速走
査軸線とする。軸線72は部品の形成方向である。FIG. 2 is a perspective view showing a raster pattern of a laser beam with respect to a part of an article manufactured by the same method and a target area. In FIG. 2, a portion of component 52 is shown schematically, which consists of four layers 54-57. The target of the laser beam 64 is a raster scan pattern 66. In this specification, "target" is a directional neutral term and does not mean the modulation state of the laser 12. For convenience, axis 68 is the fast scan axis and axis 70 is the slow scan axis. The axis 72 is the forming direction of the part.
【0016】図6と図7において、選択的レーザビーム
焼結法における粉末分与器20の実施態様を示す。全体
として、支持体100が目標区域102を画成し、この
区域に対してレーザビーム64の標的が指向される(図
1)。ホッパー104が粉末106を開口108から目
標区域102に分与する。計量ローラ(図示されず)が
開口108に配置され、このローラが回転された時に、
一定量の粉末を目標区域102の末端110に線状に配
置する。6 and 7 show an embodiment of the powder dispenser 20 in the selective laser beam sintering method. Overall, the support 100 defines a target area 102 against which the target of the laser beam 64 is directed (FIG. 1). The hopper 104 dispenses the powder 106 through the opening 108 into the target area 102. A metering roller (not shown) is placed in the opening 108 and when this roller is rotated,
A quantity of powder is linearly arranged at the end 110 of the target area 102.
【0017】ならし機構114が粉末の山106を目標
区域の他端112に向かって広げる。ならし機構114
は、外側に刻み付き面(knurled surfac
e)を備えた円筒形ドラム116を含む。バー120上
に取り付けられたモータ118が滑車122とベルト1
24を介してドラム116に連結されてこれを回転させ
る。A leveling mechanism 114 spreads the powder pile 106 toward the other end 112 of the target area. Leveling mechanism 114
Is an outer knurled surface
e) with a cylindrical drum 116. A motor 118 mounted on the bar 120 drives the pulley 122 and the belt 1
It is connected to the drum 116 via 24 and rotates it.
【0018】またならし機構114はドラム116を目
標区域の一端110と他端112との間を移動させる機
構126を備える。機構126は、バー120を水平方
向および垂直方向に移動させるX/Yテーブル128を
含む。すなわち、このテーブル128が固定され、プレ
ート130がテーブル128に対して選択的に可動であ
る。The leveling mechanism 114 also includes a mechanism 126 for moving the drum 116 between one end 110 and the other end 112 of the target area. The mechanism 126 includes an X / Y table 128 that moves the bar 120 horizontally and vertically. That is, the table 128 is fixed, and the plate 130 is selectively movable with respect to the table 128.
【0019】製造中の製品の温度を制御する装置を図8
に示す。レーザビームによってまだ走査されていない粒
子の温度と既に走査された粒子の温度との差異の故に、
製造中の製品の望ましくない収縮の生じる事が観察され
た。温度制御された空気の目標区域を通しての下降流が
このような望ましくない温度差を調整できる事が発見さ
れた。図8に示す温度制御された空気の下方送気装置1
32は焼結される粉末粒子の上層と空気との間の熱交換
によって前記のような収縮を低減させる。この熱交換が
焼結される粒子の上層の温度を調整し、上層の平均温度
を制御し、製造される製品から体積熱を除去する事によ
って製品が非焼結物質に成長する事を防止する。流入す
る空気の温度は、粉末の軟化点以上とするが、十分な焼
結の生じる温度以下に調節される。FIG. 8 shows a device for controlling the temperature of the product being manufactured.
Shown in Due to the difference between the temperature of the particles not yet scanned by the laser beam and the temperature of the particles already scanned,
It has been observed that undesirable shrinkage of the product during manufacture occurs. It has been discovered that the downflow of temperature controlled air through the target area can adjust for such undesirable temperature differences. Temperature-controlled downward air supply device 1 shown in FIG.
32 reduces such shrinkage by heat exchange between the upper layer of powder particles to be sintered and air. This heat exchange regulates the temperature of the upper layer of the particles to be sintered, controls the average temperature of the upper layer, and removes volumetric heat from the manufactured product to prevent the product from growing into a non-sintered material. . The temperature of the inflowing air is not lower than the softening point of the powder, but is adjusted to be not higher than the temperature at which sufficient sintering occurs.
