JPS5976689A - Airtight sealing method of aluminum package - Google Patents

Airtight sealing method of aluminum package

Info

Publication number
JPS5976689A
JPS5976689A JP57185536A JP18553682A JPS5976689A JP S5976689 A JPS5976689 A JP S5976689A JP 57185536 A JP57185536 A JP 57185536A JP 18553682 A JP18553682 A JP 18553682A JP S5976689 A JPS5976689 A JP S5976689A
Authority
JP
Japan
Prior art keywords
laser
output
aluminum
package
weld zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57185536A
Other languages
Japanese (ja)
Other versions
JPH0344876B2 (en
Inventor
Tsutomu Iikawa
勤 飯川
Kaoru Hashimoto
薫 橋本
Takeaki Sakai
酒井 武明
Isao Kawamura
勲 川村
Takeshi Nagai
武 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57185536A priority Critical patent/JPS5976689A/en
Publication of JPS5976689A publication Critical patent/JPS5976689A/en
Publication of JPH0344876B2 publication Critical patent/JPH0344876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/206Laser sealing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/32Bonding taking account of the properties of the material involved

Abstract

PURPOSE:To obtain a weld zone having high airtightness without generation of any weld crack by performing preheating and afterheating in the weld zone by a continuously oscillated laser having a low output, and performing regular welding by using said laser in conjunction with a pulse laser having a large output. CONSTITUTION:The laser beam 9 from a laser system 8 which oscillates continuously the laser having a low output is condensed by a half mirror 7 and a lens system 5. The condensed laser is irradiated to the weld zone 6 of a package consisting of a case 1 and a cover 2, whereby the weld zone is subjected to preheating and afterheating. On the other hand, the laser beam 10 from a laser system 34 which oscillates a pulse laser having a large output is irradiated likewise to the weld zone 6 whereby regular welding is performed. The case for generating the weld crack in the aluminum package is thus eliminated and the stable airtight welding is accomplished. This method is used for airtight sealing of the package of a GaAs semiconductor module for microwave, etc.

Description

【発明の詳細な説明】 (1)発明の」支術分野 本発明はマイクロ液出uaAe半導体モジュール等のパ
ッケージの気密封止に係り、特に熱伝導がよく、@量で
あるアルミニウムパッケージの気笛刊止の方法に関する
DETAILED DESCRIPTION OF THE INVENTION (1) Branch Field of the Invention The present invention relates to hermetic sealing of packages such as micro-liquid uaAe semiconductor modules, and in particular to hermetic sealing of packages such as micro-liquid uaAe semiconductor modules. Concerning the method of ceasing publication.

(2)j文相の背景 従来パッケージは主にステンレス全中心とした鉄系材料
によって作製されているが、熱伝導が患く、重い入点が
ある。このため、近年のアンプの尚出力化に伴う熱発生
および、アンプの軽量化の請求に耐え得る熱伝導性がよ
く、軽撤であるアルミニウムパッケージが強く要望され
ている。
(2) Background of the Japanese Literature Conventional packages are mainly made of iron-based materials, mainly stainless steel, but they suffer from poor heat conduction. For this reason, there is a strong demand for an aluminum package that is lightweight and has good thermal conductivity to withstand the heat generation that accompanies the increased output of amplifiers in recent years and demands for lighter weight amplifiers.

(3)従来技術と問題点 アルミ、ニウム金パッケージとし′Cf用する際に最も
内錐な点はその気密封止法である。すなわら、半纏体累
子9回路基板(il−JIi載しているため、ろう艦な
どの全棒金高温にさらす方法は、素子の劣化を招き採用
出来ない。また饅通溶接で、は、そりパワーが小さすぎ
、アルミニウムの熱放故性が太きいため、溶炭が不6工
となり結局、電子ビーム。
(3) Prior art and problems The most important point when using Cf as an aluminum or nickel-gold package is the hermetic sealing method. In other words, since the semi-integrated circuit board (il-JIi) is mounted, exposing the whole bar to high temperatures such as in a wax tank will cause deterioration of the element and cannot be adopted. However, because the sled power was too low and aluminum's heat dissipation was too strong, the molten coal turned into a waste and eventually became an electron beam.

レーデによる大パワーを局部的に与え得る溶接法が採用
されている。
A welding method that can locally apply large amounts of power using Rede is used.

