CN117321096A - 用于ps-b-pmma型嵌段共聚物的图案化定向自组装的具有改进的干蚀刻能力的疏水性可交联钉扎底层 - Google Patents
用于ps-b-pmma型嵌段共聚物的图案化定向自组装的具有改进的干蚀刻能力的疏水性可交联钉扎底层 Download PDFInfo
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- CN117321096A CN117321096A CN202280035777.4A CN202280035777A CN117321096A CN 117321096 A CN117321096 A CN 117321096A CN 202280035777 A CN202280035777 A CN 202280035777A CN 117321096 A CN117321096 A CN 117321096A
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-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1802—C2-(meth)acrylate, e.g. ethyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
- C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
- C08F297/026—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising acrylic acid, methacrylic acid or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D125/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Coating compositions based on derivatives of such polymers
- C09D125/02—Homopolymers or copolymers of hydrocarbons
- C09D125/04—Homopolymers or copolymers of styrene
- C09D125/08—Copolymers of styrene
- C09D125/14—Copolymers of styrene with unsaturated esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163189803P | 2021-05-18 | 2021-05-18 | |
| US63/189,803 | 2021-05-18 | ||
| PCT/EP2022/063127 WO2022243216A1 (en) | 2021-05-18 | 2022-05-16 | Hydrophobic crosslinkable pinning underlayers with improved dry etch capabilities for patterning directed self-assembly of ps-b-pmma type block copolymers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117321096A true CN117321096A (zh) | 2023-12-29 |
Family
ID=82019972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280035777.4A Pending CN117321096A (zh) | 2021-05-18 | 2022-05-16 | 用于ps-b-pmma型嵌段共聚物的图案化定向自组装的具有改进的干蚀刻能力的疏水性可交联钉扎底层 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240219829A1 (https=) |
| EP (1) | EP4341310B1 (https=) |
| JP (1) | JP7835780B2 (https=) |
| KR (1) | KR20240008940A (https=) |
| CN (1) | CN117321096A (https=) |
| TW (1) | TWI901886B (https=) |
| WO (1) | WO2022243216A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4044216A1 (en) * | 2021-02-16 | 2022-08-17 | Siltronic AG | Method for testing the stress robustness of a semiconductor substrate |
| KR20240101079A (ko) * | 2022-12-23 | 2024-07-02 | 삼성전자주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
| KR102868869B1 (ko) * | 2024-01-26 | 2025-10-14 | 에스케이하이닉스 주식회사 | 가교제 프리 포토레지스트를 활용한 네거티브 패턴 형성방법 |
| WO2026041747A1 (en) * | 2024-08-22 | 2026-02-26 | Merck Patent Gmbh | Carbon and silicone enriched new high-chi block copolymers of novel architectures for thin-film self-assembly applications |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101952195A (zh) * | 2008-02-13 | 2011-01-19 | 美光科技公司 | 嵌段共聚物圆柱体的一维阵列和其应用 |
| CN102667623A (zh) * | 2009-12-18 | 2012-09-12 | 国际商业机器公司 | 定向自组装方法以及由此形成的分层结构 |
| CN103797066A (zh) * | 2011-09-23 | 2014-05-14 | Az电子材料美国公司 | 用于定向自组装嵌段共聚物的中性层组合物及其方法 |
| US20140335324A1 (en) * | 2013-05-13 | 2014-11-13 | Az Electronic Materials (Luxembourg) S.A.R.L. | Template for self assembly and method of making a self assembled pattern |
| US20150184017A1 (en) * | 2013-12-31 | 2015-07-02 | Dow Global Technologies Llc | Copolymer formulations, methods of manufacture thereof and articles comprising the same |
| CN105264642A (zh) * | 2013-04-03 | 2016-01-20 | 布鲁尔科技公司 | 用于定向自组装的嵌段共聚物中的高度耐蚀刻的聚合物嵌段 |
| US20170069486A1 (en) * | 2015-09-07 | 2017-03-09 | Imec Vzw | Directed Self-Assembly Using Trench Assisted Chemoepitaxy |
| CN108137313A (zh) * | 2015-10-16 | 2018-06-08 | Az电子材料卢森堡有限公司 | 用于嵌段共聚物自组装的组合物和方法 |
| EP3480223A1 (en) * | 2017-11-02 | 2019-05-08 | Rohm and Haas Electronic Materials LLC | Low temperature curable addition polymers from vinyl arylcyclobutene-containing monomers and methods for making the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8835581B2 (en) | 2012-06-08 | 2014-09-16 | Az Electronic Materials (Luxembourg) S.A.R.L. | Neutral layer polymer composition for directed self assembly and processes thereof |