【0020】下方送気装置132は、目標区域136を
画成する支持体134と、空気を目標区域に向かって送
る手段と、電気抵抗142など流入空気の温度を制御す
る機構などを含む。空気を目標区域に送る手段は、支持
体134を包囲するチャンバ138と、送気ファン14
0および/または吸引ファン141とを含む。窓144
がビーム64(図1)の標的を目標区域136に対して
導入する。図1または図7に図示のような粉末分与機構
(図示されず)が少なくとも部分的にチャンバ138の
中に配置されて、粉末を目標区域136の上に分与す
る。The lower air delivery device 132 includes a support 134 defining a target area 136, means for directing air toward the target area, a mechanism for controlling the temperature of the incoming air such as an electrical resistance 142, and the like. Means for delivering air to the target area include a chamber 138 surrounding the support 134 and an air delivery fan 14.
0 and / or suction fan 141. Window 144
Introduces the target of beam 64 (FIG. 1) to target area 136. A powder dispensing mechanism (not shown) as shown in FIG. 1 or FIG. 7 is located at least partially within the chamber 138 to dispense the powder onto the target area 136.
【0021】支持体134はハニカム状多孔質媒体14
8の上にフィルタ媒体146(細孔紙)を支持する。空
気を集めて出口152に送るためにプレナム150が配
置される。もちろん出口152は真空源141またはそ
の他の空気処理機構に接続される。The support 134 is a honeycomb-shaped porous medium 14.
8 supports the filter medium 146 (pore paper). A plenum 150 is arranged to collect and direct air to the outlet 152. Of course, outlet 152 is connected to vacuum source 141 or other air treatment mechanism.
【0022】この方法の基本的着想は層ごとに部品を形
成するにある。すなわち部品は複数の別々の断面区域か
らなるものとみなされ、これらの区域が積層されて部品
の三次元構造を成す。それぞれの断面区域は二次元境界
によって画成され、もちろん各区域がそれぞれ独特の境
界を有する事ができる。また好ましくは各層の厚さ(軸
線72方向の寸法)は一定とする。The basic idea of this method consists in forming the parts layer by layer. That is, the part is considered to consist of a plurality of separate cross-sectional areas, which are stacked to form the three-dimensional structure of the part. Each cross-sectional area is defined by a two-dimensional boundary, and of course each area can have its own unique boundary. Further, preferably, the thickness of each layer (dimension in the direction of the axis 72) is constant.
【0023】この方法においては粉末22の第1部分が
目標区域26の中に配置され、レーザビーム64によっ
て選択的に焼結されて、第1焼結層54を作る(図
2)。この第1焼結区域54は所望の部品の第1断面区
域に相当する。レーザビームは配置された粉末22を画
成された境界内部においてのみ選択的に焼結する。In this method, a first portion of powder 22 is placed in target area 26 and selectively sintered by laser beam 64 to produce first sintered layer 54 (FIG. 2). This first sintering area 54 corresponds to the first cross-sectional area of the desired part. The laser beam selectively sinters the disposed powder 22 only within the defined boundaries.
【0024】もちろん、粉末22を選択的に焼結する他
の方法がある。一つの方法はレーザビームの標的を「ベ
クトル」方式で指向するにある。すなわちビームが実際
に所望の部分の各断面区域の輪郭と内部を実際にたどる
にある。あるいはビーム64の標的を反復パタンで操作
し、またレーザ12を変調させる。図2においてはラス
タ操作パタン66を使用するが、これはその実施の簡単
さの故にベクトル方式に勝っている。他の方法は、ベク
トル方式とラスタ操作方式とを組合せ、一つの層の所望
の境界をベクトル方式でたどり、境界の内部をラスタ操
作モードで照射するにある。もちろん選ばれる方法につ
いて選択の余地がある。例えばラスタモードは、ベクト
ルモードと比較して、ラスタパタン66の軸線68、7
0に対して平行でない円弧および線を近似するにすぎな
い点で不利である。場合によっては、ラスタパタンモー
ドで製造される時に部品の解像度が低下する。しかしラ
スタモードは実施の簡単さの故にベクトルモードに勝っ
ている。Of course, there are other methods of selectively sintering the powder 22. One way is to direct the target of the laser beam in a "vector" fashion. That is, the beam actually follows the contour and interior of each cross-sectional area of the desired portion. Alternatively, the target of the beam 64 is manipulated in a repetitive pattern and the laser 12 is modulated. In FIG. 2, a raster manipulation pattern 66 is used, which is superior to the vector system because of its simplicity of implementation. Another method consists in combining the vector method and the raster operation method, tracing the desired boundary of one layer in the vector method and illuminating the inside of the boundary in the raster operation mode. Of course, there is a choice as to which method to choose. For example, in raster mode, the axes 68, 7 of the raster pattern 66 are compared to vector mode.