第1図にケース1とカバー2よりなるアルミニヮムパソ
ケージA金ボ丁。これらの祠A(は純アルミニツム訃工
ひ七の合金でめれぽ容器として特に問題はない。
Figure 1 shows an aluminum computer case A box consisting of case 1 and cover 2. These shrines A are made of an alloy of pure aluminum and have no particular problems as merepo containers.

しかし、太パI)−全局部的に−4える溶接では、浴接
部の冷却速1析が憾めて早いため浴接ビード中にクラッ
ク金主じ、十分な気密性が保てないのが現状である。
However, in welding where the thickness is locally increased by -4, the cooling rate of the bath welding part is extremely fast, so cracks mainly occur in the bath weld bead, and sufficient airtightness cannot be maintained. is the current situation.

μμち、渠2図は、従来の大出力パルスレーザによ6浴
艦を模式化したものである。大出力レーザ4からのレー
ザビーム金レンズ系5でパッケージAの溶接間断6に収
束し、該当−所を溶嶺する。
Figure 2 shows a schematic diagram of a 6-bath vessel using a conventional high-output pulse laser. A laser beam from a high-output laser 4 is focused on a welding gap 6 of the package A by a gold lens system 5, and melts at the corresponding location.

この場合は大出力レーザ4を切断したとさ、上記のより
なりラックが存在し、十分な気密性は保てない。
In this case, when the high-output laser 4 is cut, the above-mentioned twisted rack exists, and sufficient airtightness cannot be maintained.

(4)発明の目的 本発明はレーデを用いて、アルミニウムパッケージの気
田封止溶接倉行う際、溶接部にクラックの発生がなくな
定に気密封止が行える方法全提供することを目自りとし
たものである。
(4) Purpose of the Invention The purpose of the present invention is to provide a complete method for airtightly sealing an aluminum package without causing cracks in the welded area using a radar. It is very special.

(5)  発明の構成 本発明は低出力の連続−#3コ辰ンーザと、畠出力のパ
ルスレーザ金回用し、低出力レーザによって16接都の
予備加熱および、#後後の゛アンニールrイjい、実際
の溶接は大出力のパルスレーザを使用する方法により達
成したものである。
(5) Structure of the Invention The present invention uses a low-output continuous -#3 laser laser and a Hatake output pulsed laser metal, and performs preheating of 16 points with the low-output laser and "annealing after #3". Yes, the actual welding was accomplished using a high-output pulsed laser.

(6)発明の実施列 以F本発明力法について図面を参照しながら説明する。(6) Implementation sequence of the invention Hereinafter, the invention method will be explained with reference to the drawings.

第3図に本発明による気密封止溶接法を示す。FIG. 3 shows the hermetic seal welding method according to the present invention.

浴接部6にまず1代出力連続発振レーザ7ステム8から
の低出力レーザビーム9をハーフミラ−7゜レンズ糸5
を弁して、照射し予備加熱しておく。
First, a low-power laser beam 9 from a first generation continuous wave laser 7 and a stem 8 is applied to the bath contact part 6 through a half-mirror 7° lens thread 5.
Turn on the valve and irradiate to preheat.

2欠に大出力バルスレーグ@振7ステム34からの人出
力パルスレーザビーム10を同様の部位に照射する。こ
の時、レーザビーム9ケよ照射し危ままでも切断して唱
よい。本−1!欣では低出力連続発振レーザ7ステム8
からのレーザビーム9 を平均出力100Wビーム4 
u 5waとして胛射し、大出力パルスレーザシステム
34からのレーザビーム10は、4msQ1g、25P
p8.380i111として照射し之。なお、大出力パ
ルスレーザビームl Off:jffl射中にもレーザ
ビーム9は照射したままとした。
At two intervals, the human power pulsed laser beam 10 from the high-output Valsleg @Fumi 7 stem 34 is irradiated to the same region. At this time, you can irradiate 9 laser beams and cut it off even if it is dangerous. Book-1! In Kin, low power continuous wave laser 7 stem 8
Laser beam 9 from 100W average output beam 4
The laser beam 10 from the high output pulse laser system 34 is emitted as u 5wa, 4msQ1g, 25P.
Irradiated as p8.380i111. Note that the laser beam 9 remained irradiated even during the irradiation of the high-power pulsed laser beam lOff:jffl.