| US9093263B2 (en) | 2013-09-27 | 2015-07-28 | Az Electronic Materials (Luxembourg) S.A.R.L. | Underlayer composition for promoting self assembly and method of making and using |
| US9181449B2 (en) | 2013-12-16 | 2015-11-10 | Az Electronic Materials (Luxembourg) S.A.R.L. | Underlayer composition for promoting self assembly and method of making and using |
| CN104749905B (zh) * | 2013-12-31 | 2018-02-13 | 罗门哈斯电子材料有限公司 | 定向自组装图案形成方法和组合物 |
| US9505945B2 (en) | 2014-10-30 | 2016-11-29 | Az Electronic Materials (Luxembourg) S.A.R.L. | Silicon containing block copolymers for direct self-assembly application |
| JP2017110150A (ja) * | 2015-12-18 | 2017-06-22 | Jsr株式会社 | 着色組成物、着色硬化膜及び表示素子 |
| EP3858872B1 (en) * | 2016-12-21 | 2022-05-11 | Merck Patent GmbH | Compositions and processes for self-assembly of block copolymers |
| SG11202103809PA (en) * | 2018-12-07 | 2021-05-28 | Merck Patent Gmbh | Rapid cross-linkable neutral underlayers for contact hole self-assembly of polystyrene-b- poly(methyl methacrylate) diblock copolymers and their formulation thereof |
-
2022
- 2022-05-16 WO PCT/EP2022/063127 patent/WO2022243216A1/en not_active Ceased
- 2022-05-16 KR KR1020237043549A patent/KR20240008940A/ko active Pending
- 2022-05-16 US US18/554,651 patent/US20240219829A1/en active Pending
- 2022-05-16 CN CN202280035777.4A patent/CN117321096A/zh active Pending
- 2022-05-16 JP JP2023571602A patent/JP7835780B2/ja active Active
- 2022-05-16 EP EP22729526.8A patent/EP4341310B1/en active Active
- 2022-05-16 TW TW111118185A patent/TWI901886B/zh active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101952195A (zh) * | 2008-02-13 | 2011-01-19 | 美光科技公司 | 嵌段共聚物圆柱体的一维阵列和其应用 |
| CN102667623A (zh) * | 2009-12-18 | 2012-09-12 | 国际商业机器公司 | 定向自组装方法以及由此形成的分层结构 |
| CN103797066A (zh) * | 2011-09-23 | 2014-05-14 | Az电子材料美国公司 | 用于定向自组装嵌段共聚物的中性层组合物及其方法 |
| CN105264642A (zh) * | 2013-04-03 | 2016-01-20 | 布鲁尔科技公司 | 用于定向自组装的嵌段共聚物中的高度耐蚀刻的聚合物嵌段 |
| US20140335324A1 (en) * | 2013-05-13 | 2014-11-13 | Az Electronic Materials (Luxembourg) S.A.R.L. | Template for self assembly and method of making a self assembled pattern |
| US20150184017A1 (en) * | 2013-12-31 | 2015-07-02 | Dow Global Technologies Llc | Copolymer formulations, methods of manufacture thereof and articles comprising the same |
| US20170069486A1 (en) * | 2015-09-07 | 2017-03-09 | Imec Vzw | Directed Self-Assembly Using Trench Assisted Chemoepitaxy |
| CN108137313A (zh) * | 2015-10-16 | 2018-06-08 | Az电子材料卢森堡有限公司 | 用于嵌段共聚物自组装的组合物和方法 |
| EP3480223A1 (en) * | 2017-11-02 | 2019-05-08 | Rohm and Haas Electronic Materials LLC | Low temperature curable addition polymers from vinyl arylcyclobutene-containing monomers and methods for making the same |
| CN109749000A (zh) * | 2017-11-02 | 2019-05-14 | 罗门哈斯电子材料有限责任公司 | 来自含乙烯基芳基环丁烯单体的低温可固化加成聚合物和其制备方法 |
Non-Patent Citations (2)
| Title |
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| SHINYA MINEGISHI 等: "Directed Self Assembly Materials for Semiconductor Lithography", JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, vol. 26, no. 6, 12 December 2013 (2013-12-12), pages 793 - 800 * |
| 李冰 等: "用于大分子定向自组装的新型嵌段共聚物的合成与表征", 影像科学与光化学, vol. 36, no. 4, 26 July 2018 (2018-07-26), pages 306 - 314 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240219829A1 (en) | 2024-07-04 |
| TWI901886B (zh) | 2025-10-21 |
| EP4341310A1 (en) | 2024-03-27 |
| KR20240008940A (ko) | 2024-01-19 |
| WO2022243216A1 (en) | 2022-11-24 |
| EP4341310B1 (en) | 2025-06-25 |
| JP2024519063A (ja) | 2024-05-08 |
| JP7835780B2 (ja) | 2026-03-25 |
| TW202307048A (zh) | 2023-02-16 |
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