The disadvantage is that it only approximates arcs and lines that are not parallel to 0. In some cases, the resolution of the part is reduced when manufactured in raster pattern mode. However, raster mode is superior to vector mode because of its simplicity of implementation.
【0025】図1に戻って、目標区域26において連続
ラスタパタンでレーザビーム64の標的が走査される。
ドライバ50はラスタパタン66(図2)を生じるよう
に検流計48、49を制御する。反射鏡46の運動は急
速走査軸線68(図2)に沿ったレーザビーム64の標
的の運動を制御するのに対して、反射鏡47の運動は低
速走査軸線70に沿ったレーザビーム64の標的の運動
を制御する。Returning to FIG. 1, the target area 26 is scanned with a laser beam 64 target in a continuous raster pattern.
The driver 50 controls the galvanometers 48, 49 to produce the raster pattern 66 (FIG. 2). The movement of the reflector 46 controls the movement of the laser beam 64 target along the fast scan axis 68 (FIG. 2), while the movement of the reflector 47 targets the laser beam 64 along the slow scan axis 70. Control the movement of.
【0026】コンピュータ40は次に作られる部品の断
面区域に関する情報を保持している。従って、バラバラ
の粉末22の一部が目標区域26の中に分与され、レー
ザビーム64の標的がその連続ラスタパタンで動かされ
る。ラスタパタン66の中において所望の間隔でレーザ
ビームを選択的に発生するように、コンピュータ40が
レーザ12を変調する。このようにして、レーザ12の
指向ビームが目標区域26の中において粉末22を選択
的に焼結して、所望の断面区域の境界を有する所望の焼
結層が得られる。このプロセスを層ごとに繰り返し、各
層を相互に焼結して、凝集部品、例えば図2の部品52
を製造する。Computer 40 holds information about the cross-sectional area of the next part to be made. Therefore, a portion of the loose powder 22 is dispensed into the target area 26 and the target of the laser beam 64 is moved in its continuous raster pattern. Computer 40 modulates laser 12 to selectively generate a laser beam in raster pattern 66 at desired intervals. In this way, the directed beam of the laser 12 selectively sinters the powder 22 in the target area 26 to obtain the desired sintered layer with the desired cross-sectional area boundaries. This process is repeated layer by layer, sintering the layers together to form an agglomerated part, such as part 52 of FIG.
To manufacture.
【0027】図1に図示のレーザヘッド30の比較的低
い出力の故に、粉末22はこの低い出力と両立する低い
融解熱のプラスチック材料(例えばABS)から成る。
本発明の装置10によって製造された部品について、数
種の後形成処理が考えられる。例えば、このようにして
製造された部品を原型モデル、すなわち砂形鋳造あるい
はろう型鋳造の金型として使用する場合には、後形成処
理は必要ない。また他の場合には、製造された部品の一
部を緊密な公差に設計するために、ある程度の後形成加
工が実施される。あるいは、ある種の型の部品は特定の
材料特性を有する必要があり、これは部品の熱処理およ
び/または化学処理によって実施される。例えば、粉末
22の粒径は、開放気孔を有する部品を製造するように
設定する事ができ、またエポキシなどの物質を部品中に
噴射すれば、所望の噴射特性、例えば、圧縮強さ、耐摩
性、均質性などが得られる。Due to the relatively low power output of the laser head 30 shown in FIG. 1, the powder 22 comprises a low heat of fusion plastic material (eg ABS) compatible with this low power output.