かかる条件で照射金材い、ケースl及びカバー2の溶接
部6を溶融溶接した。こ仁では低出力連続弗最レーザシ
ステムとして第1のヤグレーザ金柑いた。
Under these conditions, the welded parts 6 of the irradiated metal material, the case 1, and the cover 2 were melt-welded. At Konin, we developed the first Yag Laser Kumquat as a low-power continuous laser system.

又、大出力パルスレーザ発振システムとして第2のヤグ
レーザ金柑いた。なお、谷レーデシステムとしてセグレ
ーν′のIIgにアルゴンレーザ、炭酸ガスレーザ、ガ
ラスレーザー#ff:組合せ用いることができる。矢に
、人出レーザ全ψノ所し低出力連続@振し−ザビーム9
のみとrると、溶接部は;@、激な冷却をうけづ、また
アンニールされるためクラックの発生がなく残留歪も残
らない、溶接部が形成された。
In addition, a second Yag laser kumquat was used as a high-output pulse laser oscillation system. Incidentally, as a Tani Radhe system, a combination of an argon laser, a carbon dioxide laser, and a glass laser #ff can be used for IIg of Segley ν'. On the arrow, the laser is placed at all ψ positions and low output is continuously @ shake - The Beam 9
By doing this, the welded part was subjected to intense cooling and annealing, so that a welded part with no cracks and no residual strain was formed.

!1′友、清接ピード11幅上6M、溶込深さ1.0藷
が得られた。
! 1', the width of the welding pitch 11 was 6M, and the penetration depth was 1.0 mm.

本発明に゛よりAm封止したアルミニウムパッケージの
気密性をヘリウムリークディテクタによって調べたとこ
ろ、10” 1Ltln−QC18以上の高い気′m性
を有し、実用上全く問題ないことを確認した。
When the airtightness of the aluminum package sealed with Am according to the present invention was examined using a helium leak detector, it was confirmed that the package had a high airtightness of 10" 1 Ltln-QC18 or higher, and had no practical problems.

(7)発明の効果 本うら明によれは、尚出力素子が塔載でき(熱放散がよ
い)また@賞であるアルミニウムパッケージの気((j
封止が安にに6J能となる。
(7) Effects of the invention According to the present invention, the output element can be mounted on the tower (good heat dissipation), and the quality of the aluminum package ((j
The sealing capacity is easily 6J.

【図面の簡単な説明】[Brief explanation of the drawing]

相1図はアルミニウムパッケージのg 念1g+、第2
図はりt米のレーザによる溶接法金示す図、第3図は本
発明の吐出力連続発振レーザと副出力パルスレーザの2
レーザによる溶接法金示す図である。 l:ケース、2=カバー、3;入出力端子。 4二大出力レーザ、6:レンズ系、6:溶接部。 7:ハーノミラー、8:を出力連続発振レーザ。
The phase 1 diagram shows the g of the aluminum package.
Figure 3 shows the welding process using a laser beam.
FIG. 3 is a diagram showing a welding method using a laser. l: case, 2=cover, 3: input/output terminal. 42 high output lasers, 6: lens system, 6: welding part. 7: Herno mirror, 8: Continuous wave laser output.

Claims (3)

【特許請求の範囲】[Claims] (1)アルミニラ台合金のケースとカバーよりなるパッ
ケージにおいて、ケースとカバー金レーザ溶接により気
密封止する際、低出力連続発振レーザにて゛予備〃Il
熱しておき、尚出力パルスレーザにて溶接することを!
特徴とするアルミニウムパッケージの気密封止法。
(1) In a package consisting of an aluminum base alloy case and cover, when the case and cover are hermetically sealed by laser welding, a low-power continuous wave laser is used to
Heat it up and then weld it with an output pulse laser!
Features a hermetic sealing method for aluminum packages.
(2)上記1氏出力連続発振レーザがヤグ(YAG)レ
ーザ、アルゴンレーザもしくは炭酸ガスレーザであるこ
とを特徴とする特許請求の範囲第1項記載のアルミニウ
ムパッケージの気密封止法。
(2) The method for hermetically sealing an aluminum package according to claim 1, wherein the 1°C output continuous wave laser is a YAG laser, an argon laser, or a carbon dioxide laser.
(3)  上St高出力パルスレーザがヤグ(fA()
)レーザもしくは炭酸ガスレーザであることを特徴とす
る特許Hfi氷の範囲第1項記載のアルミニツムパッケ
ージの気t’/I封止法。
(3) The upper St high-power pulse laser is
) A method for sealing an aluminum package according to item 1 of the patent Hfi ice, characterized in that the laser or carbon dioxide laser is used.
JP57185536A 1982-10-22 1982-10-22 Airtight sealing method of aluminum package Granted JPS5976689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57185536A JPS5976689A (en) 1982-10-22 1982-10-22 Airtight sealing method of aluminum package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57185536A JPS5976689A (en) 1982-10-22 1982-10-22 Airtight sealing method of aluminum package

