JP2024519063A5 - - Google Patents

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Publication number
JP2024519063A5
JP2024519063A5 JP2023571602A JP2023571602A JP2024519063A5 JP 2024519063 A5 JP2024519063 A5 JP 2024519063A5 JP 2023571602 A JP2023571602 A JP 2023571602A JP 2023571602 A JP2023571602 A JP 2023571602A JP 2024519063 A5 JP2024519063 A5 JP 2024519063A5
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JP
Japan
Prior art keywords
layer
coating
substrate
random copolymer
mol
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JP2023571602A
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English (en)
Japanese (ja)
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JP2024519063A (ja
JP7835780B2 (ja
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Priority claimed from PCT/EP2022/063127 external-priority patent/WO2022243216A1/en
Publication of JP2024519063A publication Critical patent/JP2024519063A/ja
Publication of JP2024519063A5 publication Critical patent/JP2024519063A5/ja
Application granted granted Critical
Publication of JP7835780B2 publication Critical patent/JP7835780B2/ja
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JP2023571602A 2021-05-18 2022-05-16 Ps-b-pmmaタイプブロックコポリマーの誘導自己集合体をパターン化するための改善されたドライエッチング能を有する疎水性の架橋可能ピン止め下層 Active JP7835780B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163189803P 2021-05-18 2021-05-18
US63/189,803 2021-05-18
PCT/EP2022/063127 WO2022243216A1 (en) 2021-05-18 2022-05-16 Hydrophobic crosslinkable pinning underlayers with improved dry etch capabilities for patterning directed self-assembly of ps-b-pmma type block copolymers

Publications (3)

Publication Number Publication Date
JP2024519063A JP2024519063A (ja) 2024-05-08
JP2024519063A5 true JP2024519063A5 (https=) 2024-05-22
JP7835780B2 JP7835780B2 (ja) 2026-03-25

Family

ID=82019972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023571602A Active JP7835780B2 (ja) 2021-05-18 2022-05-16 Ps-b-pmmaタイプブロックコポリマーの誘導自己集合体をパターン化するための改善されたドライエッチング能を有する疎水性の架橋可能ピン止め下層

Country Status (7)

Country Link
US (1) US20240219829A1 (https=)
EP (1) EP4341310B1 (https=)
JP (1) JP7835780B2 (https=)
KR (1) KR20240008940A (https=)
CN (1) CN117321096A (https=)
TW (1) TWI901886B (https=)
WO (1) WO2022243216A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4044216A1 (en) * 2021-02-16 2022-08-17 Siltronic AG Method for testing the stress robustness of a semiconductor substrate
KR20240101079A (ko) * 2022-12-23 2024-07-02 삼성전자주식회사 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법
KR102868869B1 (ko) * 2024-01-26 2025-10-14 에스케이하이닉스 주식회사 가교제 프리 포토레지스트를 활용한 네거티브 패턴 형성방법
WO2026041747A1 (en) * 2024-08-22 2026-02-26 Merck Patent Gmbh Carbon and silicone enriched new high-chi block copolymers of novel architectures for thin-film self-assembly applications

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8101261B2 (en) * 2008-02-13 2012-01-24 Micron Technology, Inc. One-dimensional arrays of block copolymer cylinders and applications thereof
US8623458B2 (en) * 2009-12-18 2014-01-07 International Business Machines Corporation Methods of directed self-assembly, and layered structures formed therefrom
US8691925B2 (en) * 2011-09-23 2014-04-08 Az Electronic Materials (Luxembourg) S.A.R.L. Compositions of neutral layer for directed self assembly block copolymers and processes thereof
US8835581B2 (en) 2012-06-08 2014-09-16 Az Electronic Materials (Luxembourg) S.A.R.L. Neutral layer polymer composition for directed self assembly and processes thereof
JP6454324B2 (ja) * 2013-04-03 2019-01-16 ブルーワー サイエンス アイ エヌ シー. 誘導自己組織化用ブロックコポリマーに用いる高エッチング耐性ポリマーブロック
US10457088B2 (en) 2013-05-13 2019-10-29 Ridgefield Acquisition Template for self assembly and method of making a self assembled pattern
US9093263B2 (en) 2013-09-27 2015-07-28 Az Electronic Materials (Luxembourg) S.A.R.L. Underlayer composition for promoting self assembly and method of making and using
US9181449B2 (en) 2013-12-16 2015-11-10 Az Electronic Materials (Luxembourg) S.A.R.L. Underlayer composition for promoting self assembly and method of making and using
JP6558894B2 (ja) * 2013-12-31 2019-08-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC コポリマーの設計、その製造方法およびそれを含む物品
CN104749905B (zh) * 2013-12-31 2018-02-13 罗门哈斯电子材料有限公司 定向自组装图案形成方法和组合物
US9505945B2 (en) 2014-10-30 2016-11-29 Az Electronic Materials (Luxembourg) S.A.R.L. Silicon containing block copolymers for direct self-assembly application
KR102651697B1 (ko) * 2015-09-07 2024-03-27 아이엠이씨 브이제트더블유 트렌치 보조 케모에피탁시(trac) dsa 흐름
US9574104B1 (en) * 2015-10-16 2017-02-21 Az Electronic Materials (Luxembourg) S.A.R.L. Compositions and processes for self-assembly of block copolymers
JP2017110150A (ja) * 2015-12-18 2017-06-22 Jsr株式会社 着色組成物、着色硬化膜及び表示素子
EP3858872B1 (en) * 2016-12-21 2022-05-11 Merck Patent GmbH Compositions and processes for self-assembly of block copolymers
US20190127506A1 (en) * 2017-11-02 2019-05-02 Rohm And Haas Electronic Materials Llc Low temperature curable addition polymers from vinyl arylcyclobutene-containing monomers and methods for making the same
SG11202103809PA (en) * 2018-12-07 2021-05-28 Merck Patent Gmbh Rapid cross-linkable neutral underlayers for contact hole self-assembly of polystyrene-b- poly(methyl methacrylate) diblock copolymers and their formulation thereof

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