Several types of post-forming treatments are conceivable for the parts produced by the apparatus 10 of the present invention. For example, if the part produced in this way is used as a prototype model, that is, a mold for sand casting or wax casting, no post-forming treatment is necessary. In other cases, some post-forming is performed to design some of the manufactured parts to tight tolerances. Alternatively, certain types of parts need to have certain material properties, which may be performed by heat treatment and / or chemical treatment of the part. For example, the particle size of the powder 22 can be set to produce parts with open porosity, and if a substance such as epoxy is injected into the part, the desired injection characteristics, such as compressive strength, wear resistance, etc. can be achieved. The characteristics, homogeneity, etc. are obtained.
【0028】粉末22の性能を改良する2、3の特性が
確認された。第1に、カーボンブラックなどの顔料の添
加によって、粉末の吸収エネルギーを制御する事ができ
る。添剤の濃度と組成の調節によって、粉末の吸収率k
を制御する事ができる。一般にエネルギー吸収率は下記
の指数崩壊関係式によって支配される。 I(z)=Io exp(kZ) ここにI(z)は表面に対する垂直距離zにおける粉末
中の最適吸収エネルギー強さ(単位面積当たり粉末)、
IoはIの表面値(表面におけるエネルギー強さ)、ま
たkは吸収率とする。吸収率kの調節と一定量のビーム
エネルギー量を吸収する層の厚さの調節によって、この
工程中に吸収されるエネルギーを全体的に制御する事が
できる。A few properties have been identified which improve the performance of powder 22. First, the absorption energy of the powder can be controlled by adding a pigment such as carbon black. By adjusting the concentration and composition of the additive, the absorption rate k of the powder
Can be controlled. Generally, the energy absorption rate is governed by the following exponential decay relation. I (z) = Io exp (kZ) where I (z) is the optimum absorbed energy intensity in the powder at a perpendicular distance z to the surface (powder per unit area),
Io is the surface value of I (energy intensity on the surface), and k is the absorptance. By adjusting the absorptance k and adjusting the thickness of the layer that absorbs a certain amount of beam energy, the energy absorbed during this step can be controlled entirely.
【0029】粉末の他の重要な特性は、粒子のアスペク
ト比(すなわち粒子の最大寸法と最小寸法の比)であ
る。すなわち、ある範囲のアスペクト比を有する粒子
は、部品の収縮中に湾曲する傾向がある。低いアスペク
ト比を有する粒子、すなわち殆んど球形の粒子の場合、
部品の収縮はより三次元的となり、より大きな湾曲を生
じる。高いアスペクト比を有する粒子(例えばフレーク
状またはロッド状)の粒子を使用する場合、収縮は主と
して垂直方向に生じ、部品の湾曲度を減少させまたは除
去する。高いアスペクト比の粒子はより大きな結合自由
度を有するものと考えられ、粒子間接触は優先的に水平
面に配向されて、収縮は主として垂直方向に生じる。Another important property of the powder is the aspect ratio of the particles (ie the ratio of the maximum size to the minimum size of the particles). That is, particles having a range of aspect ratios tend to bend during the shrinking of the part. For particles with a low aspect ratio, i.e. almost spherical particles,
The shrinkage of the part becomes more three-dimensional, resulting in greater curvature. When using particles with a high aspect ratio (eg, flakes or rods), shrinkage occurs primarily in the vertical direction, reducing or eliminating the curvature of the part. High aspect ratio particles are believed to have greater bonding degrees of freedom, with interparticle contacts preferentially oriented in the horizontal plane and shrinkage predominantly in the vertical direction.