Publications (2)

Publication Number Publication Date
JPS5976689A true JPS5976689A (en) 1984-05-01
JPH0344876B2 JPH0344876B2 (en) 1991-07-09

Family

ID=16172518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57185536A Granted JPS5976689A (en) 1982-10-22 1982-10-22 Airtight sealing method of aluminum package

Country Status (1)

Country Link
JP (1) JPS5976689A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053090A (en) * 1989-09-05 1991-10-01 Board Of Regents, The University Of Texas System Selective laser sintering with assisted powder handling
US5076869A (en) * 1986-10-17 1991-12-31 Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
US5132143A (en) * 1986-10-17 1992-07-21 Board Of Regents, The University Of Texas System Method for producing parts
US5296062A (en) * 1986-10-17 1994-03-22 The Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
JPH10230379A (en) * 1997-02-20 1998-09-02 Kobe Steel Ltd Manufacture of aluminum alloy container
CN105234557A (en) * 2015-10-28 2016-01-13 大族激光科技产业集团股份有限公司 Laser welding method for sealed device
JP2016078082A (en) * 2014-10-17 2016-05-16 株式会社豊田自動織機 Laser welding method and laser welding device
US20180178321A1 (en) * 2016-12-22 2018-06-28 Toyota Jidosha Kabushiki Kaisha Laser welding method and laser welding device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639070A (en) * 1986-10-17 1997-06-17 Board Of Regents, The University Of Texas System Method for producing parts by selective sintering
US5316580A (en) * 1986-10-17 1994-05-31 Board Of Regents, The University Of Texas System Method and apparatus for producing parts by selective sintering
US5132143A (en) * 1986-10-17 1992-07-21 Board Of Regents, The University Of Texas System Method for producing parts
US5296062A (en) * 1986-10-17 1994-03-22 The Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
US5616294A (en) * 1986-10-17 1997-04-01 Board Of Regents, The University Of Texas System Method for producing parts by infiltration of porous intermediate parts
US5382308A (en) * 1986-10-17 1995-01-17 Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
US5076869A (en) * 1986-10-17 1991-12-31 Board Of Regents, The University Of Texas System Multiple material systems for selective beam sintering
US5597589A (en) * 1986-10-17 1997-01-28 Board Of Regents, The University Of Texas System Apparatus for producing parts by selective sintering
US5053090A (en) * 1989-09-05 1991-10-01 Board Of Regents, The University Of Texas System Selective laser sintering with assisted powder handling
JPH10230379A (en) * 1997-02-20 1998-09-02 Kobe Steel Ltd Manufacture of aluminum alloy container
JP2016078082A (en) * 2014-10-17 2016-05-16 株式会社豊田自動織機 Laser welding method and laser welding device
CN105234557A (en) * 2015-10-28 2016-01-13 大族激光科技产业集团股份有限公司 Laser welding method for sealed device
US20180178321A1 (en) * 2016-12-22 2018-06-28 Toyota Jidosha Kabushiki Kaisha Laser welding method and laser welding device
CN108232047A (en) * 2016-12-22 2018-06-29 丰田自动车株式会社 Method for laser welding and laser soldering device
JP2018103202A (en) * 2016-12-22 2018-07-05 トヨタ自動車株式会社 Laser welding method and laser welding device
US10821544B2 (en) 2016-12-22 2020-11-03 Toyota Jidosha Kabushiki Kaisha Laser welding method and laser welding device

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