JP2502612Y2 - 電子部品 - Google Patents

電子部品

Info

Publication number
JP2502612Y2
JP2502612Y2 JP1989073583U JP7358389U JP2502612Y2 JP 2502612 Y2 JP2502612 Y2 JP 2502612Y2 JP 1989073583 U JP1989073583 U JP 1989073583U JP 7358389 U JP7358389 U JP 7358389U JP 2502612 Y2 JP2502612 Y2 JP 2502612Y2
Authority
JP
Japan
Prior art keywords
electronic component
wiring pattern
base
component element
chip carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989073583U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313746U (enrdf_load_stackoverflow
Inventor
徹男 田島
▲吉▼彦 安原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1989073583U priority Critical patent/JP2502612Y2/ja
Publication of JPH0313746U publication Critical patent/JPH0313746U/ja
Application granted granted Critical
Publication of JP2502612Y2 publication Critical patent/JP2502612Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)
JP1989073583U 1989-06-26 1989-06-26 電子部品 Expired - Lifetime JP2502612Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989073583U JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989073583U JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Publications (2)

Publication Number Publication Date
JPH0313746U JPH0313746U (enrdf_load_stackoverflow) 1991-02-12
JP2502612Y2 true JP2502612Y2 (ja) 1996-06-26

Family

ID=31612525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989073583U Expired - Lifetime JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Country Status (1)

Country Link
JP (1) JP2502612Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227586U (enrdf_load_stackoverflow) * 1989-07-26 1990-02-22
JPH11251488A (ja) * 1998-03-05 1999-09-17 Sumitomo Metal Electronics Devices Inc セラミックパッケージ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123271A (enrdf_load_stackoverflow) * 1973-03-28 1974-11-26
JPS5899839U (ja) * 1981-12-28 1983-07-07 三菱電機株式会社 半導体装置用実装基板
JPS6083353A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd チツプキヤリア基板
JPS61182098U (enrdf_load_stackoverflow) * 1985-04-30 1986-11-13
JPS6393136A (ja) * 1986-10-07 1988-04-23 Mitsubishi Electric Corp トランジスタ装置
JPH01125959A (ja) * 1987-11-11 1989-05-18 Matsushita Electric Ind Co Ltd 高周波用パッケージ

Also Published As

Publication number Publication date
JPH0313746U (enrdf_load_stackoverflow) 1991-02-12

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