【0030】[0030]
【実施例】図6と図7に本発明の粉末を粉末層として分
与し形成する装置の例を示す。分与機構114は、製造
中の部品を乱す事なく目標区域102の中において制御
された平坦な粉末層を形成させる事を見出した。秤量さ
れた粉末量106が目標区域102の末端110に堆積
される。粉末が分与された時にドラム116を末端11
0から移動させる。図7に図示のように、粉末が山状に
分与された後、プレート130とバー120(および付
属の機構)が垂直に上昇される。プレート130がホッ
パ104の方に移動して、ドラム116を末端110に
沿った粉末の山に隣接する位置にもってくる。そこでド
ラム116を下降させて粉末の山と接触させ、目標区域
102に沿って水平方向に移動させて、粉末の山を平坦
な層状に広げる。もちろん、テーブル128に対するプ
レート130の正確な位置を制御する事ができるので、
ドラム116と目標区域102の間隔が正確に制御され
て、粉末層に所望の厚さを与える事ができる。好ましく
は、ドラム116と目標区域102との間隔は一定であ
って、平行運動を生じるが、これ以外の間隔オプション
も可能である。EXAMPLE FIGS. 6 and 7 show an example of an apparatus for dispensing and forming the powder of the present invention as a powder layer. It has been found that the dispensing mechanism 114 forms a controlled flat powder layer in the target area 102 without disturbing the parts being manufactured. A weighed amount of powder 106 is deposited at the end 110 of the target area 102. When the powder is dispensed, the drum 116 is moved to the end 11
Move from 0. After the powder is dispensed in a pile, as shown in FIG. 7, the plate 130 and bar 120 (and associated mechanism) are raised vertically. The plate 130 moves toward the hopper 104 to bring the drum 116 into position adjacent the pile of powder along the end 110. There, the drum 116 is lowered into contact with the powder peaks and moved horizontally along the target area 102 to spread the powder peaks into a flat layer. Of course, since it is possible to control the exact position of the plate 130 with respect to the table 128,
The distance between the drum 116 and the target area 102 can be precisely controlled to give the powder layer the desired thickness. Preferably, the spacing between the drum 116 and the target area 102 is constant, resulting in a parallel movement, although other spacing options are possible.
【0031】ドラム116が目標区域102に沿って水
平に末端110から他端112まで移動される際に、モ
ータ118によって、ドラム116を逆回転させる。図
6に図示のように「逆回転(conuter−rota
tion)」とは、ドラム116が目標区域102に沿
って水平に移動する方向Mに対して逆方向Rに回転され
る事を意味する。A motor 118 causes the drum 116 to rotate in reverse as the drum 116 is moved horizontally along the target area 102 from the distal end 110 to the other end 112. As shown in FIG. 6, "reverse rotation (computer-rota)
“Tion)” means that the drum 116 is rotated in the opposite direction R with respect to the direction M of horizontal movement along the target area 102.
【0032】さらに詳しくは、図6においてドラム11
6は粉末の山106の後端160と接触して高速で逆回
転される。粉末に対するドラムの機械的作用が粉末を運
動方向Mに放出するので、放出された粒子が粉末の山の
先端区域162に落下する。図6に図示のように、ドラ
ム116の背後に(ドラム116と末端110との間
に)平滑な平坦粉末層164が残される。More specifically, the drum 11 in FIG.
6 contacts the rear end 160 of the powder pile 106 and is rotated in reverse at high speed. The mechanical action of the drum on the powder ejects the powder in the direction of movement M, so that the ejected particles fall into the tip area 162 of the powder pile. A smooth flat powder layer 164 is left behind the drum 116 (between the drum 116 and the end 110) as shown in FIG.
【0033】また図6は、粉末106が先に焼結された
粉末166あるいは焼結されていない粉末168を攪乱
する事なく、目標区域上に分布されうる事を示す。すな
わち、ドラム116は、先に形成された層に対して剪断
作用を加える事なくまた製造中の製品を攪乱する事な
く、目標区域に沿って移動される。このような剪断作用
がないので、焼結された粒子166と非焼結粒子168
とを含む目標区域の脆い基層上に平滑な粉末層106を
分布させる事ができる。FIG. 6 also shows that the powder 106 can be distributed over the target area without disturbing the previously sintered powder 166 or the unsintered powder 168. That is, the drum 116 is moved along the target area without shearing the previously formed layer or disturbing the product being manufactured. Since there is no such shearing action, the sintered particles 166 and the non-sintered particles 168 are
A smooth powder layer 106 can be distributed over the fragile base layer in the target area including and.
【0034】[0034]
【作用・効果】図6から明らかなように、本発明によれ
ば、ドラムが逆方向回転を行うことから、ドラムは前面
の粉末の山106の後端160と接触して接触部分の粉
末を噴きとばし、粉末の山の先端部分162に落下させ
る。このように本発明では、ドラム前面で接触する粒子
だけが上方に持ち上げられ山の先端にとばされて放出さ
れる。ドラムと接触する粉末のみが動き、それ以外の粉
末への影響はない。とくにすでに形成された平坦粉末層
164への影響はない。したがって、形成された平坦面
へ剪断力が加えられることがない。粉末が変質、変形し
やすいものであっても問題はおこらないのである。As is apparent from FIG. 6, according to the present invention, since the drum rotates in the reverse direction, the drum comes into contact with the rear end 160 of the powder ridge 106 on the front surface to remove the powder at the contact portion. It is blown off and dropped onto the tip portion 162 of the powder pile. Thus, in the present invention, only the particles that come into contact with the front surface of the drum are lifted upward, and are skipped and ejected at the tip of the mountain. Only the powder that comes into contact with the drum moves, and the other powders are not affected. In particular, there is no effect on the already formed flat powder layer 164. Therefore, no shearing force is applied to the formed flat surface. No problem occurs even if the powder is easily altered or deformed.
【0035】選択的レーザ焼結法の場合、ナイロンのよ
うなポリマーが使用されることが多いが、このような場
合、凝集、粘着が起こりやすい。ここで剪断力のような
力が働くと、粒子の塊状化がおこり平坦層に悪い影響を
与えることになるが、本発明ではそのような欠点は避け
られる。In the case of the selective laser sintering method, a polymer such as nylon is often used, but in such a case, aggregation and sticking are likely to occur. When a force such as a shearing force acts here, the particles agglomerate and adversely affect the flat layer, but such defects are avoided in the present invention.
【0036】この外、本発明は、基礎体がこわれやすい
表面である場合にもすぐれた効果を奏することは明らか
であろう。In addition to the above, it will be apparent that the present invention exerts an excellent effect even when the base body has a fragile surface.
【0037】選択的レーザ焼結法では、複雑な形状の部
品を比較的容易に製造する事ができる。当業者には明ら
かなように、図3に示す部品は通常の機械加工法によっ
て製造する事が困難である。特にこの部品が比較的小寸
法の場合、キャビティ82と柱84を工作機械によって
製造する事は不可能ではないまでも困難である。このよ
うな製造法を可能にする上で本発明はきわめて有用であ
る。The selective laser sintering method allows relatively complicated parts to be manufactured relatively easily. Those skilled in the art will appreciate that the components shown in FIG. 3 are difficult to manufacture by conventional machining methods. It is difficult, if not impossible, to manufacture cavities 82 and posts 84 by machine tools, especially if the parts are of relatively small dimensions. The present invention is extremely useful in enabling such a manufacturing method.
【図1】選択的・指向エネルギービーム焼結法に使用す
る装置の分解斜視図、FIG. 1 is an exploded perspective view of an apparatus used for a selective and directed energy beam sintering method,
【図2】選択的・指向エネルギービーム焼結法によって
製造される部品の一部および目標区域に対するレーザビ
ームのラスタパタンを示す斜視図、FIG. 2 is a perspective view showing a laser beam raster pattern for a part and a target area of a component manufactured by a selective directed energy beam sintering method;
【図3】選択的・指向エネルギービーム焼結法によって
製造される部品の一例を示す斜視図、FIG. 3 is a perspective view showing an example of a component manufactured by a selective and directed energy beam sintering method,
【図4】図3の部品の部分断面図、4 is a partial cross-sectional view of the component of FIG. 3,
【図5】図3の7−7線に沿ってとられた断面図、5 is a cross-sectional view taken along line 7-7 of FIG. 3,
【図6】本発明の粉末を分与する装置の図式的垂直断面
図、FIG. 6 is a schematic vertical cross-sectional view of an apparatus for dispensing powder of the present invention,
【図7】本発明の粉末分与装置の説明的斜視図、FIG. 7 is an explanatory perspective view of the powder dispensing apparatus of the present invention,
【図8】選択的・指向エネルギービーム焼結法における
粉末温度調整装置の図式的説明図。FIG. 8 is a schematic explanatory view of a powder temperature adjusting device in a selective directed energy beam sintering method.
フロントページの続き (72)発明者 デッカード,カール アール アメリカ合衆国テキサス州、オースチ ン、レイク、オースチン、ブールバー ド、ユー、ティー、エム、エッチ、ピ ー、ナンバー、94 (56)参考文献 特開 昭50−21906(JP,A)Front Page Continuation (72) Inventor Deckard, Carl Earl, Texas, USA, Austin, Lake, Austin, Boulevard, You, Tee, M, Etch, Pee, Number, 94 (56) References -21906 (JP, A)
Claims (16)
この区域中に粉末層として形成する装置において、 ドラム手段と、 前記の区域と前記ドラムとの間に所定の間隔をもって、
前記区域の一端から他端までドラムを移動させる手段
と、 前記区域の一端から他端までのドラムの移動方向と逆方
向に前記ドラムを回転させる手段とを含み、 前記ドラムは、逆回転されて前記一端から他端まで移動
される時に、前記粉末の山と接触して粉末を前記運動方
向に放出し、このドラム手段と前記一端の間に、近似的
に前記所望の間隔の厚さを有する粉末層を残すように成
された粉末層形成装置。1. Dispensing a pile of powder at one end of an area,
In a device for forming a powder layer in this area, a drum means and a predetermined distance between the area and the drum,
Means for moving the drum from one end to the other end of the zone, and means for rotating the drum in a direction opposite to the direction of movement of the drum from one end to the other end of the zone, the drum being rotated in reverse When moving from the one end to the other end, it contacts the pile of powder to expel the powder in the direction of movement, and has approximately the desired spacing thickness between the drum means and the one end. A powder layer forming device configured to leave a powder layer.
に記載の装置。2. The desired spacing is constant.
An apparatus according to claim 1.
が一定であり、ドラム手段が前記区域に対して平行に移
動するようにされている請求項1に記載の装置。3. An apparatus according to claim 1, wherein said area is flat, said desired spacing is constant and said drum means is adapted to move parallel to said area.
面を有する円筒体である請求項1に記載の装置。4. The apparatus of claim 1 wherein said drum means is a cylinder having a substantially uniform circular cross section.
請求項4に記載の装置。5. The device of claim 4, wherein the cylinder has a knurled outer surface.
する手段を含む請求項1に記載の装置。6. The apparatus of claim 1, including means for depositing the powder pile proximate the one end.
おいて: 前記区域に近接した位置においてある量の粉末を供給
し; 前記ある量の粉末の位置の前の位置から前記区域を横切
ってドラムを移動させ; 前記区域を横切っての前記ドラムの移動の方向とは逆方
向にドラムを回転させ;そして、 該ドラムが前記区域を横切って移動する間にある量の粉
末を逆回転ドラムと接触させて、前記移動段階がなされ
た後前記区域上に粉末層が残されるようにする各段階を
含む粉末層形成方法。7. A method of forming a powder layer on an area of a surface, comprising: supplying a quantity of powder at a location proximate to the area; and crossing the area from a position prior to the location of the quantity of powder. Moving the drum; rotating the drum in a direction opposite to the direction of movement of the drum across the zone; and transferring a quantity of powder to the counter rotating drum during movement of the drum across the zone. A method of forming a powder layer, comprising the steps of contacting to leave a powder layer on the area after the moving step.
間隔を保ってドラムを維持するようにする請求項7に記
載の方法。8. The method of claim 7, wherein the drum is maintained at a desired distance from the zone during the moving step.
距離にあり、かつ前記区域は平らである請求項8に記載
の方法。9. The method of claim 8, wherein the desired spacing is a constant distance from the zone and the zone is flat.
請求項7に記載の方法。10. The method of claim 7, wherein the surface of the drum has a rough texture.
ものである請求項7に記載の方法。11. The method of claim 7, wherein the surface of the drum is knurled.
位置に粉末の山を堆積することから成る請求項7に記載
の方法。12. The method of claim 7, wherein said feeding step comprises depositing a powder pile at a location proximate said area.
求項7に記載の方法。13. The method of claim 7, wherein the powder is capable of being sintered.
焼結された状態の部分と、非焼結状態の部分とを有する
請求項13に記載の方法。14. The method of claim 13, wherein the area of the surface containing the powder has a portion in a sintered state and a portion in a non-sintered state.
ドラムと前記粉末との接触の結果として粉末が移動の方
向に射出させられる請求項7に記載の方法。15. The method of claim 7, wherein in the contacting and moving step, powder is ejected in the direction of movement as a result of contact between the drum and the powder.
前記位置において、計量した量の粉末を供給することか
ら成る請求項7に記載の方法。16. The method of claim 7, wherein said feeding step comprises feeding a metered amount of powder at said location proximate said area.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/920,580 US4863538A (en) | 1986-10-17 | 1986-10-17 | Method and apparatus for producing parts by selective sintering |
US920580 | 1986-10-17 | ||
US105316 | 1986-10-17 | ||
US10531687A | 1987-10-05 | 1987-10-05 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63500437 Division |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH06192702A JPH06192702A (en) | 1994-07-12 |
JP2542783B2 true JP2542783B2 (en) | 1996-10-09 |
Family
ID=26802457
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63500437A Expired - Lifetime JP2620353B2 (en) | 1986-10-17 | 1987-10-14 | Method of manufacturing parts by selective sintering |
JP5083522A Expired - Lifetime JP2542783B2 (en) | 1986-10-17 | 1993-04-09 | Method and apparatus for forming powder as a powder layer |
JP7295716A Expired - Lifetime JP2800937B2 (en) | 1986-10-17 | 1995-11-14 | Equipment for manufacturing parts by selective sintering |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63500437A Expired - Lifetime JP2620353B2 (en) | 1986-10-17 | 1987-10-14 | Method of manufacturing parts by selective sintering |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7295716A Expired - Lifetime JP2800937B2 (en) | 1986-10-17 | 1995-11-14 | Equipment for manufacturing parts by selective sintering |
Country Status (15)
Country | Link |
---|---|
US (5) | US5132143A (en) |
EP (3) | EP0542729B1 (en) |
JP (3) | JP2620353B2 (en) |
KR (1) | KR960008015B1 (en) |
AT (3) | ATE138294T1 (en) |
AU (3) | AU603412B2 (en) |
BG (1) | BG47343A3 (en) |
BR (1) | BR8707510A (en) |
DE (4) | DE3751819T2 (en) |
DK (1) | DK329888A (en) |
FI (1) | FI84329C (en) |
HK (3) | HK194796A (en) |
HU (1) | HUT56018A (en) |
MC (1) | MC1931A1 (en) |
WO (1) | WO1988002677A2 (en) |
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1987
- 1987-10-14 EP EP93200093A patent/EP0542729B1/en not_active Revoked
- 1987-10-14 EP EP88900160A patent/EP0287657B2/en not_active Expired - Lifetime
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- 1987-10-14 DE DE3751819T patent/DE3751819T2/en not_active Revoked
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- 1987-10-14 WO PCT/US1987/002635 patent/WO1988002677A2/en active IP Right Grant
- 1987-10-14 MC MC872635A patent/MC1931A1/en unknown
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- 1987-10-14 DE DE3750931T patent/DE3750931T3/en not_active Expired - Fee Related
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- 1987-10-14 JP JP63500437A patent/JP2620353B2/en not_active Expired - Lifetime
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- 1987-10-14 AU AU10466/88A patent/AU603412B2/en not_active Ceased
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- 1987-10-14 AT AT88900160T patent/ATE116179T1/en active
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1988
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1990
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- 1990-12-21 AU AU68346/90A patent/AU632195B2/en not_active Ceased
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1992
- 1992-07-10 US US07/911,879 patent/US5316580A/en not_active Expired - Lifetime
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1993
- 1993-03-17 AU AU35241/93A patent/AU659289B2/en not_active Ceased
- 1993-04-09 JP JP5083522A patent/JP2542783B2/en not_active Expired - Lifetime
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1994
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1995
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1996
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